Oak-Mitsui delivers the worlds' finest, high performance copper foils and lamination products to the PCB industry. They believe they have performed well in meeting and exceeding their customers' expectations in this industry by listening and understanding the needs of their customers as well as their customers' market. Read more...More Product Announcements from Oak-Mitsui, Inc.
MicroThin® is a very low profile copper 3µm or 5µm copper foil with an 18µm or 35µm peelable copper carrier for high-density circuit applications. The releasing layer can be peeled-off after lamination and recycled. Read more...More Product Announcements from Oak-Mitsui, Inc.
PA&E's explosive metal welding process creates high-strength, bi-metallic transitions that join dissimilar metals together at the molecular level. For the maritime industry, this means high-strength, critical parts can be manufactured incorporating stainless steel/aluminum bi-metallic transitions and welded directly to an aluminum structure without generating galvanic corrosion. Read more...More Product Announcements from PA&E
The explosive metal welding process can be used to create bi-metal pipe transitions for applications that require a connection between vessels made of different types of metals. This type of work-piece is well suited for nuclear, maritime and cryogenic applications as well as in instances that use pressure vessels made from clad plate. Read more...More Product Announcements from PA&E
The explosive metal bonding process can join otherwise incompatible materials without compromising other design elements in applications such as: weld transitions, precious metal conservation, preventing galvanic corrosion, corrosive resistant linings, and more. Read more...More Product Announcements from PA&E