Indium Corporation

Indium Corporation - Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace. Read more...

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Indium Corporation

New...Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. Read more...

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Indium Corporation

Indium Corporation's - new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys Read more...

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Indium Corporation

Indium Corp. Introduces a full line of soldering products that satisfy IPC’s J-STD004B stricter requirements for measuring halogens and electromigration risk. Indium Corporation’s full line of PCB assembly products specifically designed to meet new international standards, which help to improve both first pass yields and long-term reliability. Read more...

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Lucas Milhaupt Global Brazing Solutions

Lucas Milhaupt has been providing joining solutions to the appliance industry for decades. As the leader in brazing solutions, we have supplied solutions for air conditioners, evaporators, condensers, compressors, valves & controls, refrigerators & freezers, and ice machines all over the world. Read more...

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Indium Corporation

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany. Read more...

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Indium Corporation

Indium8.9HFA is a versatile, halogen-free, Pb-free solder paste with leading print performance on miniaturized components. Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices, especially as they struggle with <8mil challenges associated with continuing miniaturization in the electronics assembly industry Read more...

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Indium Corporation

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semi... Read more...

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Indium Corporation

The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the most popular Pb-free alloys melt in the 220°C to 225°C. But, what do you do if you need a solder that reflows at a lower temperature? Read more...

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Indium Corporation

Indium Corporation - Solder preform placement is tremendously faster using InTEGRATED® SOLDER PREFORMS. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion. Used in a variety of applications that require precise amounts of solder, dimensions can be held to tight tolerances to assure volume... Read more...

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