Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.

Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.

Polyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part adhesive systems.

Specialty polymers and resins are proprietary polymers, resins, monomers and intermediates. This category includes plastics and elastomers that are based on proprietary curing technologies or chemistries, or that are designed for specialized applications.

Thermoplastics and thermoplastic materials soften when heated and harden when cooled. They can withstand many heating and cooling cycles and are often suitable for recycling.

Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation or resilience).

Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding.

Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms.

Industrial sealants are liquid or viscous compounds used between surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material. They may also include compounds for filling gaps or seams.

Casting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place.

Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.

Pressure sensitive adhesives (PSA) and contact adhesives adhere to most surfaces with very slight pressure. They are available in solvent and latex or water based forms.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications