The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision. Read more...More Product Announcements from Zygo Corporation
The XR 1 combines the portable drive units of the MarSurf M-Series units with the PC‑based evaluation software of larger MarSurf XR-Series systems
Utilizing wireless Bluetooth technology, the XR 1 offers an affordable entry into higher-end surface metrology systems Read more...More Product Announcements from Mahr Inc.
Features high measuring speed, horizontal travel up to 260 mm, vertical resolution to 0.8 nm
Designed for checking topography during multi-step grinding/polishing operations
Backed by Mahr worldwide network for service and application support Read more...More Product Announcements from Mahr Inc.
For over fifty years, Lapmaster has been a leader in the manufacturing of industrial lapping machines and consumables. Lapmaster International now offers a complete turnkey solution for Metallographic Sample Preparation. Combining our comprehensive line of Sample Preparation Equipment and Quality Processing Consumables Read more...More Product Announcements from Lapmaster-Wolters International
The Lapmaster/LAMTech TOPOS and SPI series of Interferometers feature Grazing Incidence flatness inspection and measurement capability for ground, lapped & polished surfaces. Use of this system eliminates the need to generate a polished surface, strictly for optical flatness measurement. Ground surfaces, matte surfaces and polsihed surfaces can all be measured with one unit! Read more...More Product Announcements from Lapmaster-Wolters International