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Logarithmic Slope:

mV/decade

Supply Voltage (VS):

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Supply Current (IS):

Operating Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

RoHS Compliant?

Package Type:

Pin Count:

Number of Devices in Package:

On-Chip ESD Protection?

Rail-to-Rail Output?

Rail-to-Rail Input?

Single Supply?

Thermal Shutdown Protection?

Current Limiter?

Complementary Outputs?

Help with Logarithmic Amplifier Chips specifications:

Performance
   Logarithmic Slope       The logarithmic slope is the scale or rate of the output voltage per decade. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Supply Voltage (VS)       Supply voltage (VS) refers to the source voltage range. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Supply Current (IS)       Source current (IS) is the current produced by the supply source when connected to the amplifier. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Temperature       Operating temperature is specified by level (minTypMax) of the ambient temperature (in °C) in which the amplifier was designed to operate 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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RoHS Compliant
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Package Characteristics
   Package Type       
   Your choices are...         
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. 
   DPAK       DPAK refers to a type of transistor outline package (T0-252). 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   SIP       SIP refers to a single inline package. 
   SOIC       SOIC refers to a small outline IC. 
   SSOP       SSOP refers to a shrink small outline package. 
   SOP       SOP is a small outline package. 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. 
   SOT       SOT packaging refers to a small outline transistor. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   PSOP       PSOP refers to a power small outline package. 
   QFP       QFP is a quad flat package. 
   TO-220       Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. 
   TO-3       Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. 
   TSSOP       TSSOP refers to thin shrink small outline L-leaded packages. 
   QSOP       QSOP refers to a quarter size outline package. 
   PLCC       PLCC refers to a plastic leaded carrier. 
   UCSP       UCSP refers to an ultra chip scale package. 
   Other       This refers to other unlisted, specialized, or proprietary packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Devices in Package       This refers to the number of devices in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Features
   On-Chip ESD Protection       The chip has embedded radiation protection. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Rail-to-Rail Output       The rail-to-rail output voltage swing is measured from the negative to the positive value of the supply voltage. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Rail-to-Rail Input       The rail-to-rail input voltage can vary from the negative to the positive value of the supply voltage. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Single Supply       The chip can operate with only one supply. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Thermal Shutdown Protection       The regulator has an embedded control circuit that shuts down the device when the temperature exceeds a predefined limit. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Current Limiter       The amplifier has an embedded current limiter. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Complementary Outputs       The device has at least two outputs that are complementary. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Texas Instruments High-Performance Analog
Texas Instruments High-Performance Analog