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Configuration:

Normal Condition:

Supply Voltage (VS):

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Max Ron:

Propagation Delay:

Min Operating Current:

Power Dissipation:

tON:

tOFF:

Operating Ambient Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Pin Count:

Number of Devices in Package:

Package Type:

Logic Family:

Bilateral Switch?

Fault-Tolerant Protection?

On-Chip ESD Protection?

Overcurrent Protection?

Radiation Tolerant?

Chip Enable?

Serial Input?

Single Supply?

ELV Directive?

RoHS Compliant?

Help with IC Analog Switches specifications:

General Specifications
   Configuration       
   Your choices are...         
   SPST       Single-pole, single-throw (SPST) switches make or break the connection of a single conductor in a single branch circuit. They usually have two terminals and are referred to as single-pole switches. 
   SPDT       Single-pole, double-throw (SPDT) switches make or break the connection of a single conductor with either of two other single conductors. They usually have three terminals and are commonly used in pairs. SPDT switches are sometimes called three-way switches. 
   DPST       Double-pole, single-throw (DPST) switches make or break the connection of two circuit conductors in a single branch circuit. They typically have four terminals. 
   DPDT       Double-pole, double-throw (DPDT) switches make or break the connection of two conductors to two separate circuits. They typically have six terminals and are available in both momentary and maintained contact versions. 
   SP3T       Single-pole, three-throw (SP3T) switches make or break the connection of a single conductor with either of four other single conductors. 
   SP4T       Single-pole, four-throw (SP4T) switches make or break the connection of a single conductor with either of four other single conductors. 
   Other       This refers to other unlisted types of configuration. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Normal Condition       
   Your choices are...         
   Normally Closed (NC)       Devices are normally closed (NC), meaning that the switch is in the closed condition when not energized.  
   Normally Open (NO)       Devices are normally open (NO), meaning that the switch is in the open condition when not energized. 
   Open/Close       When non-energized, the switch can be in either the closed condition or the open condition. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Performance
   Supply Voltage (VS)       Supply voltage (VS) refers to the source voltage range. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Max Ron       Max Ron is the maximum resistance across the contact when the switch is ON. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Propagation Delay       Propagation delay is the time interval between the application of an input signal and the occurrence of the corresponding output. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Min Operating Current       This is the minimum current needed for active chip operation. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Power Dissipation       Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatt. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   tON       This is the maximum time to turn on the switch. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   tOFF       This is the maximum time to turn off the switch. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Ambient Temperature:       This refers to the full-required range of ambient operating temperature. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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Package Characteristics
   Pin Count       Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Devices in Package       This refers to the number of devices in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Package Type       
   Your choices are...         
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. 
   DPAK       DPAK refers to a type of transistor outline package (T0-252). 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   SIP       SIP refers to a single inline package. 
   SOIC       SOIC refers to a small outline IC. 
   SSOP       SSOP refers to a shrink small outline package. 
   SOP       SOP is a small outline package. 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. 
   SOT       SOT packaging refers to a small outline transistor. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   PSOP       PSOP refers to a power small outline package. 
   QFP       QFP is a quad flat package. 
   TO-220       Transistor Outline is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. 
   TO-3       Transistor Outline is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. 
   TSSOP       TSSOP refers to thin shrink small outline L-leaded packages. 
   QSOP       QSOP refers to a quarter size outline package. 
   PLCC       PLCC refers to a plastic leaded carrier. 
   UCSP       UCSP refers to an ultra-chip scale package. 
   Other       This refers to other unlisted, specialized, or proprietary packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Logic Family       
   Your choices are...         
   TTL       Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL signals are defined as "low" or L when between 0 V and 0.8 V with respect to the ground terminal and "high" or H when between 2 V and 5 V. The first logic devices designed from bipolar transistors were referred to as standard TTL. The addition of Schottky diodes to the base collector of bipolar transistor was called Schottky logic (S-TTL). Schottky diodes shorten propagation delays within TTL by preventing the collector from going into what is called “deep saturation.”  Other TTL technologies include low-power Schottky (LS-TTL), advanced Schottky (AS-TTL), advanced low-power Schottky (ALS-TTL), and low-voltage TTL (LVTTL). 
   FAST       Fairchild Advanced Schottky TTL (FAST) technology was created in late 1970 when advances in IC technology allowed the speed and drive of S-TTL to be combined with the lower power of LS-TTL to form a new logic. An advanced related family is the FASTr, which is faster than FAST, has a higher driving capability (IOL, IOH), and produces much lower noise. The “r” in FASTr refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed. 
   Standard CMOS / CMOS (4000)       Complementary metal-oxide semiconductor (CMOS) logic uses a combination of p-type and n-type metal-oxide-semiconductor field effect transistors (MOSFET) to implement logic gates and other digital circuits found in computers, telecommunications, and signal processing equipment. It is the technology of choice for many present-day digital integrated circuits. CMOS 4000 refers to the series 4000 that is true CMOS with non-TTL levels. 
   FCT       Fast CMOS technology (FCT) was introduced in 1986. With this technology the speed gap between CMOS and TTL was closed. Since FCT is the CMOS version of FAST, it has the low power consumption of CMOS, but speed comparable with TTL. Advanced versions of the FCT standard are FCTx and FCTx-T. The x in FCTx and FCTx-T refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed. 
   High-Speed CMOS (HCMOS)       High-speed CMOS technology (HCMOS) is also known as HC / HCT. There are several basic flavors of HCMOS technology: high-speed CMOS (HC), high-speed CMOS with TTL input (HCT), advanced high-speed CMOS (AHC), and advanced high-speed CMOS with TTL inputs (AHCT). 
   Advanced CMOS       Advanced CMOS is a much higher speed version of HCMOS.  It is also known as AC / ACT.  Advanced CMOS technology comes in different flavors: standard advanced CMOS (AC), advanced CMOS with TTL inputs (ACT), advanced CMOS with quiet outputs (ACQ), advanced CMOS with TTL inputs and quiet outputs (ACTQ), advanced ultra-low voltage CMOS (AUC), advanced ultra-low power CMOS (AUP), advanced very-low voltage CMOS (AVC), advanced low voltage HCMOS (ALVC), and advanced low voltage CMOS with bus hold (ALVCH).  ACQ / ACTQ are second generation Advanced CMOS with much lower noise. While ACQ has the CMOS input level, ACQT is equipped with TTL level input. 
   Low Voltage CMOS       There are several low-voltage CMOS technologies: standard low voltage (LV), low-voltage high-performance HCMOS (LVC), low-voltage CMOS technology with TTL inputs (LVT), low-voltage with TTL inputs and high-impedance (LVTC), advanced low-voltage CMOS with bus hold (ALVCH), low-voltage CMOS that operates with 3 V or 5 V (LCX), and low-voltage CMOS that operates with 1.8 V or 3.6 V (VCX). 
   BiCMOS Technology       BiCMOS is a SiGe Bipolar technology that combines the high speed of bipolar TTL with the low power consumption of CMOS. There are a number of BiCMOS flavors including advanced BiCMOS technology (ABT), advanced BiCMOS technology with enhanced transceiver logic (ABTE), advanced low-voltage BiCMOS (ALB), advanced low-voltage BiCMOS technology (ALVT), BiCMOS with TTL inputs (BCT), BiCMOS with backplane and transceiver logic (BTL), and low-voltage BiCMOS technology (LVT). 
   ECL       Emitter coupled logic (ECL) uses transistors to steer current through gates that compute logical functions. By comparison, TTL and related families use transistors as digital switches, where the transistors are either cut off or saturated depending on the state of the circuit. This distinction explains ECL's chief advantage: that because the transistors are always in the active region, they can change state very rapidly. ECL circuits can operate at very high speed which can also be a disadvantage. When the transistors are continually drawing current, they require higher power and thus generate large amounts of waste heat.   ECL gates use differential amplifier configurations at the input stage. A bias configuration supplies a constant voltage at the midrange of the low and high logic levels to the differential amplifier. Then the appropriate logical function of the input voltages will control the amplifier and the base of the output transistor. The propagation time for this arrangement can be less than a nanosecond. Other noteworthy characteristics of the ECL family include little power-noise and negative power supplies. Since ECL circuits operate with negative power supplies, logic levels are incompatible with other families This means that interoperation between ECL and other designs are difficult.   
   Integrated Injection Logic (I2L)       Integrated injection logic (I2L) is based on bipolar transistor logic. It is commonly referred to as "I-square-L." 
   Silicon on Sapphire (SOS)       Silicon on sapphire (SOS) is a hetero-epitaxial process wherein a thin layer of silicon is “grown” on a sapphire (Al2O3) wafer. SOS is part of the silicon on insulator (SOI) family of CMOS technologies. SOS is primarily used in military and space applications because of its inherent resistance to radiation. It has seen little commercial use to date because of difficulties in fabricating the very small transistors used in modern high-density applications. Problematically, the SOS process often results in the formation of dislocations from crystal lattice disparities between the sapphire and silicon.  This leads to unusable wafers and drives up the production cost. 
   GaAs       Gallium arsenide (GaAs) is a compound semiconductor mixing the strength of two elements, gallium (Ga) and arsenic (As). Gallium is a byproduct of the smelting of other metals, notably aluminum and zinc, and is rarer than gold. Arsenic is not rare, but it is poisonous. Gallium arsenide has many uses including being used in some diodes, field-effect transistors (FETs), and integrated circuits (ICs). GaAs components are useful at ultra-high radio frequencies and in fast electronic switching applications. GaAs devices generate less noise than most other types of semiconductor components and, as a result, are useful in weak-signal amplification applications. Gallium arsenide is used in the manufacture of light-emitting diodes (LEDs), which are found in optical communications and control systems. Gallium arsenide can replace silicon in the manufacture of linear and digital ICs. Digital devices are used for electronic switching, and also in computer systems. 
   CBT       Cross-bar switch technology (CBT) enables a bus-interface to function as a very fast bus switch, isolating buses when the switch is open and offering very little delay when the switch is closed. Supplier: Texas Instruments. It is also knows as quick switch (QS), fast switch technology (FST), or Pericom Interface (PI5C). When the switch is open it provides circuit isolation (high impedance). When the switch is closed, it provides a near-zero propagation delay through a 5-Ohm resistance.  CBT devices operate 4.5 and 5.0 V. Bus switch technology is used in PLDs to provide a better performance to the device. There are many modalities in this technology, such as CBT with an internal Schottky diode (CBTS) that provides negative voltage undershoot protection for both input and output; series damping resistor option (CBTR) that includes an internal resistor to better terminate both inputs and outputs that connect to the transmission line for better signal integrity; low-voltage CBT (CBTLV) that features simple n-channel and p-channel MOS transistors optimized for 3.3 V operation while maintaining low propagation delays and low current supply; very low voltage bus switch (CBTV) that features simple n-channel and p-channel MOS transistors optimized for 2.5 V operation while maintaining low propagation delays and low current supply. 
   Gunning Technology       Gunning transceiver logic includes standard Gunning with transceiver logic (GTL) and Gunning with transceiver logic plus (GTLP). 
   Other       Other unlisted families. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Features
   Bilateral Switch       The switch allows signals to be transmitted in either direction. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Fault-Tolerant Protection       The device has protection for electrical faults. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   On-Chip ESD Protection       The chip has embedded protection against electrostatic discharge (ESD). 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Overcurrent Protection       The switch has circuitry for overcurrent protection. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Radiation Tolerant       The device is radiation tolerant. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Chip Enable       The chip can be enabled or disabled by applying a logic signal to the chip enable (CE) pin. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Serial Input       The device accepts a serial input. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Single Supply       The chip can operate with only one supply. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Standards and Certifications
   ELV Directive       End of Life Vehicles (ELV) Directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of July 1, 2003. Lead can still be used as an alloying additive in copper, steel, aluminum, and in solderable applications. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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