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Making products that are lighter, stronger and last longer, and new materials that improve performance.
Henkel Corporation - Electronics

TECHNOMELT PA 678, high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. Read more...

More Product Announcements from Henkel Corporation - Electronics
Henkel Corporation - Electronics

Henkel's renowned TECHNOMELT low pressure molding solution delivers exceptional sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage because the entire TECHNOMELT operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged. Read more...

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AGC Chemicals Americas, Inc.

Composed of pigments and fillers such as glass, carbon, graphite and metal powders (bronze and molybdenum disulfide), Fluon® Filled PTFE Compounds are molding powders that enhance wear resistance, creep resistance, thermal conductivity and electrical conductivity over virgin PTFE resins. Read more...

More Product Announcements from AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.

AGC Chemicals Americas FluoroCompounds Group has opened a pilot plant in Thorndale, Pa., to make it fast and easy for customers to receive small batches and samples of PTFE compounds, which meet the rigorous production part approval process (PPAP) testing standards for automotive components.

Fluon® Filled PTFE Compounds from AGC FluoroCompounds Group are polytetrafluoroethylen... Read more...

More Product Announcements from AGC Chemicals Americas, Inc.