Wacker Chemical Corp.

GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable as
binder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural proximity of the nitrogen atom to the silicon atom in the dimethoxy(methyl)sily... Read more...

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Ellsworth Adhesives

The Mold Man™ 2050 from MoldMan™ Systems is their new Mix on Demand Molding™ table top, low pressure, injection molding machine with the ability to mold two-part materials like Silicones, Epoxies and Urethanes. Read more...

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Ellsworth Adhesives

Ellsworth Adhesives recommends Technomelt for protecting electronic assemblies from environmental exposure. Read more...

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Wacker Chemical Corp.

Special features
- Gap filler, thermal conductivity 2.3 W/mK
- Two-part, RT curing
- Constant properties from –50 °C to +180 °C
- Low stress, soft and tacky
- D4-D8 < 350ppm
- Low abrasive

Application
Interface material for heat sink applications for the electronics industry Read more...

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Ellsworth Adhesives

As electronic devices become smaller and more portable, the batteries within these devices must do the same. Read more...

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Ellsworth Adhesives

Thermal management is a significant issue when designing electronics for all industries. Luckily, Dow Corning has developed a line of thermal conductive adhesives, encapsulants, dispensable thermal pads and thermally conductive gap fillers that assist in solving these problems in the transportation, aerospace, appliance, medical and consumer electronics markets. Read more...

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Ellsworth Adhesives

As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel. Read more...

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Ellsworth Adhesives

As electronic devices become smaller, stronger and faster, the need for greater thermal management (heat dissipation and control) within these devices has increased exponentially. Read more...

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Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F. Read more...

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Henkel Corporation - Electronics

LOCTITE STYCAST EO 1058 is a single component epoxy system that cures at 125°C. EO1058 provides excellent environmental and thermal protection to encapsulated parts. This product is especially suited for use in protecting devices subjected to harsh environments such as automotive applications. Read more...

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