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Bus Interface / Output Type:

Package / Form Factor:

Supply Voltage:

Output Frequency:

Operating Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Features / Standards:

Help with IC Phase-locked Loops (PLLs) specifications:

General Specifications
   Bus Interface / Output Type       
   Your choices are...         
   CMOS       Complementary metal-oxide semiconductor (CMOS) is a low-power technology that can achieve high switching speeds. The voltage swing is 0 V to supply voltage. 
   HCMOS       High-speed complementary metal-oxide semiconductor (HCMOS) provides faster switching speeds than conventional CMOS. The voltage swing is 0 V to supply voltage. 
   ECL       Emitter coupled logic (ECL) is an extremely high-speed logic that consumes a great amount of power. ECL has a very small voltage swing, typically 0.8 V to -0.8 V. 
   PECL       Positive emitter coupled logic (PECL).  
   LVPECL       Low voltage positive emitter coupled logic (LVPECL). 
   HSTL       High speed transceiver logic (HSTL). 
   I2C       The inter-integrated circuit (I2C) bus is a two-wire, low-to-medium speed, communication bus. 
   LVDS       Low voltage differential signaling (LVDS) is the TIA/EIA-644A specification for high-speed transmission over twisted copper cables. TIA/EIA-644A is a specification from the Telecommunications Industry Association (TIA) and the Electronic Industries Association (EIA). 
   Parallel       Parallel interface. 
   SPI       Serial peripheral interface bus (SPI) is a synchronous full duplex bus. 
   SSTL       Stub series terminated logic (SSTL). 
   TTL       Transistor-transistor logic (TTL) is a common type of digital circuit in which the output is derived from two transistors. 
   Sine Wave       The output is a sinusoidal wave. 
   Other       Other unlisted interfaces. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Package / Form Factor       
   Your choices are...         
   Surface Mount Technology (SMT)       Surface mount technology (SMT) adds components to a printed circuit board (PCB) by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux. With careful placement, SMT components on solder paste remain in position until elevated temperatures, usually from an infrared oven, melt the paste and solder the component leads to the PCB pads.   Industry-standard pick-and-place equipment can mount SMT components quickly, accurately, and cost-effectively. SMT is a widely used alternative to mounting processes that insert pins or terminals through holes and solder leads into place on the opposite side of the board. 
   Through Hole Technology (THT)       Through hole technology (THT) mounts components on a printed circuit board (PCB) by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board. 
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. 
   QFN       Quad flat non-leaded package (QFN). Also known as QFNL. 
   QSOP       Quarter small outline package (QSOP). 
   SOIC       Small outline integrated circuit (SOIC). 
   SOP       Small outline package (SOP). 
   SSOP       Shrink small outline package (SSOP). 
   TSSOP       Thin shrink small outline package (TSSOP). 
   Other       Other unspecified packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Performance
   Supply Voltage       The operating voltage of the device. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Output Frequency       The nominal value of the device frequency. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Temperature       The full-required range of ambient operating temperatures. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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Features / Standards
           
   Your choices are...         
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated, biphenyl, and polybrominated diphenyl ether. 
   Lead Free       Devices do not contain lead (Pb) in any form. The electronics industry is working to provide lead-free products in response to concerns about the environmental impact of using lead in solder finishes. These efforts are in response to both customer demands and government directives to decrease the amount of waste from consumer electronics. Officially, products that are lead free have less than 1000 ppm lead by weight. 
   Programmable       The frequency of the device can be selected and programmed by the user. 
   Military Standard       The device is suited for military applications. 
   WEEE Compliant       The Waste Electrical and Electronics Equipment Regulations (WEEE Regulations) is a European Parliament Directive with the aim of encouraging reuse, recycling, and recovery of electrical and electronic equipment, and to improve the environmental impact and performance of this equipment. This directive sets the requirements and criteria for the collection, treatment, recycling, and recovery of this equipment. It makes producers responsible for financing these activities, and retailers and distributors must provide means for consumers to return used or obsolete equipment without charge. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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