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Making products that are lighter, stronger and last longer, and new materials that improve performance.
Indium Corporation

Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. Read more...

More Product Announcements from Indium Corporation
Indium Corporation

Indium - 9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...

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Indium Corporation

Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... Read more...

More Product Announcements from Indium Corporation
Indium Corporation

Indium Corporation - These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages... Read more...

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H.C. Starck Inc. - Fabricated Products Group

Custom-engineered thermal management materials from H.C. Starck are helping the electronics industry continue its rapid growth, part of which is driven by increasing miniaturization. This trend puts ever greater cooling demands on electronic circuitry. Our molybdenum and tungsten materials, laminates, and engineered composite materials are uniquely suited for these applications. Read more...

More Product Announcements from H.C. Starck Inc. - Fabricated Products Group