Fujipoly® introduces a new line of high-performance, glass fabric reinforced thermal interface materials. Sarcon® GAR thin films deliver a high thermal conductivity (3.0 W/m°K) while exhibiting a thermal resistance as low as .17°Cin2/W.
The reinforced film is a great choice for complex die-cut shapes and exerts a low force on components as it fills near‐micro... Read more...More Product Announcements from Fujipoly® America Corp.
Pyrolytic Graphite by MINTEQ® International Inc, Pyrogenics Group provides a reduced cost of ownership due to the low erosion rates of the material. This is a key factor in all improvements is the reduction of costs for the end user and improves productivity by enabling the user to operate longer without tooling changes and the associated costs of downtime during the tooling change Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
The heat-conducting SEMICOSIL® 961 TC silicone filler from WACKER is applied directly to the heat sink. Once the electrical circuit is pressed on, the gap filler cures to form a soft, cushioning silicone layer that optimally transfers heat to the heat sink. Read more...More Product Announcements from Wacker Chemical Corp.
Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Read more...More Product Announcements from Master Bond, Inc.
Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Read more...More Product Announcements from Indium Corporation
MINTEQ® International Inc, Pyrogenics Group has a powerful new weapon in the battle against thermal heat in state-of-the-art electronic circuits and devices. PYROID® HT Pyrolytic Graphite thermal spreader and heat sink material offer exceptionally high thermal conduction that won't bust your budget. Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
To keep electronic devices running smoothly and for a long period of time, potting compounds are used to help dissipate heat from the sensitive electronic component. Read more...More Product Announcements from Ellsworth Adhesives
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
Dow Corning® recently developed TC-4525, a thermally conductive, soft and compressible, gap filling silicone adhesive designed to dissipate heat from printed circuit boards. Read more...More Product Announcements from Ellsworth Adhesives
The introduction of Sarcon® YR‐c by Fujipoly® gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.
When placed between a heat source such as a high‐performance semiconductor and... Read more...More Product Announcements from Fujipoly® America Corp.