The MicroSense UltraMap C200 is a new automated wafer measurement tool designed specifically for high throughput dimensional measurement of sapphire wafers for LED manufacturing. The UltraMap C200 utilizes MicroSense’s novel two sided capacitive sensing technology to measure sapphire wafer thickness, TTV (total thickness variation), bow, warp, and LTV (local thickness variation). Read more...More Product Announcements from MicroSense, LLC
MAZeT offers customer-specific solutions for communication interfaces of the automation engineering industries. Read more...More Product Announcements from MAZeT GmbH
Solar Wafer Thickness Tool from MTI. The PV-1000 is a High speed, multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials. Read more...More Product Announcements from MTI Instruments Inc.