Product Announcements: Solder

Are you having trouble getting consistently good strong solder joints? Improve first-pass yields - Reduce field failures - Improve performance - Enhance your company's reputation for on-time delivery, high quality and reliable performance. Attend the May 15th webinar & SEE THE VIDEO WITH A SOLUTION (read more)

Five years ago RoHs was launched, amid concerns that the world of electronics would collapse due to the many challenges of lead-free (Pb-free) soldering. A few solder alloys have become common, industry-wide, among solar module assemblers & the die-attach method of choice for many IGBT manufacturers is the tin-silver eutectic (read more)

Solder preform placement is tremendously faster using InTEGRATED® SOLDER PREFORMS. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion. Used in a variety of applications that require precise amounts of solder, dimensions can be held to tight tolerances to assure volume accuracy. See the video demonstration - it's FAST (read more)

We offer solder wire, solder ribbon and research kit options so you can more easily find a solution to your application. Each kit comes with a list of available alloys and its characteristics so you can determine the best alloy for your manufacturing process. (read more)

Tabbing and Bus Ribbon Kits are a valuable tool for scientists and engineers to efficiently experiment with different coatings and fluxes at both traditional and low temperatures in an easy-to-handle, low-cost kit system. The fluxes are designed to work in both manual and automated assembly processes (read more)

The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the most popular Pb-free alloys melt in the 220°C to 225°C. But, what do you do if you need a solder that reflows at a lower temperature? (read more)

Solder preforms are manufactured shapes of solder or braze metals designed to fit a specific joint configuration. Preforms contain precise and predetermined quantities of an alloy or a pure metal. They have been used in a variety of applications, such as hybrid and discrete component assembly and surface mount technology. (read more)

Indium Corporation's Indium8.9HF-1 is a probe-testable, no-clean, halogen-free, Pb-free solder paste that eliminates graping and head-in-pillow defects. Its unique activator package and outstanding oxidation barrier allows it to coalesce and wet as good as, or better than, its halogen-containing counterparts. It also has unsurpassed print transfer efficiency and response-to-pause printing. (read more)