Sarcon® PG25A is one of Fujipoly's softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates. Read more...More Product Announcements from Fujipoly® America Corp.
Sarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads. Read more...More Product Announcements from Fujipoly® America Corp.
Epoxy Technology, Inc. (EPO-TEK®)presents an updated Thermal Management Brochure to include the Newest additions to the EPO-TEK® Products for Optimizing Thermal Management: EK1000, EK2000 & EK1000-1 Read more...More Product Announcements from Epoxy Technology
SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hinderin
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
SEMICOSIL® 961 TC by WACKER - two-part silicone that cures at room-temperature to a soft silicone rubber with a thermal conductivity of 2.0 W/mK offering efficient heat transfer between the electrical circuit and heat sink needed in today’s electronics. It’s ideal for automated dispensing with increased dispense speeds and accuracy. Read more...More Product Announcements from Wacker Chemical Corp.
Pyroid® HT Pyrolytic Graphite Material Provides “Diamond Like Thermal Performance Without the Diamond Price” l
Pyroid® HT Pyrolytic Graphite Customer Benefits:
- Significant thermal spreading
- Fast and Uniform Thermal Response
- Weight savings
- Direct solder attachment
Get a Copy of Pyroid® HT Heat Sink/Spread... Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Fujipoly’s SARCON® 30XR-Um Thin Film sets a new standard for performance and compressibility. The putty-like thermal gap filler pad exhibits a thermal conductivity of 17 watt/m-k and a thermal resistance of only 0.02 °Cin2/W. Read more...More Product Announcements from Fujipoly® America Corp.
Thermal interface tapes, pads, and epoxies by 3M provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity. They address a crucial problem with today's low-power electronic devices – the need to dissipate the sizable amounts of heat being generated. Read more...More Product Announcements from Digi-Key Electronics