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Fasteners and materials, and the tools and systems that automate application/dispensing and assembly/disassembly.
Henkel Corporation - Industrial

Henkel's hot melt adhesives have already been used in the 3D-printing of functional applications such as furniture and elements for buildings. Henkel is focusing development in this area on providing novel filament and powder materials for us in SLS and FDM printers. Read more...

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Fujipoly® America Corp.

Some of the most cumbersome steps in evaluating the performance of a thermal interface material are requesting product samples and receiving quotes. To eliminate this frustration, Fujipoly® created an online suite of features that allow engineers to request complimentary samples and/or quotes with the click of a mouse.

The registration process takes under 2 minutes to c... Read more...

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MINTEQ® International Inc, Pyrogenics Group

Pyroid® HT Pyrolytic Graphite Material Provides “Diamond Like Thermal Performance Without the Diamond Price” l

Pyroid® HT Pyrolytic Graphite Customer Benefits:

  • Significant thermal spreading
  • Fast and Uniform Thermal Response
  • Weight savings
  • Direct solder attachment

Get a Copy of Pyroid® HT Heat Sink/Spread... Read more...

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Henkel Corporation - Electronics

Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applicatons requiring isolation between heat sinks and high-voltage, bare-leaded devices. Read more...

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Henkel Corporation - Electronics

Henkel offers a wide range of thermally conductive film adhesives that are ideal for bonding large areas or complex shapes. Read more...

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Fujipoly® America Corp.

Engineers say the new layout and added content helps them quickly find a thermal interface material that is best suited for their cooling needs without the added step of calling for technical support. The catalog features thermal interface solutions for virtually any application, ranging from low-cost thin films and form-in-place materials to 17.0 W/m°K high-performance... Read more...

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Henkel Corporation - Electronics

Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities Read more...

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Ellsworth Adhesives

As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel. Read more...

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Ellsworth Adhesives

Dow Corning® recently developed TC-4525, a thermally conductive, soft and compressible, gap filling silicone adhesive designed to dissipate heat from printed circuit boards. Read more...

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Ellsworth Adhesives

To keep electronic devices running smoothly and for a long period of time, potting compounds are used to help dissipate heat from the sensitive electronic component. Read more...

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