Product Announcements: MEMS Foundry

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Precious Metals. We have the in-house capability to do blanket thin films and complete device fabrication in our Medford, OR facility. If you have a metal electrode device you need fabricating please contact us! (read more)

Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti, Cr, Ni, Ag, Au, and Pt. Evaporation is done at low temperatures that will not damage photo resist for metal lift-off. We have the in-house capability to do complete device fabrication for customers. (read more)

Rogue Valley Microdevices is an industry leader for high quality LPCVD films. You can order LPCVD Nitride as thick as 5μm or as thin as 100Å! Low Stress LPCVD Nitride is one of our most popular films and is often used for building Membranes, Cantilever Beams and other mechanical structures. We have the in-house capability to design and manufacture your complete device. (read more)

Rogue Valley Microdevices is proud to be your leading source of high quality LPCVD films. Our Stoichiometric LPCVD Nitride can be a very effective insulator, and works great as a KOH etch mask when deposited over thermal oxide. Our Stoichiometric LPCVD Nitride has a film stress of 800 MPa (Tensile). We also have the in-house capability to design and manufacture Nitride Windows. (read more)

Specializing in MEMS and Biomedical Device fabrication, Rogue Valley Microdevices is a full service MEMS foundry that combines state of the art process modules with the engineering experience and expertise to seamlessly go from custom design to device manufacturing. (read more)

Rogue Valley Microdevices offers Wet Thermal Oxide film for silicon, SOI, and quartz wafers. We offer a film thickness range of 1,000 angstroms to 15 microns. Starting Silicon Wafers (50mm-200mm) can be provided by Rogue Valley Microdevices or customers can send in their own wafers. For film thicknesses under 1,000 angstroms we can provide Dry Thermal or Dry Chlorinated Thermal Oxide. (read more)

Rogue Valley Microdevices is proud to be your leading source of high quality LPCVD Silicon Nitride films. Our LPCVD Nitride Process uses very specific gas ratios to produce a stable LPCVD Silicon Nitride film that can target a customer's film stress requirements. Our engineering team is able to offer our customers the opportunity to customize Film Stress to fit their exact application. (read more)

Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition for Semiconductor Wafers. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to... (read more)

Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing. Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling. (read more)