Ellsworth Adhesives

Ellsworth Adhesives is the world's largest distributor of industrial adhesives. Shop online for virtually every adhesive used in industrial applications. Read more...

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Master Bond, Inc.

Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator. Read more...

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Hapco, Inc.

When choosing the proper urethane or epoxy for an electrical application, there are some important considerations to keep in mind. In this article, we will discuss those considerations and how they apply to the world of urethanes and epoxies. Read more...

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Master Bond, Inc.

Master Bond EP42HT-2LTE is widely used for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat. Read more...

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Epoxy Technology

Epoxy Technology presents various high temperature epoxies suited for down-hole applications that include die attach, heat sinking, capacitor attach, potting, fiber optics & sensors. Read more...

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Master Bond, Inc.

Master Bond’s two component epoxy resin system EP62-1, is widely used for high performance bonding, filament winding, castings and printed circuit board laminates. It offers outstanding resistance to many aggressive chemicals and maintains superior heat resistance throughout its working life. Upon cure, EP62-1 features minimal shrinkage and excellent electrical insulation. Read more...

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Master Bond, Inc.

Master Bond Supreme 3HTND-2GT is a fast curing, toughened, one component epoxy adhesive and sealant ideal for precise positioning and bonding of microelectronic components and other electronic assemblies. It offers remarkably durable protection against adverse environmental conditions, vibration, impact and thermal shock for components on circuit boards. Read more...

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Master Bond, Inc.

With a glass transition temperature exceeding 175°F, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours. It bonds well to a wide variety of substrates. Read more...

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Master Bond, Inc.

Featuring an array of rough and tumble performance properties, Master Bond EP21SC-1 is ideal for chemical and mechanical processing applications as well as tank and chute maintenance. This exceptionally rigid material has a Shore D hardness exceeding 95. EP21SC-1 includes a silicon carbide filler which enhances its abrasion resistance. It also withstands a wide variety of chemicals. Read more...

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Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. Read more...

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