As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel. Read more...More Product Announcements from Ellsworth Adhesives
Fujipoly® introduces Sarcon® PG80A, its newest high-performance, low compression force putty-like thermal interface material. The 13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI.
Technic... Read more...More Product Announcements from Fujipoly America Corp.
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
Henkel offers a wide range of thermally conductive film adhesives that are ideal for bonding large areas or complex shapes. Read more...More Product Announcements from Henkel Corporation - Electronics
Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Read more...More Product Announcements from Indium Corporation
Fujipoly's Sarcon® 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer as well as a low-tac surface treatment. These features prevent die-cut holes from collapsing and help maintain original spec tolerances during final assembly. Read more...More Product Announcements from Fujipoly America Corp.
LED lighting has made a profound impact on the functionality and appearance of millions of consumer and commercial products. One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. Read more...More Product Announcements from Fujipoly America Corp.
Epoxy Technology, Inc. (EPO-TEK®)presents an updated Thermal Management Brochure to include the Newest additions to the EPO-TEK® Products for Optimizing Thermal Management: EK1000, EK2000 & EK1000-1 Read more...More Product Announcements from Epoxy Technology
Intumescent Fire Retardant Coatings Firex™MINTEQ® Firex™ intumescent fire retardant coatings have provided fire protection for personnel and property for over 30 years. Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
The Pyrogenics Group provides extreme-purity, freestanding PYROID® Pyrolytic Graphite (PG) films and stripper foils. Pyroid® PG film is available at any thickness between 2 µm to 75 µm, area densities of 0.5 mg/cm2 and up. Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group