Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Read more...More Product Announcements from Indium Corporation
MINTEQ® International Inc, Pyrogenics Group has a powerful new weapon in the battle against thermal heat in state-of-the-art electronic circuits and devices. PYROID® HT Pyrolytic Graphite thermal spreader and heat sink material offer exceptionally high thermal conduction that won't bust your budget. Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
To keep electronic devices running smoothly and for a long period of time, potting compounds are used to help dissipate heat from the sensitive electronic component. Read more...More Product Announcements from Ellsworth Adhesives
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
Dow Corning® recently developed TC-4525, a thermally conductive, soft and compressible, gap filling silicone adhesive designed to dissipate heat from printed circuit boards. Read more...More Product Announcements from Ellsworth Adhesives
The introduction of Sarcon® YR‐c by Fujipoly® gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.
When placed between a heat source such as a high‐performance semiconductor and... Read more...More Product Announcements from Fujipoly® America Corp.
As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel. Read more...More Product Announcements from Ellsworth Adhesives
Fujipoly® introduces Sarcon® PG80A, its newest high-performance, low compression force putty-like thermal interface material. The 13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI.
Technic... Read more...More Product Announcements from Fujipoly® America Corp.
Henkel offers a wide range of thermally conductive film adhesives that are ideal for bonding large areas or complex shapes. Read more...More Product Announcements from Henkel Corporation - Electronics
Fujipoly's Sarcon® 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer as well as a low-tac surface treatment. These features prevent die-cut holes from collapsing and help maintain original spec tolerances during final assembly. Read more...More Product Announcements from Fujipoly® America Corp.