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Packaging equipment design and packaging equipment fabrication services specialize in the design and fabrication of packaging equipment and packaging products.
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  • Motion Control Requirements for Hermetic Seam Welding
    management devices. The last few years have seen significant growth in implantable pulse devices (e.g., neurostimulators) for the treatment of chronic pain. All of these components share a common packaging technology that consists of two titanium half-shells that are joined together with a hermetic
  • Ceramic Electronic and IC Packaging Design Guide
    amounts of raw materials. Materials include Alumina (HTCC),. the vertical electrical interconnections. form a strong hermetic joint. into a homogeneous slurry. This. between the layers. Conductive circuit. Power Dissipation Packages. Aluminum Nitride, BeO and LTCC. mixture is principal y ceramic powders
  • Waterproof Step Motors Make Waves in Industry
    fitted with redundant shaft seals, O rings, hermetic cable feedthrough, pressure equalization and other waterproofing features. Together, these design features allow a step motor to answer a design engineer's need for a motor that will not fail after even prolonged exposure to, or submersion in, most
  • Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments (.pdf)
    . precious metals in designs and increase performance are challenging packaging designers and manufactures to. develop new interconnection solutions Applications for multiple chip packages, power conversion and. generation, MEMs devices, Solar, LED and Automotive Interfaces are seeing higher operational
  • Sure Ways to Reduce Package Sealing Failure (.pdf)
    . challenge to hermetic sealing of packages for both wet and dry products. In even the best-. controlled packaging operations, product spills onto the sealing bars. Sealants vary in their ability to cope with contamination of the sealing area. In a test involving. marinated meat packaging, a drop
  • Micro-Joining With Electron Beam Energy (.pdf)
    . packaging industry and were presented by Alloyed Electronics Corp. The micro-joining applications developed by Hamilton Standard,. Division of United Aircraft Corp. The equipment used was a. Hamilton-Zeiss model EBM2,approximately 4 kW and utilized an. X,Y, table and a 40X microscope. The operator
  • Avago Technologies: Reliable LEDs for Automotive Grade Optocouplers (.pdf)
    . by the negative temperature coefficient of the LED for-. ward voltage. For example, in a 3.3V system, this will have. a 10% compensation effect, resulting in an overall drift of. Defects. <10%. Epitaxial Growth. LED Fabrication. Assembly Packaging. Assembling. Handling. The LED is covered

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