Master Bond, Inc.

Master Bond Supreme 3HTND-2GT is a fast curing, toughened, one component epoxy adhesive and sealant ideal for precise positioning and bonding of microelectronic components and other electronic assemblies. It offers remarkably durable protection against adverse environmental conditions, vibration, impact and thermal shock for components on circuit boards. Read more...

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Master Bond, Inc.

With a glass transition temperature exceeding 175°F, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours. It bonds well to a wide variety of substrates. Read more...

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Master Bond, Inc.

Featuring an array of rough and tumble performance properties, Master Bond EP21SC-1 is ideal for chemical and mechanical processing applications as well as tank and chute maintenance. This exceptionally rigid material has a Shore D hardness exceeding 95. EP21SC-1 includes a silicon carbide filler which enhances its abrasion resistance. It also withstands a wide variety of chemicals. Read more...

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Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. Read more...

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Master Bond, Inc.

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the temperature range of -60°F to +450°F. Read more...

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Master Bond, Inc.

Suitable for applications where long-term exposure to a broad range of temperatures from -60°F to +450°F is required, Supreme 45HTQ is a toughened, quartz filled system. It produces durable high strength bonds which have a superior ability to withstand thermal cycling and chemicals. Read more...

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Master Bond, Inc.

Featuring a convenient one to one mix ratio by weight or volume, EP21NDFG is a two component epoxy with a paste consistency. This room temperature curing system offers outstanding physical properties including dimensional stability, thermal cycling resistance and electrical insulation values. It withstands a wide variety of chemicals, including water, oils, fuels, acids, bases and salts. Read more...

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Master Bond, Inc.

With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system cures readily with heat and offers a long open time at room temperatures. It provides noteworthy dimensional stability, chemical resistance and physical strength properties. Read more...

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Master Bond, Inc.

Master Bond Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350°F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable handling properties including no mixing and unlimited working life at room temperature. Read more...

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Epoxy Technology

Epoxy Technology's optical line of adhesives is used for bonding and protective coatings in various fiber optic applications. Our epoxy adhesives are frequently used to bundle optical fibers and bond components in optoelectronic devices. Read more...

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