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Fasteners and materials, and the tools and systems that automate application/dispensing and assembly/disassembly.
Henkel Corporation - Electronics

Technomelt AS 8998 offfers a fast, highly-precise, automated, easy-to-remove approach to masking specific components or areas on the PCB that must be free of protective coatings. Read more...

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Henkel Corporation - Electronics

LOCTITE ABLESTIK 2902 is a silver-filled, premeasured and packaged two component adhesives used for electronic bonding and sealing applications. It cures at room temperature or by heat and has excellent adhesive to a variety of substrates. Read more...

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Indium Corporation

Indium Corp. Introduces a full line of soldering products that satisfy IPC’s J-STD004B stricter requirements for measuring halogens and electromigration risk. Indium Corporation’s full line of PCB assembly products specifically designed to meet new international standards, which help to improve both first pass yields and long-term reliability. Read more...

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Indium Corporation

One of the key hurdles in new product development is being able to test a variety of options at a reasonable cost. Indium Corporation's Solder Research Kits provide you with the means to experiment with various solders. Kits available include: Solder Paste Solder Wire Solder Ribbon with fluxes that range from 102°C-350°C. Read more...

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Indium Corporation

Indium Corporation - The portable electronics industry has ongoing challenges to improve drop-shock performance without sacrificing thermal cycling performance, reduce need for expensive board-level underfills (and associated material, process and re-work costs), as well as the inability to even reach some areas with underfill; and reduce costs. Read more...

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Indium Corporation

No other metal is as versatile as indium metal. In its various forms it is used for:

  • Sealing in cryogenic applications - stays malleable and ductile below -150°C
  • Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C
  • High-end device cooling - reduces operating temperatures by up to 10°C
Read more...

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Indium Corporation

The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the most popular Pb-free alloys melt in the 220°C to 225°C. But, what do you do if you need a solder that reflows at a lower temperature? Read more...

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Indium Corporation

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semi... Read more...

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Indium Corporation

New...Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. Read more...

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Indium Corporation

Indium Corporation's - new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys Read more...

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