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Parts by Number for Eutectic Solder Top

Part # Distributor Manufacturer Product Category Description
158 °F Eutectic Fusible Alloy Bar   Indium Corporation Solder than 300F, well below the melting point of Tin-lead eutectic solders. The major component of fusible alloys is bismuth. Besides producing low melting point, bismuth also gives these materials the unique characteristic of expanding on freezing. This expansion, which can continue for hours or even...
Indium-Tin Ribbon - 52In 48Sn   Indium Corporation Solder Product Description: Indium-tin ribbon has fair wettability on non-metals; good low temperature malleability. Alloy: 52In 48Sn. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 118 ºC Eutectic. Solidus Melting Temperature: 118 ºC Eutectic. Pb-Free: Yes
Indium-Tin Wire - 52In 48Sn - 3 ft   Indium Corporation Filler Alloys and Consumables Product Description: Indium-tin wire has fair wettability on non-metals; good low temperature malleability. Alloy: 52ln 48Sn. Diameter: .030". Quantity: 3 ft Spool. Liquidus Melting Temperature: 118 ºC Eutectic. Solidus Melting Temperature: 118 ºC Eutectic. Pb-Free: Yes
Bismuth Alloys   Belmont Metals, Inc. Ingots and Casting Stock Bismuth Alloys. Featuring 99.9% Bismuth and Low Melt Eutectic and Non-Eutectic Alloys offering custom compositions and forms. Bismuth is a white, crystalline, brittle metal with a pinkish tinge. It s the most naturally diamagnetic element and has one of the lowest values of thermal conductivity...
Plated Flanges   Materion Corporation Aluminum and Aluminum Alloys eutectic die attach. Plated flanges are used for wide variety of applications, including: Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams). Substrates for discrete ringframes that are epoxied onto the flange...
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Conduct Research Top

  • Assessment of Eutectic Solder Phase Growth in Under-The-Hood Power Control Modules (.pdf)
    of Eutectic Solder Phase Growth in. Under-The-Hood Power Control Modules. Craig Hillman. DfR Solutions. Andre Kleyner. Delphi Delco. 2005 SAE World Congress. Detroit, Michigan. April 11-14, 2005. 400 Commonwealth Drive, Warrendale, PA 15096-0001 U.S.A. Tel: (724) 776-4841 Fax: (724) 776-5760 Web
  • Gold Tin The Unique Eutectic Solder Alloy (.pdf)
    The eutectic gold-tin alloy is 80%Au/20%Sn with a eutectic of 280°C (556°F) and is reflowed in a pure nitrogen or forming gas* atmosphere, which forms the "flux", normally onto gold based metallisations. The peak reflow temperature is usually 320-340°C in a bell shaped profile, with a dwell time
  • AN3017: Procedure for MSAG MMIC AuSn Eutectic Solderability
    The following procedure is M/A-COM's recommended instruction for eutecticly attaching die to pedestals. 2.1 The following are materials and supplies required to perform eutectic soldering. Solder Preforms: A. 80/20 AuSn B. Approximately 100% die coverage C. Approximately 1 mil thick Gases: A. N2
  • Reliability Study Conducted: Leadless Chip Thermistor with High Temperature Solder Leach Resistant Gold Contacts, Die Mounted with Eutectic Au/Sn Solder by Customer (.pdf)
    with High Temperature Solder. Leach Resistant Gold Contacts, Die Mounted with Eutectic Au/Sn Solder by Customer. Study Period: 2000 to 2001. This report is a summary of the information contained in the full report with the file name. “CornerstoneT041ThermReliabilityReport.pdf,” which came from
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile. AN233 Solder Reflow Recommendation AN233. Solder Reflow Recommendation. BASICS OF THE REFLOW PROCESS. Author: Ravi Sharma. Microchip Technology Inc. Lead-free soldering techniques have been
  • High Melting Lead-Free Mixed BiAgX Solder Paste System
    Although lead-free soldering has been main stream in the industry since 2006. with the replacement of the eutectic SnPb system by the SnAgCu system, the. development of drop-in lead-free alternatives for high melting high lead solder. alloys is still far from mature. The BiAg alloy exhibits
  • Solder Reflow Information
    to Change Without Notice. • November 17, 2005. 1. APPLICATION NOTE • SOLDER REFLOW INFORMATION. Recommended Solder Reflow Profiles. Profile Feature. SnPb Eutectic. Lead (Pb)-Free (SnAgCu). Ramp rate. 0.5–2.0 °C/sec. 0.5–2.0 °C/sec. Preheat (soak). Temperature min. (TSMIN). Reference solder paste
  • How to use Fusible Alloys (.pdf)
    Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and influences the melting point, as well as gives these materials the unique characteristic of expansion upon

More Information on: Eutectic Solder Top

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  • Solder Joint Technology
    Wetting Reaction of Pb-Free Eutectic Solders on Thick Cu UBM...........................................................................
  • Lead-Free Electronic Solders
    For exam- ple, McCormack and coworkers [40, 41] modified the Sn–3.5Ag binary eutectic solder with 0.5–2.0 wt.% Zn additions, and noted substantial refinement of the microstructure; in particular, they observed a decrease in the incidence of b-Sn...
  • Lead-free Solders: Materials Reliability for Electronics
    Tsai, J.Y., Chang, C.W., Ho, C.E. et al. (2006) Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates.
  • Lead-free Electronics
    After soldering the same components with tin-lead eutectic solder , the lead-free materials were used with a reflow temperature of 245"C, which again was well below the 260°C expected peak.
  • A Guide to Lead-free Solders
    As-cast Microstructures of Solder Alloys..........................................73 3.4.1 SnPb Euctectic..........................................................................74 3.4.2 SnAg Eutectic Solder ...............................................................74 3.4.3 SnAgCu Ternary Solders.........................................................75 3.5 .
  • ULSI Semiconductor Technology Atlas
    TABLE 15.1 Layered Structure of UBM Systems UBM System Passivation Bumping method UBM layer structure Sputtered Cu/Ni(V)/Al Silicon nitride Print and reflow Eutectic solder Cu 500 nm Ni(V) 400 nm Al 400 nm Al or SiN SiO2 or...
  • Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Reliability of Pb-Free Solder Joints in Comparison to Sn-Pb Eutectic Solder Joints .
  • Lead-Free Soldering
    This approach is eminently logical: the new standard Pb-free alloy replaces Sn-Pb eutectic solder in a wide variety of board designs and microelectronics applications.