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Product Announcements: Dielectric Ceramics and Substrates

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Ferro Corporation - New Systems for LTCC Packaging Market
New Systems for LTCC Packaging Market

Ferro Electronic Materials has introduced two new high-performance systems for the Low-Temperature Co-Fired Ceramic (LTCC) packaging market. These materials provide highly reliable packaging for critical applications such as satellite modules, military radar, antenna systems, and high-speed digital communications. (read more)

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Aremco Products, Inc. - AREMCOLOX™ 502-400 NEW MACHINABLE GLASS-CERAMIC
AREMCOLOX™ 502-400 NEW MACHINABLE GLASS-CERAMIC

Aremcoloxtm 502-400, a new machinable glass-ceramic available from Aremco Products Inc., is now used to produce thermally insulative and high dielectric components and fixtures used in electrical and electronics applications to 700 oF (371 oC). (read more)

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TPL, Inc. - Advanced Dielectric Composites from TPL
Advanced Dielectric Composites from TPL

TPL's composite dielectric material represents a significant breakthrough in dielectric materials for high energy density capacitors. Efforts in this area have transitioned from materials development, supported by basic R & D contracts, to device fabrication for a number of pulsed power and directed energy applications. (read more)

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TPL, Inc. - Ceramics & Nano-Composites
Ceramics & Nano-Composites

TPL's composite dielectric material represents a significant breakthrough in dielectric materials for high energy density capacitors. Efforts in this area have transitioned from materials development, supported by basic R & D contracts, to device fabrication for a number of pulsed power and directed energy applications. (read more)

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