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Educational and Training Software - Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots -- SPVC-TAL1
Description: The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder.
Supplier: Grainger Industrial Supply
Description: Bath And Shower Trim Kit, Without Rough In Valve, Handle Type Metal Lever, Handle Finish Chrome, Color/Finish Chrome Plated, Material of Construction Brass, Connection 1/2 Solder In, Max. Flow 2.5 GPM, ADA Compliant, Standards Shower Handle Control Meets ADA, Unit is CSA B-125, ASME A112.18.1M
- Applications: Commercial
- Material: Brass
Supplier: RS Components, Ltd.
Description: Product Category:Solder Bath
- Equipment Type: Soldering Equipment
- Brazing & Soldering: Hot Rod / Iron
Thermal Compounds and Thermal Interface Materials - Techspray Silicone Free Heat Sink Compound 4 oz Aerosol -- 1978-DPSupplier: Ellsworth Adhesives
Description: Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40C (-40F) to 200C (392F). Sold as a pack (24/pk).
- Form: Grease / Paste
- Cure Type / Technology: Specialty / Other
- Industry: Semiconductors / IC Packaging, Electronics
- Composition: Filled
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Parts by Number for Solder Bath Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|485||PLC Radwell||Hakko||Not Provided||SOLDER BATH|
|T0052704299||Allied Electronics, Inc.||APEX TOOL GROUP||Not Provided||Solder Bath, WSB150|
|T0052704099||Allied Electronics, Inc.||APEX TOOL GROUP||Not Provided||Solder Bath, WSB80|
|3615504||RS Components, Ltd.||Weller||Soldering, Workbench Accessories||Product Category:Solder Bath|
|2788291||RS Components, Ltd.||Ersa||Soldering, Workbench Accessories||Product Category:Solder Bath|
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Application Note - Effect of Solder Reflow on Secure(R) Adhesive
to simulated the bonding of an electronic printed circuit board to a heat sink. The assemblies are then subjected to solder reflow conditions by submerging them into a bath of molten solder at 288oC for 10 seconds. The high temperature of solder reflow and the mismatched coefficients of thermal
Using Inverter Technology in the Motor Fusing Industry (.pdf)
Commutator fusing was developed in the early 1950's as a method of manufacturing small universal or DC electric motors. The early process of attaching wires to the commutator required dipping the commutator into a solder bath, and hand soldering the connections. This two-step process was not only
Wave soldering is a widely applied mass soldering method for electronic boards. Wave soldering or flow soldering uses a molten solder bath with a traveling wave. Printed circuit boards are positioned so that the terminations just touch the solder wave avoiding excess solder on the PCB. Wave
Teccor Thyristor Surface Mount Soldering Recommendations (.pdf)
elements to enhance solderabil-. Vapor phase. ity). For more information, consult Du Pont's Thick-Film. zone. handbook or the factory. Heating. elements. It is best to prepare the substrate by either dipping it in a solder. bath or by screen printing a solder paste. Boiling liquid (primary medium). After
Surface Mount Technology (.pdf)
. XFIBWFQSPEVDFEBEJHJUBMNJDSPTDPQFUIBUQSPWJEFTBOTXFST. (7) Failure in plating on component leads. 14. *UIBTFWPMWFEGSPNBNBDIJOFUIBUTJNQMZPCTFSWFTUPBQBSU. OFSGPSUIFPCTFSWFS. II) Flow. 15. 1) PCB angle to solder bath. 15. 2) PCB design error. 17. 3) Temperature setting point. 17. III) Touch-up and Rework. 18. 1
Recommendations for Soldering Terminal Leads to MOV Varistor Discs (.pdf)
, but are not recom-. mends 1.1.1 trichloroethane for the. mended. removal of flux residues after soldering. Soldering Ovens. Box, convection, and conveyor belt ovens. RA - These fully activated fluxes are corro-. Defluxing in a solvent bath with ultrasonic. are suitable for reflow solder processes. sive
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
to rosin ratio. which refers to the acceptable barrel-fill. temperatures of the bottom or topside. Testing criteria: (see IPC J-STD-001 for details). Using. heaters, and localizing the nitrogen. a selective solder machine, one is able. and/or solder bath temperatures. With. Selective solder machines
Non-Destructive Analysis of Hazardous Substances in Electrical and Electronic Equipment
of multi-layer electronic. components. General materials testing. Analysis of Plating Bath Solutions. The lead content of solder pads and components can be. A printed circuit board scanned with a. accurately quantified. It is easy to distinguish an elevated. FISCHERSCOPE® X-RAY XDAL®. lead content
Engineering Web Search: Solder Bath Top
Solder - Wikipedia, the free encyclopedia
Solder From Wikipedia, the free encyclopedia
Xilinx XAPP427 Implementation and Solder Reflow Guidelines for...
Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee XAPP427 (v2.5) February 4, 2010 Summary
Solder bath analysis - Balver Zinn
Solder bath analysis Metallurgical investigations Solder bath analysis Balver Zinn offers Solder bath analyses free of charge for their customers.
:: Inde :: Weller WHP80 Heating Plate (80 Watt, 200°C)
Hot Guns, Solder Bath, Heat Plates Fume Extraction Systems Hot Guns, Solder Bath, Heat Plates Weller WHP80 Heating Plate (80 Watt, 200°C)
How to Work With Silver Solder
Home | Lifestyle | Home Repair & Maintenance | Soldering | How to Work With Silver Solder How to Work With Silver Solder by Nikki Cash
- AIM Solder - 14168 - Solder - Wire - Allied Electronics
FTR-K1 SERIES POWER RELAY 1 POLE - 5A/10A Medium Load Control...
Flow Solder condition: Pre-heating: maximum 120?C Soldering: dip within 5 sec. at 260?C solder bath Solder by Soldering Iron: Soldering Iron
IEEE Xplore - Lead-Free Solder Process Development
Browse Books & eBooks > Lead-Free Solder Process Devel...