Product Announcements: Semiconducting Materials

In a world driven by technology, scanning and sensing equipment must constantly evolve to meet new challenges. That's where Marktech can help. Advanced sensing applications require the correct custom solution either in packaged component or assembly form. Our engineers offer design expertise taken from 26 years of history specializing in sensor packaging covering UV and IR spectral ranges. (read more)

Kynar wire

UL1422 28AWG

Material: Copper Wire Coating Ag

Color: White

Length: 20,000FT/Roll

Temp.: 105C.

Voltage Rating: 150~300V (read more)

SMD Common Mode Choke

- HDMI Filter

- EMI / EMC/ ESD Solution

- For HDMI - Source Device (read more)

From One Engineer to Another This paper addresses reflow in an enclosed oven, although many of the discussions may pertain to wave soldering and even vacuum soldering. Let's start with the real reason assembly engineers use nitrogen in inert soldering: because it is the cheapest gas available that does not react with hot metal surfaces to form an unsolderable film (read more)

There are lots of ways of forming deposits of solder in a small form factor, and solder paste printing remains one of the most reliable, although yield drops dramatically at below 120microns pitch (some say 100 microns). If you are stencil printing solder paste, there are two guiding principles Sbiroli's Rule & Anglin's Rule Read More
(read more)

Indium9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. (read more)

Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. (read more)