Epoxy Technology

Epoxy Technology, Inc. (EPO-TEK®) offers an expanded line of Room Temperature Curing Electrically Conductive Adhesives (ECAs). These ECAs are ideal for temperature sensitive substrates, allowing for a lower stress cure, best for large parts as well as high stress, temperature cycled parts. These epoxies require no oven curing; reducing capital costs and giving greater flexibility for... Read more...

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Alpha Assembly Solutions

In response to the power semiconductor market's drive to improve reliability and device performance for automotive, alternative energy, transportation, consumer electronics, telecommunications and industrial applications, Alpha has developed a line of ALPHA® Argomax® advanced sinter technology products. Read more...

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Indium Corporation

Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... Read more...

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Henkel Corporation - Electronics

In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. LOCTITE GC 10 is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance. Read more...

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