Modifications have been made to several existing CHRocodile sensors to enable measurement on unique semiconductor materials, ranging from glass, sapphire and highly doped wafers, to TSVs and other structured devices. Capable of measuring wafer thickness, topography or film thickness at high speeds, CHRocodile sensors are available for nearly all materials and applications. Read more...More Product Announcements from Precitec, Inc.
Cost-effective alternative to fully-automated wafer inspection systems. Read more...More Product Announcements from MTI Instruments Inc.
The MicroSense Polar Kerr System is a full 300 mm wafer, non-contact magnetic metrology tool for perpendicular and in-plane MRAM, providing critical process control information on the multi-layer magnetic stack that is an essential component of MRAM fabrication. This metrology tool offers unsurpassed magnetic field control, and is capable of measuring wafers up to 300 mm. Read more...More Product Announcements from MicroSense, LLC
An alternative to fully automaed metrology tool, the Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 150mm, 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Read more...More Product Announcements from MTI Instruments Inc.
Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness measurements. The Proforma 200SA can be used for most wafer materials and accommodates diameters from 75 to 200 mm. Read more...More Product Announcements from MTI Instruments Inc.