VORASPEC™ 58 Toughened Epoxy Binder: Tougher Protection for Your Formulations Read more...More Product Announcements from Dow Polyurethanes
Master Bond’s two component epoxy resin system EP62-1, is widely used for high performance bonding, filament winding, castings and printed circuit board laminates. It offers outstanding resistance to many aggressive chemicals and maintains superior heat resistance throughout its working life. Upon cure, EP62-1 features minimal shrinkage and excellent electrical insulation. Read more...More Product Announcements from Master Bond, Inc.
Master Bond Supreme 3HTND-2GT is a fast curing, toughened, one component epoxy adhesive and sealant ideal for precise positioning and bonding of microelectronic components and other electronic assemblies. It offers remarkably durable protection against adverse environmental conditions, vibration, impact and thermal shock for components on circuit boards. Read more...More Product Announcements from Master Bond, Inc.
With a glass transition temperature exceeding 175°F, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours. It bonds well to a wide variety of substrates. Read more...More Product Announcements from Master Bond, Inc.
Ellsworth Adhesives is the world's largest distributor of industrial adhesives. Shop online for virtually every adhesive used in industrial applications. Read more...More Product Announcements from Ellsworth Adhesives
Featuring an array of rough and tumble performance properties, Master Bond EP21SC-1 is ideal for chemical and mechanical processing applications as well as tank and chute maintenance. This exceptionally rigid material has a Shore D hardness exceeding 95. EP21SC-1 includes a silicon carbide filler which enhances its abrasion resistance. It also withstands a wide variety of chemicals. Read more...More Product Announcements from Master Bond, Inc.
Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. Read more...More Product Announcements from Master Bond, Inc.
EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the temperature range of -60°F to +450°F. Read more...More Product Announcements from Master Bond, Inc.
Suitable for applications where long-term exposure to a broad range of temperatures from -60°F to +450°F is required, Supreme 45HTQ is a toughened, quartz filled system. It produces durable high strength bonds which have a superior ability to withstand thermal cycling and chemicals. Read more...More Product Announcements from Master Bond, Inc.
Featuring a convenient one to one mix ratio by weight or volume, EP21NDFG is a two component epoxy with a paste consistency. This room temperature curing system offers outstanding physical properties including dimensional stability, thermal cycling resistance and electrical insulation values. It withstands a wide variety of chemicals, including water, oils, fuels, acids, bases and salts. Read more...More Product Announcements from Master Bond, Inc.