Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. Read more...

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MINTEQ® International Inc, Pyrogenics Group

Intumescent Fire Retardant Coatings Firex™MINTEQ® Firex™ intumescent fire retardant coatings have provided fire protection for personnel and property for over 30 years. Read more...

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MINTEQ® International Inc, Pyrogenics Group

Pyroid® HT Pyrolytic Graphite Material Provides “Diamond Like Thermal Performance Without the Diamond Price” l

Pyroid® HT Pyrolytic Graphite Customer Benefits:

  • Significant thermal spreading
  • Fast and Uniform Thermal Response
  • Weight savings
  • Direct solder attachment

Get a Copy of Pyroid® HT Heat Sink/Spread... Read more...

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Master Bond, Inc.

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system Read more...

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Fujipoly® America Corp.

Sarcon® PG25A is one of Fujipoly's softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates. Read more...

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Fujipoly® America Corp.

Sarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads. Read more...

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Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®)presents an updated Thermal Management Brochure to include the Newest additions to the EPO-TEK® Products for Optimizing Thermal Management: EK1000, EK2000 & EK1000-1 Read more...

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Fujipoly® America Corp.

SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B delivers a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W. Read more...

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Indium Corporation

Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...

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Wacker Chemical Corp.

SEMICOSIL® 961 TC by WACKER - two-part silicone that cures at room-temperature to a soft silicone rubber with a thermal conductivity of 2.0 W/mK offering efficient heat transfer between the electrical circuit and heat sink needed in today’s electronics. It’s ideal for automated dispensing with increased dispense speeds and accuracy. Read more...

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