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MicroSense, LLC

Precise thickness measurement of thin wafers is challenging, the MicroSense UltraMap 300-BP system measures virtually any wafer material, regardless of optical characteristics or resistivity. It can measure thickness of wafers with up to 5mm of Bow. Read more...

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MicroSense, LLC

The MicroSense UltraMap 200C is a new automated wafer measurement tool designed specifically for high throughput dimensional measurement of sapphire, silicon and silicon carbide wafers. The UltraMap 200C utilizes MicroSense’s novel two sided capacitive sensing technology to measure wafer thickness, TTV (total thickness variation), bow, warp, and LTV (local thickness variation). Read more...

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HORIBA Scientific

The UVISEL ellipsometer range offers the best combination of modularity and performance for thin film characterizations. Based on phase modulation technology, the UVISEL ellipsometers delivers high accuracy and high resolution measurements with an excellent signal to noise ratio.

UVISEL ellipsometers offer a modular design, enabling the best fit to your applications. Read more...

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