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  • Microporous Silica: Ultra Low Thermal Conductivity Boards (.pdf)
    Microporous Silica has the lowest thermal conductivity of any rigid board material for service up to 1000°C. Microporous Silica is excellent back-up insulation for high temperature kilns. The very low thermal conductivity of the material makes it possible to reduce the overall thickness
  • New advances in microparticle retention
    techniques over the past twenty years to meet this challenge. Retention and drainage aid programs have evolved from the use of a single flocculant or conventional coagulant-flocculant program to include the use of anionic microparticles based on bentonite clay or colloidal silica chemistry

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