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  • Gold Tin The Unique Eutectic Solder Alloy (.pdf)
    The eutectic gold-tin alloy is 80%Au/20%Sn with a eutectic of 280°C (556°F) and is reflowed in a pure nitrogen or forming gas* atmosphere, which forms the "flux", normally onto gold based metallisations. The peak reflow temperature is usually 320-340°C in a bell shaped profile, with a dwell time
  • Assessment of Eutectic Solder Phase Growth in Under-The-Hood Power Control Modules (.pdf)
    In many applications, especially automotive, solder interconnects experience degradation due to prolonged temperature and power cycling. This degradation behavior manifests itself as changes in the grain/phase structure, primarily through grain/phase coarsening. Because the magnitude of the change
  • AN3017: Procedure for MSAG MMIC AuSn Eutectic Solderability
    The following procedure is M/A-COM's recommended instruction for eutecticly attaching die to pedestals. 2.1 The following are materials and supplies required to perform eutectic soldering. Solder Preforms: A. 80/20 AuSn B. Approximately 100% die coverage C. Approximately 1 mil thick Gases: A. N2
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile
  • How to use Fusible Alloys (.pdf)
    Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and influences the melting point, as well as gives these materials the unique characteristic of expansion upon
  • Reliability Study Conducted: Leadless Chip Thermistor with High Temperature Solder Leach Resistant Gold Contacts, Die Mounted with Eutectic Au/Sn Solder by Customer (.pdf)
    This report is a summary of the information contained in the full report with the file name. "CornerstoneT041ThermReliabilityReport.pdf," which came from a customer of Cornerstone Sensors, hereinafter named "Customer," whose name has been withheld due to Customer's request for confidentiality. The
  • High Melting Lead-Free Mixed BiAgX Solder Paste System
    Although lead-free soldering has been main stream in the industry since 2006. with the replacement of the eutectic SnPb system by the SnAgCu system, the. development of drop-in lead-free alternatives for high melting high lead solder. alloys is still far from mature. The BiAg alloy exhibits
  • Development of a High Performance Lead-Free Wave Solder Alloy
    Lead Free Wave soldering has developed with two main alloy systems. The Sn/Ag/Cu range of solders having typically 3 - 4 % Ag content and the Sn/Cu eutectic based systems. Both of these systems have inherent drawbacks when comparing the value equation from a user perspective. The Sn/Ag/Cu range

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  • Solder Joint Technology
    Wetting Reaction of Pb-Free Eutectic Solders on Thick Cu UBM...........................................................................
  • Lead-Free Electronic Solders
    For exam- ple, McCormack and coworkers [40, 41] modified the Sn�3.5Ag binary eutectic solder with 0.5�2.0 wt.% Zn additions, and noted substantial refinement of the microstructure; in particular, they observed a decrease in the incidence of b-Sn �
  • Lead-free Solders: Materials Reliability for Electronics
    Tsai, J.Y., Chang, C.W., Ho, C.E. et al. (2006) Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates.
  • Lead-free Electronics
    After soldering the same components with tin-lead eutectic solder , the lead-free materials were used with a reflow temperature of 245"C, which again was well below the 260�C expected peak.
  • Principles of Soldering
    The authors have com- pared the spreading characteristics, as a function of excess temperature above the melting point (�superheat�), of all combinations of the elements bismuth, indium, lead, silver, and tin when used as eutectic solders on �ideal� substrates [Humpston and Jacobson �
  • A Guide to Lead-free Solders
    As-cast Microstructures of Solder Alloys..........................................73 3.4.1 SnPb Euctectic..........................................................................74 3.4.2 SnAg Eutectic Solder ...............................................................74 3.4.3 SnAgCu Ternary Solders.........................................................75 3.5 .
  • Lead-Free Solder Interconnect Reliability
    X.Q. Shi, Z.P. Wang, W. Zhou, H.L.J. Pang, and Q.J. Yang, A New Constitutive Creep Constitutive Model for Eutectic Solder Al- loy, ASME Transactions, J. Electron.
  • Advanced Flip Chip Packaging
    It has also been utilized to form a hybrid joint, uniting high lead with eutectic solder for joining die onto organic substrates.