Thermal interface tapes, pads, and epoxies by 3M provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity. They address a crucial problem with today's low-power electronic devices – the need to dissipate the sizable amounts of heat being generated. Read more...More Product Announcements from Digi-Key Electronics
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
Henkel's hot melt adhesives have already been used in the 3D-printing of functional applications such as furniture and elements for buildings. Henkel is focusing development in this area on providing novel filament and powder materials for us in SLS and FDM printers. Read more...More Product Announcements from Henkel Corporation - Industrial
Some of the most cumbersome steps in evaluating the performance of a thermal interface material are requesting product samples and receiving quotes. To eliminate this frustration, Fujipoly® created an online suite of features that allow engineers to request complimentary samples and/or quotes with the click of a mouse.
The registration process takes under 2 minutes to c... Read more...More Product Announcements from Fujipoly® America Corp.
Pyroid® HT Pyrolytic Graphite Material Provides “Diamond Like Thermal Performance Without the Diamond Price” l
Pyroid® HT Pyrolytic Graphite Customer Benefits:
- Significant thermal spreading
- Fast and Uniform Thermal Response
- Weight savings
- Direct solder attachment
Get a Copy of Pyroid® HT Heat Sink/Spread... Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applicatons requiring isolation between heat sinks and high-voltage, bare-leaded devices. Read more...More Product Announcements from Henkel Corporation - Electronics
Henkel offers a wide range of thermally conductive film adhesives that are ideal for bonding large areas or complex shapes. Read more...More Product Announcements from Henkel Corporation - Electronics
Engineers say the new layout and added content helps them quickly find a thermal interface material that is best suited for their cooling needs without the added step of calling for technical support. The catalog features thermal interface solutions for virtually any application, ranging from low-cost thin films and form-in-place materials to 17.0 W/m°K high-performance... Read more...More Product Announcements from Fujipoly® America Corp.
Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities Read more...More Product Announcements from Henkel Corporation - Electronics
As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel. Read more...More Product Announcements from Ellsworth Adhesives