Drift Free Alternative Dew Point Monitor for Compliance with NFPA 99 Level 1 and Level 2 Medical Air. Read more...More Product Announcements from Edgetech Instruments Inc.
- NFPA 99 Compliant
- Audible and Visual Alarms
- Continuous Dew Point Monitoring
- Chilled Mirror Sensor Selection Required
IST provides exclusive humidity sensors with directly integrated platinum temperature sensors that cater to a wide range of applications.
A variety of different layouts and connections such as SMD and wired
configurations are available. Read more...
Try the Online Drying Simulator Tool
Optimized drying saves you energy and costs
We have developed this drying simulator to show how exact humidity measurements can lead to more efficient energy use and higher yields in drying applications. Read more...
Drying applications are known to account for up to 20% energy consumption in industrial chemical processes. Drying processes can be energy-intensive and costly.
We've created an online drying simulator to help you analyze how your humidity measurements are impacting your energy use and yields.
Try it now! Read more...More Product Announcements from Vaisala
973E is a value engineered version of the 973 series. It does compromise on quality and performance, so still includes pressure measurement as a standard feature, can operate up to 10bar and features ORIS to maintain fast response in spot check applications. Read more...More Product Announcements from MBW Calibration AG
- Frost/dew point range: -30 to +70 C
- Temperature: -50 to +100 C
- Temperature with T12: -200 to +250 C
The rugged dew point transmitter continuously measures moisture content of compressed air or process gas over a -148° F to +68° F dewpoint range. The transmitter operates from 12 to 28 Vdc in a loop-powered configuration. Read more...More Product Announcements from The Kahn Companies
The second generation of WLCSP (wafer-level chip-scale package) humidity sensor. The SHTW2 humidity sensor comes in a flip chip package – an established technology that represents one of the simplest and smallest possible ways of packaging a semi-conductor chip and results in a tiny footprint of 1.3 x 0.7 x 0.5 mm3. Read more...More Product Announcements from Sensirion AG