Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin®. MicroThin® is a very low profile copper 3µm or 5µm copper foil with an 18µm or 35µm peelable copper carrier for high-density circuit applications. The releasing layer can be peeled-off after lamination and recycled. Read more...More Product Announcements from Oak-Mitsui, Inc.
Applications: Electrochemistry and Fuel Cells
Electrochemical cells and fuel cells require electrodes that permit the transverse flow of fluids while maximizing the effective surface area of a given occupied volume. Read more...More Product Announcements from Dexmet Corporation
Dexmet® expanded metals and foils are the materials of choice in bushing and bearing construction. As compared to the typical extruded material or woven material, Dexmet expanded metal save money by eliminating waste AND will not unravel. Read more...More Product Announcements from Dexmet Corporation
Application: Electric Heating Elements
Dexmet has been producing heating elements in a variety of materials for many years. The most common materials are INCO 600, Nickel, Copper and Kanthal, however since we expand all ductile materials, we can create a configuration for you in most any metal. Read more...More Product Announcements from Dexmet Corporation
Oak-Mitsui offers a family of resin coated copper products call MutliFoil. MutliFoil is manufactured by our parent company Mitsui Kinzoku. Mitsui is the world's leading supplier of resin coated copper with excellent quality and service worldwide. Read more...More Product Announcements from Oak-Mitsui, Inc.