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Parts by Number for Solder Mask Top

Part # Distributor Manufacturer Product Category Description
CM8I ASAP Semiconductor SOLDER MASK-CHEMASK 250M Not Provided Not Provided
862-150ML Digi-Key MG Chemicals Prototyping Products SOLDER MASK LATEX PEELABLE 5OZ
CLF8E ASAP Semiconductor Chemtron Not Provided SOLDER MASK, LEAD FREE, 236ML; Coating Type:Solder Mask; Coating
SPOT-ON PEELABLE SOLDER.RESIST Newark / element14 MULTICORE (SOLDER) Not Provided MULTICORE (SOLDER) - SPOT-ON PEELABLE SOLDER.RESIST - SOLDER MASK CHEMICAL COATING; 250ML
2211-8SQ ASAP Semiconductor Techspray Not Provided TECHSPRAY - 2211-8SQ - SOLDER MASK; BOTTLE; 8FL.OZ
SPOT-ON PEELABLE SOL ASAP Semiconductor Multicore Not Provided SOLDER RESIST, SPOT-ON, PEELABLE; Coating Type:Solder Mask; Disp
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Conduct Research Top

  • BBG Tech Tip #9: Solder Mask
    on to the PCB. The epoxy or non-. imageable masks are mainly used for lesser technology boards where design. tolerances are not so tight. Liquid photoimageable solder mask (LPI) is the. mask of choice in today's market of tight tolerances and dimensional controls. LPI can be either silkscreened, curtain-coated
  • Medical Device Link . Ensuring Solder Joint Integrity
    accommodate only very narrow solder dams, the areas between pads filled with solder mask, and solder wells, the areas surrounding the pads that are devoid of solder mask. Thus, accurate solder mask application and registration is more difficult. Also, as the pad width narrows, the allowable solder
  • Solder Powder: IPC
    Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so on. For this reason, I just spent an interesting couple of months leading a cross-industry (two solder paste suppliers and two
  • SMT Adhesive Dispensing (.pdf)
    The adhesive dispensing process, can be defined as the process of transferring adhesive onto the PCB solder mask in a position suitable for holding the later placed components until the PCB is wave soldered. In some cases, this process is also used to hold heavy components in the second pass
  • HumiSeal(R) 1B31S (.pdf)
    1B31S is a modified version of 1B31 with improved adhesion to solder masks. 1B31S is a fast air drying, single component, acrylic coating providing excellent moisture and environmental protection for printed circuit assemblies. The final film demonstrates excellent flexibility and is easily
  • Tech Tip #13: Panel Plating vs Pattern Plating
    , are to be plated with copper. Tin is then plated onto those areas to serve as an etch resist allowing the removal of unwanted copper prior to solder mask operation. PCB Tech Tips—Bare Board Group, Printed Circuit Board Manufacturer. PCB Manufacturing. History/Mission. Staff. Testimonials. Awards/Associations
  • M538: Surface Mounting Instructions - Footprint Guidelines
    and will also allow for just enough excess surface area for adequate solder filleting. The following recommended footprints are suggested guidelines only and may require ground plane modifications for electrical and/or thermal considerations. When an increase in ground plane size is necessary, solder mask
  • S2083: Surface Mounting Instructions for PQFN Packages
    . With the correct pad geometry, the package will self-align when subjected to a solder reflow process and will also allow for just enough excess surface area for adequate solder filleting. The solder mask should be applied over bare copper (SMOBC) to avoid solder reflow under the solder mask

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