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  • MICRO: Tool/Fab Automation
    electrostatic discharge (ESD) events. Such discharges can cause microprocessors in process tools to operate unpredictably. Erratic tool behavior, in turn, can result in tool lockups, failed calibrations, and error messages, all of which lead to tool downtime and the need for operator intervention
  • MICRO: Expansions and Acquisitions
    Brooks Automation has opened a plant near Los Angeles for manufacturing the company's process tool automation and factory management software. Located in Sylmar, the plant houses the largest cleanroom in all of Brooks' plants. The room includes a Class 10,000 production area measuring 13,900 sq ft
  • MICRO: Product Technology News (May '2000)
    by applying airflow and temperature control within the machine chamber and through the use of a hybrid active damper. The tool's improved vibration isolation structure allows synchronization control at a high scanning speed. A series of in-process monitors detects and measures ESD events accurately
  • Medical Device Link .
    Abrasive-jet machining has become a helpful tool in medical and electronics manufacture, where it is used for drilling, deburring, beveling, lead cleaning, wire stripping, and coating removal. Unfortunately, the process tends to generate electrostatic charges within work chambers. In fact, abrading
  • MICRO:Archive:Back Issue TOC
    first; FOUP sales set record; Genus sells first ALD tool Seiko Epson inks SOI pact; Partners offer software; Ibis ups wafer capacity; Brooks buys SEMY; Lambda opens service center; Semtech exiting foundry biz; Chem vendors expands to Asia SCP Global Technology, SPIE's Symposium on Microelectronic
  • MICRO:March 1998:Product Technology News (p.122)
    the risk of repetitive injury. The tool moves wafers from a process cassette into a "coin stack " shipping container or from a shipping container into a process cassette. The orientation mark is found before the wafer is transported into the shipping container or placed into the cassette. An ESD
  • MICRO: Product Technology News (June '2000)
    The Q200 is an automated 200-mm overlay metrology tool for 0.13- um and smaller processes. The system measures all layers, including CMP, buried layers, grainy images, and image contrast reversals. Fast pattern recognition and robotic wafer handling make possible a throughput of 80 wafers/hr at 20
  • MICRO: Archive: Back Issue TOC
    , integrated metrology tool, cleanroom-compatible filters, liquid optical particle counter, storage system/stocker, extractive gas monitor, ESD monitoring system, machine control system, mechanical vacuum pump, field emission SEMs, continuous gas-emission monitor Vendor releases new version of wafer-mapping

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