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  • Gold Tin The Unique Eutectic Solder Alloy (.pdf)
    The eutectic gold-tin alloy is 80%Au/20%Sn with a eutectic of 280°C (556°F) and is reflowed in a pure nitrogen or forming gas* atmosphere, which forms the "flux", normally onto gold based metallisations. The peak reflow temperature is usually 320-340°C in a bell shaped profile, with a dwell time
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile
  • High Melting Lead-Free Mixed BiAgX Solder Paste System
    Although lead-free soldering has been main stream in the industry since 2006. with the replacement of the eutectic SnPb system by the SnAgCu system, the. development of drop-in lead-free alternatives for high melting high lead solder. alloys is still far from mature. The BiAg alloy exhibits
  • Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
    In this study, the reliability of low Ag SAC alloy doped with Mn (SACM) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys. SACM is a patent pending alloy consisting of 0.5-1% Ag, 0.5-1% Cu
  • Development of a High Performance Lead-Free Wave Solder Alloy
    Lead Free Wave soldering has developed with two main alloy systems. The Sn/Ag/Cu range of solders having typically 3 - 4 % Ag content and the Sn/Cu eutectic based systems. Both of these systems have inherent drawbacks when comparing the value equation from a user perspective. The Sn/Ag/Cu range
  • Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics
    We present here the findings of Alpha's Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200oC. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted
  • iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry
    cost of alloys containing significant amounts of silver. Concerns regarding the poor drop/shock. performance of near-eutectic SAC alloys led to the development of low Ag alloys to improve the mechanical strength of BGA and CSP solder joints. Most recently, investigations into new solder paste alloys
  • LED Die Attach -- Trends & Considerations
    ), performance (thermal dissipation and light output), reliability (lumen maintenance) and. cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones and sintered materials have all been used for LED die-attach. Often, use of a particular technology platform results in trade-off between different

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  • Solder Joint Technology
    Wetting Reaction of Pb-Free Eutectic Solders on Thick Cu UBM...........................................................................
  • Lead-Free Electronic Solders
    For exam- ple, McCormack and coworkers [40, 41] modified the Sn–3.5Ag binary eutectic solder with 0.5–2.0 wt.% Zn additions, and noted substantial refinement of the microstructure; in particular, they observed a decrease in the incidence of b-Sn …
  • Lead-free Solders: Materials Reliability for Electronics
    Tsai, J.Y., Chang, C.W., Ho, C.E. et al. (2006) Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates.
  • Lead-free Electronics
    After soldering the same components with tin-lead eutectic solder , the lead-free materials were used with a reflow temperature of 245"C, which again was well below the 260°C expected peak.
  • Principles of Soldering
    The authors have com- pared the spreading characteristics, as a function of excess temperature above the melting point (“superheat”), of all combinations of the elements bismuth, indium, lead, silver, and tin when used as eutectic solders on “ideal” substrates [Humpston and Jacobson …
  • A Guide to Lead-free Solders
    As-cast Microstructures of Solder Alloys..........................................73 3.4.1 SnPb Euctectic..........................................................................74 3.4.2 SnAg Eutectic Solder ...............................................................74 3.4.3 SnAgCu Ternary Solders.........................................................75 3.5 .
  • Lead-Free Solder Interconnect Reliability
    and Q.J. Yang, A New Constitutive Creep Constitutive Model for Eutectic Solder Al- .
  • Advanced Flip Chip Packaging
    It has also been utilized to form a hybrid joint, uniting high lead with eutectic solder for joining die onto organic substrates.