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Fasteners and materials, and the tools and systems that automate application/dispensing and assembly/disassembly.
Master Bond, Inc.

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. Read more...

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Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. Read more...

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Master Bond, Inc.

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it is also a candidate for electronic potting and sealing applications. Read more...

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Epoxy Technology

Epoxy Technology announces an expanded line of solar adhesive products for thin film panel assembly. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) announces a new tech tip that provides an overview of resin bleed, ways to avoid it and is meant as a general guideline for epoxy adhesive users. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) announces its new instructional sheet on how to work properly with epoxies from storage and handling to surface preparation, application and proper curing. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) offers our newest educational tool designed to assist adhesive users in gaining a more thorough understanding of adhesive properties and testing. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) announces its newly updated Low Outgassing Adhesives brochure. This technical piece has been revised to include several new products that now meet the NASA ASTM E595, MIL-STD 883/5011 and Telcordia GR-1221 Standards. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) announces its latest offering for epoxy adhesive selection, our PCB Applications Guide. This interactive tool allows users to select applications within a PCB in order to view each corresponding product recommendation. Each sheet provides mechanical and physical properties for each product to help in selecting the most appropriate epoxy. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) manufactures a variety of underfills for several applications, with a key distinction being cure temperature. Read more...

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