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Fasteners and materials, and the tools and systems that automate application/dispensing and assembly/disassembly.
Fujipoly® America Corp.

Engineers say the new layout and added content helps them quickly find a thermal interface material that is best suited for their cooling needs without the added step of calling for technical support. The catalog features thermal interface solutions for virtually any application, ranging from low-cost thin films and form-in-place materials to 17.0 W/m°K high-performance... Read more...

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Henkel Corporation - Electronics

Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities Read more...

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Ellsworth Adhesives

As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel. Read more...

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Ellsworth Adhesives

Dow Corning® recently developed TC-4525, a thermally conductive, soft and compressible, gap filling silicone adhesive designed to dissipate heat from printed circuit boards. Read more...

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Ellsworth Adhesives

To keep electronic devices running smoothly and for a long period of time, potting compounds are used to help dissipate heat from the sensitive electronic component. Read more...

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Master Bond, Inc.

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. Read more...

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Fujipoly® America Corp.

Fujipoly® introduces a new line of high-performance, glass fabric reinforced thermal interface materials. Sarcon® GAR thin films deliver a high thermal conductivity (3.0 W/m°K) while exhibiting a thermal resistance as low as .17°Cin2/W.

The reinforced film is a great choice for complex die-cut shapes and exerts a low force on components as it fills near‐micro... Read more...

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MINTEQ® International Inc, Pyrogenics Group

Pyrolytic Graphite by MINTEQ® International Inc, Pyrogenics Group provides a reduced cost of ownership due to the low erosion rates of the material. This is a key factor in all improvements is the reduction of costs for the end user and improves productivity by enabling the user to operate longer without tooling changes and the associated costs of downtime during the tooling change Read more...

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Wacker Chemical Corp.

The heat-conducting SEMICOSIL® 961 TC silicone filler from WACKER is applied directly to the heat sink. Once the electrical circuit is pressed on, the gap filler cures to form a soft, cushioning silicone layer that optimally transfers heat to the heat sink. Read more...

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Master Bond, Inc.

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Read more...

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