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Industrial Adhesives - 3M 3764B Hot Melt Adhesive - Clear High Melt Gaylord Pellet - 41526 - -- 021200-41526Supplier: R. S. Hughes Company, Inc.
Description: 3M 3764B clear hot melt adhesive is compatible with abs, acrylic, ceramic, chipboard, coated cardboard, foam, glass, plastic, polycarbonate, polyethylene and pvc materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +190.4 F. Delivers great performance
- Cure Type / Technology: Thermoplastic / Hot Melt
- Viscosity: 6000 cps
Supplier: Accuratus Corporation
Description: Zirconia is an extremely refractory material. It offers chemical and corrosion inertness to temperatures well above the melting point of alumina. The material has low thermal conductivity. It is electrically conductive above 600°C and is used in oxygen sensor cells and as the susceptor (heater
- Material Type: Zirconia, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
Description: Ideal for small melting applications such as non-ferrous steel or precious metals using a ceramic, clay graphite or silicon carbide crucible. Standard Features Heavy duty, high conductivity coil custom designed to match most existing power supplies Direct power lead connection eliminates
- Configuration: Top Loading
- Process Temperature: 786 to 3221 F
- Controller Type: Single Set Point
Thin Film Materials - Nonferrous Metals and Alloys,Refractory and Reactive Metals,Tungsten and Tungsten Alloys -- Plasma Spray NozzlesSupplier: PLANSEE SE
Description: nozzles ensure optimum heat transfer and are able to withstand even the most extreme mechanical stresses. Optimum materials properties. Long service life. Thanks to its high melting point, tungsten ensures that even the high temperatures that occur at the particularly exposed tip cause no damageShow More
Description: Light weight table top furnace ideal for melting precious metals. Standard Features Furnace is designed for being able to pour while still under power to prevent "freezing" of metal in the crucible. For use with graphite or ceramic crucibles Includes a table-top glastic stand for holding
- Configuration: Other
- Process Temperature: 786 to 3221 F
- Controller Type: Single Set Point
Supplier: PLANSEE SE
Description: Stirrers are used to homogenize the glass melts. These must withstand extremely high temperatures and aggressive glass melts. Molybdenum from Plansee is the right material for these challenging conditions. Melting point of 2 620 °C (4 748 °F) Outstanding creep resistance High dimensionalShow More
Calorimeters and Thermal Analyzers - Test Bench for Determination of the Pyrometric Cone Equivalent (Refractoriness) - Pyrometric Cone Equivalent: PCE 428Supplier: NETZSCH-Gerätebau GmbH
Description: PCE 428 - Pyrometric Cone Equivalent Because of the heterogeneity of their composition and structure, ceramic refractories do not exhibit a uniform melting point. The refractoriness is characterized by the optical determination of the pyrometric cone equivalent (according to Seger), i.e.
- Thermal Analyzer Type: Other Analyzer
- Temperature Range: 68 to 3092 F
Supplier: Aremco Products, Inc.
Description: Low melting point adhesive systems for moderate-stress machining processes
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Electronics, OEM / Industrial, Photonics / Optoelectronics
- Chemical / Polymer System Type: Specialty / Other
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Top Seiko Co., Ltd.
Aluminum Nitride(ALN) processed components
microgrooves to increase the surface area of the AlN heaters, which is essential for effective heat removal. It is definitely a unique ceramic material that combines high electrical resistivity and high thermal conductivity. You can see more ALN product samples on the ALN page of our website. Properties of ALN (Alminum Nitride). Melting point. 2200 C. Thermal Shock Resistance. 400 C. Thermal conductivity. 170~200 W/(m.K). Thermal expansion coefficient. 2.4 x 106. Specific gravity (density). 3.3... (read more)
Browse Ceramic Fabrication Services Datasheets for Top Seiko Co., Ltd.
Chatham Components, Inc.
High Current Thermal Cutoffs - SEFUSE Brand
The SEFUSE brand thermal fuses are designed for high current applications. The SEFUSE is manufactured by NEC/ SCHOTT Components Corporation, Shiga, Japan. SEFUSE brand thermal fuses are non-resettable protectors attached to the heat generating section of electronic parts, motors, transformers circuits and other devices. The thermal element breaks the circuit when the thermal sensitive pellet liquefies when the temperature rises to the melting point of the thermal element. This allows a spring... (read more)
Browse Thermal Cutoffs and Thermal Fuses Datasheets for Chatham Components, Inc.
Saint-Gobain Coating Solutions
melting point even at up to 900 - 1000 F. Flow and creeps are virtually non-existent below its crystal-crystal transition temperature of 625 F. The reported mechanical properties of Ekonol were measured on samples, which were compression sintered at 800 F and 10,000 psi. Ekonol has excellent solvent resistance with the exception of concentrated sulfuric acid and strong alkalis. The water absorption rate is low at 0.4% after 500 hours at 212 F. Ekonol Polyester is self-lubricating and provides... (read more)
Browse Ceramic Powders and Precursors Datasheets for Saint-Gobain Coating Solutions
Conduct Research Top
High Contrast Fiber Laser Marking of Silicon Carbide
Silicon Carbide is a high temperature engineering ceramic that has impressive thermal properties; a high melting point, high thermal conductivity, high electric field breakdown strength and high maximum current density. Its properties have made it a prime candidate for use as a semiconductor
toughness, and tailorable properties. Also known as engineered ceramics, these materials are replacing metals in applications where reduced density and higher melting points can increase efficiency and speed of operation. The nature of the bond between ceramic particles helps differentiate engineering
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The high melting points of ceramic materials cause that the ceramics with a help of the powder technology are processed.
Sintering and joining of low temperature co-fired tungsten and aluminum oxide
…this chapter, several strategies for bonding W and A1203 will be examined at low firing temperatures, including conventional joining processes, as well as a class of new techniques concerned with the use of a low melting point ceramic additive, particularly Na2Si03,that…
Surface modification technologies V
1 We have coated graphite substrates with titanium carbide, an extremely hard (HV 20-30 GPa) high melting point ceramic material that is frequently applied to reduce wear.
Critical Issues for Producing UHTC-Brazed Joints: Wetting and Reactivity
They have been shown to occur, at the microscopic scale, in many systems at high temperature, even with high melting point ceramic materials and with systems which, at the macroscopic scale, are considered as non-reactive (Ref 78, 82, 97-102).
Handbook of Thin-Film Technology
In particular, with the process- ing of high melting point ceramic materials, the kinetic energy of the particles represents a de- termining factor in the case of collision with the substrate, and the film quality regarding adhesion and porosity.
Growth and Microstructure‐Dependent Hardness of Directionally Solidified WC –W 2 C Eutectoid Ceramics
Laser surface processing can be utilized to directionally solidify high melting point ceramic composites.11–14 Laser- .
Study on direct fabrication of ceramic shell mold with slurry-based ceramic laser fusion and ceramic laser sintering
Both processes are somewhat similar to SLS in the principle of using laser scanning to fabricate parts, but use slurry, which was composed of a structural material (high melting point ceramic powder) and an inorganic binder (low melting point ceramic powder).
Cell‐Assisted Deposition of Inorganic Coatings
At 500°–600°C the nanoparticles already developed enough bonding with the substrate to form a quite stable layer, even in the case of a high melting point ceramic material like YFSZ.
Preparation of mullite fibres by sol–gel processes using aluminium carboxylates and tetraethylorthosilicate
Conventionally, melt spin- ning methods are adopted for the synthesis of low melting point ceramic fibres.
Half-transient liquid phase diffusion welding: An approach for diffusion welding of SiCp /A356 with Cu interlayer
Liquid state production normally involves mixing high melting point ceramic particles into the liquid metal by properly stirring and subsequently casting the relatively mushy mixture.