Sarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads. Read more...More Product Announcements from Fujipoly® America Corp.
SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hinderin
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
SEMICOSIL® 961 TC by WACKER - two-part silicone that cures at room-temperature to a soft silicone rubber with a thermal conductivity of 2.0 W/mK offering efficient heat transfer between the electrical circuit and heat sink needed in today’s electronics. It’s ideal for automated dispensing with increased dispense speeds and accuracy. Read more...More Product Announcements from Wacker Chemical Corp.
Pyroid® HT Pyrolytic Graphite Material Provides “Diamond Like Thermal Performance Without the Diamond Price” l
Pyroid® HT Pyrolytic Graphite Customer Benefits:
- Significant thermal spreading
- Fast and Uniform Thermal Response
- Weight savings
- Direct solder attachment
Get a Copy of Pyroid® HT Heat Sink/Spread... Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Fujipoly’s SARCON® 30XR-Um Thin Film sets a new standard for performance and compressibility. The putty-like thermal gap filler pad exhibits a thermal conductivity of 17 watt/m-k and a thermal resistance of only 0.02 °Cin2/W. Read more...More Product Announcements from Fujipoly® America Corp.
Thermal interface tapes, pads, and epoxies by 3M provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity. They address a crucial problem with today's low-power electronic devices – the need to dissipate the sizable amounts of heat being generated. Read more...More Product Announcements from Digi-Key Electronics
Henkel's hot melt adhesives have already been used in the 3D-printing of functional applications such as furniture and elements for buildings. Henkel is focusing development in this area on providing novel filament and powder materials for us in SLS and FDM printers. Read more...More Product Announcements from Henkel Corporation - Industrial
Some of the most cumbersome steps in evaluating the performance of a thermal interface material are requesting product samples and receiving quotes. To eliminate this frustration, Fujipoly® created an online suite of features that allow engineers to request complimentary samples and/or quotes with the click of a mouse.
The registration process takes under 2 minutes to c... Read more...More Product Announcements from Fujipoly® America Corp.
Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applicatons requiring isolation between heat sinks and high-voltage, bare-leaded devices. Read more...More Product Announcements from Henkel Corporation - Electronics