Wacker Chemical Corp.

Special features
- Gap filler, thermal conductivity 2.3 W/mK
- Two-part, RT curing
- Constant properties from –50 °C to +180 °C
- Low stress, soft and tacky
- D4-D8 < 350ppm
- Low abrasive

Application
Interface material for heat sink applications for the electronics industry Read more...

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