Product Announcements: Electronic and IC Packaging Services

Anaren's ceramics-focused subsidiary in Salem, NH offers deep expertise in thick-film, with performance to 80GHz; best-in-class equipment & systems; and robust engineering support (particularly in RF/microwave, via Anaren's Syracuse engineering team). Standard thick-film components are also available. And all the above is offered by an ISO 9001:2000 facility. (read more)

AdTech produces HTCC and AlN packages for microwave applications in the X through K band frequency ranges. Its design process uses state of the art 3-D Finite Element Method (FEM) simulators and proprietary numerical simulators. This process can yield market-differentiating performance while maintaining cost effective solutions. (read more)

ADTech provides Advanced Multilayer Packaging Technology for Optoelectronics Applications including in-house design capabilities, as well as excellent relationships with outside design service firms for overflow and special design needs. (read more)

AdTech maintains in-house design capabilities, as well as excellent relationships with outside design service
firms for overflow and special design needs. Additionally, AdTech's design staff can interface with and accept
customer design data in a number of formats. Capabilities include but are not limited to:

Engineering Software:

• AutoCAD
• S

PFC is the leader in the advancement of components and materials for the challenging conditions of semiconductor processing. Our products are installed in fabrication plants, helping semiconductor manufacturers amplify yield, minimize their full value of claim and perfect their performance worldwide. (read more)

This electronic packaging alternative offers engineers a lightweight option with high thermal conductivity. (read more)

SOURIAU PA&E offers customers the option of using titanium as the primary housing material and integrating composite heat sinks composed of molybdenum/copper (Mo/Cu) or aluminum/silicon carbide (AlSiC) into strategic locations of the structure for excellent heat dissipation capabilities. (read more)

AdTech Ceramics has an experienced employee base with a manufacturing capability for multilayer co-fired electronic packages. Our available products include Optical Packages.

Processes revolve around 30 plus years of experience in material science, engineering, design, tooling and manufacturing of multilayer ceramics. Materials include Alumina (HTCC), Aluminum Nitride (AlN), BeO and LTCC... (read more)

AdTech Ceramics has designed a product line that combines thin film substrate qualities (5 micro inch or better surface finish) with multilayer HTCC structure and straight through hermetic vias, with the practicality of multilayer co-fire alumina. Demonstrated programs have included flip chip, copper metallization and cavities. (read more)

AdTech Ceramics' microwave packaging capabilities include hermetic Alumina High Temperature Cofired Ceramic (HTCC) and Aluminum Nitride (AIN) for applications in the X through K band frequency ranges. (read more)