Product Announcements:
Semiconducting Materials

Custom-engineered thermal management materials from H.C. Starck are helping the electronics industry continue its rapid growth, part of which is driven by increasing miniaturization. This trend puts ever greater cooling demands on electronic circuitry. Our molybdenum and tungsten materials, laminates, and engineered composite materials are uniquely suited for these applications. Read more...

Cheap Tubes is "The Source for Single Layer Graphene Oxide"! Our SLGO uses no metal catalysts in its production, it is made by a modified Hummers method. Our SLGO is Di Water, NMP, DCB, or DMF Soluble so it can be easily dispersed into solvents for further processing without the use of surfactants, it is truly solution processable. Read more...

Indium's experts will present & teach professional development courses at the 35th International Electronics Manufacturing Technology Conference, November 6–8. A White Paper explains the research involved in identifying lead-free alternatives for high-melting, high lead-containing solder alloys. READ IT HERE Read more...

These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages offset the investment Read more...

Kynar wire UL1422 28AWG Material: Copper Wire Coating Ag Color: White Length: 20,000FT/Roll Temp.: 105C. Voltage Rating: 150~300V Read more...

SMD Common Mode Choke - HDMI Filter - EMI / EMC/ ESD Solution - For HDMI - Source Device Read more...

From One Engineer to Another This paper addresses reflow in an enclosed oven, although many of the discussions may pertain to wave soldering and even vacuum soldering. Let's start with the real reason assembly engineers use nitrogen in inert soldering: because it is the cheapest gas available that does not react with hot metal surfaces to form an unsolderable film Read more...

There are lots of ways of forming deposits of solder in a small form factor, and solder paste printing remains one of the most reliable, although yield drops dramatically at below 120microns pitch (some say 100 microns). If you are stencil printing solder paste, there are two guiding principles Sbiroli's Rule & Anglin's Rule Read More Read more...

Indium9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...

Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. Read more...