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  • Electrodeposition and Surface Finishing
    where EΘ (A) and EΘ (B) are standard potentials of metals A and B, a activities of corresponding metal ions in the solution, and p and q numbers of electrons to be exchanged during the process of metal deposition .
  • Modern Electroplating 5th Edition
    It will be shown later that the limiting current density is of great practical importance in metal deposition since the type and quality of metal deposits depend on the relative values of the deposition current and the limiting current.
  • Fundamental Aspects of Electrometallurgy
    In the second part (Chapters 3–6) the mechanisms of metal deposition are discussed at a high scientific level although efforts were made to simplify them in an approachable way.
  • Modern Aspects of Electrochemistry
    Metal Deposition as a Class of its Own.....................195 (i) Redox Reactions...............................................195 (ii) Metal Deposition and Dissolution....................197 2.
  • Theory and Practice of Metal Electrodeposition
    The essential concepts in theoretical electrochemistry necessary for the investi- gation of metal deposition processes is provided here, including data that are com- monly absent in specialized academic courses.
  • Electrochemical Dictionary
    ...Harnisch F, Hummel A, Hasse U (2004) Electrochem Commun 6:929; [iv] Ivoševi´c N, Žuti´c V (1998) Langmuir 14:231; [v] Kovaˇc S, Svetliˇci´c V, Žuti´c V (1999) Colloids Surfaces 149:481; [vi] Raub E, Müller K (1967) Fundamentals of metal deposition .
  • Modern Aspects of Electrochemistry
    Fundamentals and contemporary applications of electroless metal deposition .
  • Handbook of Porous Silicon
    ...on the backside, either by ion implantation or by depositing a thin metal layer such as Al (for p-type wafers) and Au–Sb (for n-type wafers); mechanical abrasion of the backside of the wafer, before metal deposition , can often improve the...