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Fasteners and materials, and the tools and systems that automate application/dispensing and assembly/disassembly.
Ellsworth Adhesives

If an encapsulant with flame retardancy and flexibility is necessary in your next electronics application, CONAP® EN-5852 from Cytec Solvay Group may be an excellent selection. Read more...

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Henkel Corporation - Electronics

Henkel's low viscosity thermally conductive, low pressure molding material, Technomelt TC-50, provides an alternataive to potting for electronic heat generating devices. Read more...

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Master Bond, Inc.

Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping. Read more...

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Henkel Corporation - Electronics

TECHNOMELT PA 2384 is a chemically resistance low pressure molding material that offers chemical resistance for devices that are exposed to various chemicals, including solvents, acids, engine fluids, soaps and alkalines, among others. Read more...

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Henkel Corporation - Electronics

TECHNOMELT PA 668 is a UV-stabilized white molding material that has been engineered to be aesthetically aligned with consumer and industrial product designs, while offering superior molding and color integrity performance. Resistant to UV light, as well as temperature resistant in-process and in-use, TECHNOMELT PA 668 maintains its color even when subjected to harsh external environments. Read more...

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Henkel Corporation - Electronics

TECHNOMELT PA 668 is a UV-stabilized white low pressure molding material that has been engineered to be aesthetically aligned with consumer and industrial product designs. The UV and thermal stability of TECHNOMELT PA 668 make it extremely versatilve. It is ideal for multiple applications including indoor and outdoor LED lighting, househould consumer products and industrial sensors. Read more...

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Henkel Corporation - Electronics

Henkel's thermally conductive TECHNOMELT, combines the low-pressure, protective benefits of all TECHNOMELT materials with new, thermally conductive functional capabilities. Read more...

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Henkel Corporation - Electronics

Ease of use is one of the top aforementioned qualities that Henkel's Hysol brand encapsulation materials strive to provide. These products also ensure in-process simplicity and outstanding long-term performance, along with protection from the effects of mechanical damage and corrosion for Gold (Au) wire, Aluminum (Al), Silicon (Si) die and low-Potassium (K) die. Read more...

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R. S. Hughes Company, Inc.

Introducing Momentive’s elite Adhesive line. Manufacturers of sophisticated electronics rely on Momentive to fill critical processing needs and supply vital properties to components from the circuit board to the display... Read more...

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ELANTAS PDG, Inc.

ELAN-Tron® U polyurethane resins provide electrical insulation with superior environmental protection. The two-part systems cure at room temperature or with low heat. Flexibility and a low exotherm minimize stress on sensitive components. They are typically dispensed with meter-mix equipment and are available in filled and unfilled versions. Read more...

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