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  • Particulate Removal from Process Furnace Exhaust (.pdf)
    This Ohio manufacturing company refurbishes Teflon coated baking trays by removing the teflon coating in a high temperature furnace. The process not only generates high levels of Hydrofluoric Acid but also particulates in the 5 micron size range.
  • Ionizing Wet Scrubber (IWS) Removes Both Acid Gas and Submicron Particulate (.pdf)
    A major company in the chemical process industry recently upgraded their liquid waste incinerator to a higher capacity. After reviewing current technologies, they chose Verantis' IWS TM pollution abatement system based on their previous successful experiences with this product. The same customer
  • HEV Venturi and Oilmaster TM Team Up to Eliminate Oily Graphite Particulate at Major Forging Facility
    NTN Driveshaft Inc. of Columbus, Indiana had a history of high maintenance costs with existing dry filters to control oil, dirt, smoke, and other particulates generated by the operation of their 2,000 ton presses. The NTN filter press process creates an oily translucent vapor containing a graphite
  • Organic Particulate Filtration
    A food products company that mixes various types of waxes and other components to make the base for chewing gums was faced with the issue of cleaning up a slightly odorous, visible emission being exhausted from two of their process lines.
  • Fans and Blowers for Combustion Process
    The burning of gas, oil, coal, or other combustible material requires air. When the end result of the burning is to be an efficient combustion process, in compliance with Federal and State Clean Air Act requirements, the volume of supply air must be reliably controlled. Insufficient air volume
  • MICRO: Process Equipment Control - Richardson (April 2000)
    The control of both metallic and particulate contamination during wafer processing has become increasingly critical as device geometries have continued to shrink. Minimizing contaminant levels in high-density polysilicon etch chambers is particularly important because the gate oxide is exposed
  • MICRO: Classifying defects for copper CMP process modules
    exposure to nanoscale particulate media (i.e., slurry), exposure to reaction and polish by-products, and interactions with previous process steps. CMP is one of the most critical operations in semiconductor fabrication because yield is extremely sensitive to CMP performance. CMP is used at
  • How to Maintain your Dust Collector
    The inception of the dust collector has allowed companies to effectively capture airborne particulate from an air stream. This has become more important for several reasons. First, containing particulate - toxic or not - is necessary to provide a healthy and clean work environment. Second

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