Product Announcements: Semiconductor Foundry Services

TQBiHEMT integrates E/D pHEMT and HBT onto a single chip, thus reducing part count, saving board space and improving overall system costs. This process, well suited for applications with high data rates and frequencies, offers high levels of integration and functionality to accommodate today's increasingly demanding applications. Click here for more information: http://www.tqs.com/prodserv/fo... (read more)

Rogue Valley Microdevices Sputter process has been designed to deposit ultra-clean, semiconductor grade metals. The process includes an in-situ RF etch which ensures good film adhesion and Ohmic contact to underlying conductive layers. We have the in-house capability to do blanket thin films and complete device fabrication. (read more)

Wet Thermal Oxidation for Silicon Wafers is available 1,000 angstroms to 15µm thick. Great Quality and lead-times are our focus. We can process wafers and have them back to you within 5-7 days, helping to reduce cycle time. Our Wet thermal Oxidation process was designed for growing thicker oxide layers while maintaining the same level of quality you would expect from Dry thermal Oxidation. (read more)

Rogue Valley Microdevices is please to offer you the option of Dry Chlorinated Thermal Oxidation. Our Dry Chlorinated Thermal Oxidation is recommended for use in MOS and other active device fabrication processes. Using Dry Chlorinated Thermal Oxide can help your devices to perform to its highest potential by eliminating metal ions. (read more)

Rogue Valley Microdevices offers Low Stress LPCVD Nitride with a Film Stress of less than 250 MPa Tensile. It is often used for building Membranes, Cantilever Beams and other mechanical structures. Low Stress Nitride is also very effective as a KOH mask and we can deposit 50A to 2µm in thickness. (read more)

Specializing in MEMS and Biomedical Device fabrication, Rogue Valley Microdevices is a full service MEMS foundry that combines state of the art process modules with the engineering experience and expertise to seamlessly go from custom design to device manufacturing. (read more)

Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti, Cr, Ni, Ag, Au, and Pt. Evaporation is done at low temperatures that will not damage Photoresist for metal lift-off. We have the in-house capability to do complete device fabrication for customers. (read more)

Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing.

Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling. (read more)

Rogue Valley Microdevices offers PECVD Silicon Oxide for glass, sapphire, and silicon wafers. Our PECVD Oxide is a single sided film that has been optimized for wafers requiring minimal thermal processing, and is often used during the semiconductor manufacturing process to form intra-metal dielectric stacks. PECVD Oxide is also used in MEMS and Surface micro-machining processes. (read more)

Rogue Valley Microdevices offers PECVD Silicon Carbide for silicon, glass, and sapphire wafers. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)