Product Announcements: Wafer and Thin Film Instrumentation

Contactless Thickness Measurement of Wafer

• Rough-cut or textured wafers
• Opaque and scattering materials, for example PP- and PET-bottles
• Multilayer systems, for example foils and bonded wafers

SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. (read more)

The CHRocodile family of sensors and probes continues to expand. Products are available for enhanced measurement on unique materials and structures, higher speeds, and enhanced precision. (read more)

The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer. (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness measurements. The Proforma 200SA can be used for most wafer materials and accommodates diameters from 75 to 200 mm. (read more)

StellarNet offers a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB spectrometer coupled to a reflectance probe and light source. The optical properties are obtained from reflection and thickness is measu... (read more)