Diamond has thermal conductivity five times that of copper and is an electrically insulating, making for an ideal heat sink. CVD Diamond has all of the properties of single crystal diamond without many of the size and shape limitations Read more...More Product Announcements from Applied Diamond, Inc.
An excellent material for use in high energy research applications; diamond’s tensile strength, high thermal conductivity, beam resistance, low noise, fast response and transmission across a variety of wave lengths make diamond a superior material for a variety of challenging applications. Read more...More Product Announcements from Applied Diamond, Inc.
The portable electronics industry has ongoing challenges to improve drop-shock performance without sacrificing thermal cycling performance, reduce need for expensive board-level underfills (and associated material, process and re-work costs), as well as the inability to even reach some areas with underfill; and reduce costs. See Indium's new technology that addresses these issues Read more...More Product Announcements from Indium Corporation
Custom-engineered thermal management materials from H.C. Starck are helping the electronics industry continue its rapid growth, part of which is driven by increasing miniaturization. This trend puts ever greater cooling demands on electronic circuitry. Our molybdenum and tungsten materials, laminates, and engineered composite materials are uniquely suited for these applications. Read more...More Product Announcements from H.C. Starck Inc. - Fabricated Products Group
These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages offset the investment Read more...More Product Announcements from Indium Corporation
Indium9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...More Product Announcements from Indium Corporation
Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. Read more...More Product Announcements from Indium Corporation