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Coating System Type:

Technology / Process:

PVD Processes:

CVD Processes:

Applications & Materials Processed:

Materials Processed (Deposit or Substrate):

Maximum Part Diameter / Width:

Integral Process Controller?

Metrology / Film Monitor?

Automated Loading?

Multiple Sources?

Gas Control Unit?

Vacuum / Pressure Range:

High Vacuum Pump Type:

Help with Thin Film Equipment specifications:

Coating System Type
           
   Your choices are...         
   Batch System (Single Chamber / Multiple Wafers)       Batch systems can pass several wafers or samples simultaneously through in a single process, usually in a single chamber.  An oxidation furnace is an example of a batch processing system.  Some batch systems also have the capability to apply several processes simultaneously. 
   Cluster Tool (Multi-Chamber / Single Wafer)       Cluster tools consist of multiple chambers for different processes.  The cluster tool usually has a central robot to feed multiple process chambers. Cluster tools are commonly used to perform multiple process steps on a series of single wafer or samples and therefore may improve process control and cycle time compared a batch processor. 
   Factory / Free Standing        Large, floor mounted vacuum deposition systems designed for high volume factory use or processing large components. 
   Laboratory / Benchtop       Small, bench top mounted vacuum deposition systems designed for low volume experimental or analytical applications.  Sputter coaters for SEM or TEM preparation would fall into this category. 
   Other       Other unlisted, specialized, or proprietary coater or vacuum system type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Technology / Process
           
   Your choices are...         
   Chemical Vapor Deposition (CVD)       In chemical vapor deposition (CVD) processes, a precursor gas or mixture of gases is fed into a chamber and reacted with an energy source (usually heat) to form thin film coatings. CVD processes are useful in the deposition of dielectric films such as oxides and nitrides.  The energy or heat source may be a plasma, substrate induction, or resistance heater. 
   Physical Vapor Deposition (PVD)       Physical vapor deposition processes form thin film layers through evaporation or sputtering (glow discharge processes) of atoms from a source and then condensing or depositing the material onto the surface, substrate, wafer or part. 
   Ion Implantation       In an ion implantation process, a highly accelerated beam of charged atoms (ions) is directed at a surface resulting in the capture of some of these atoms in the surface of the substrate or wafer.  In microelectronics, ion implantation is used to dopant silicon with boron (B), phosphorus (P), arsenic (As) or antimony (Sb).  A subsequent annealing treatment or thermal cycle is required to drive the implanted ions into the surface.  Ion implantation can also be used to form wear resistance layer 
   Liquid Phase Deposition (ECD, Sol-Gel)       Thin film equipment using a liquid phase process such as sol-gel, electrochemical deposition, liquid phase epitaxy, electroless plating, electroplating or electrophoretic deposition. 
   Plasma Etching / Cleaning       Plasma ashing, plasma cleaning, sputter etching, sputter precleaning or ion milling are processes that use plasma to remove layers of material from a substrate or wafer for cleaning purposes.  A clean, contamination-free surface is required for subsequent thin film deposition or wet processing. 
   Rapid Thermal Processing (RTP)       In rapid thermal processing (RTP), silicon wafers are rapidly oxidized to form a silicon dioxide dielectric layer by a brief exposure to high temperature steam. 
   Vacuum Annealing       Extended thermal processing using a longer cycle or process time for oxidation, wafer annealing, head magnetic annealing or driving dopants into a substrate. 
   Combined / Multiple Processes       Thin film equipment having the capability of running substrates or wafers through several processes simultaneously or sequentially. 
   Other       Other unlisted, specialized, or proprietary process type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   PVD Processes       
   Your choices are...         
   Evaporation - Electron Beam       A PVD process using an electron beam to vaporize the material to be deposited on the substrate. 
   Evaporation - MBE / Epitaxial       Molecular beam epitaxy uses the evaporation of sources under ultra-high vacuum (UHV) conditions to form epitaxial deposit. 
   Evaporation - Resistance       A PVD process using resistance heating to vaporize the material to be deposited on the substrate. Passing current through the tungsten filament or element heats material on a tungsten filament or in a crucible surrounded by the resistance-heating element. 
   Sputtering - DC       A PVD process using plasma (glow-discharge) to ionize or knock (sputter) atoms off a target (source material) and deposit the positively charged ions on a substrate or wafer.  The DC power source results in metal target with a negative bias and a substrate with a positive bias causing unidirectional plasma current from the wafer to the target. 
   Sputtering - DC Pulsed       Pulsed sputtering is a DC sputtering process where the power source is pulsed. 
   Sputtering - RF       A PVD process using plasma (glow-discharge) to ionize or knock (sputter) atoms off a target (source material) and deposit the positively charged ions on a substrate or wafer.  The high frequency, alternating current (AC) or radio frequency (RF) power source can provide a forward (positive) or reverse (negative) bias.  In DC sputtering, only positive sputtering occurs.  The negative sputtering or is useful for sputtering cleaning or ion milling of the substrate prior to deposition. 
   Other       Other unlisted, specialized, or proprietary PVD processes. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   CVD Processes       
   Your choices are...         
   APCVD (Atmospheric Pressure)       Chemical vapor deposition process running under atmospheric pressures. 
   LPCVD (Low Pressure)       Chemical vapor deposition process running under low or sub-atmospheric pressures. 
   MOCVD (Metal Organic)       Metal organic chemical vapor deposition process has the capability to deposit epitaxial films. 
   PECVD (Plasma Enhanced)       Chemical vapor deposition process where reactions are enhance through the development of a plasma energy source. 
   PHCVD (Photon / Laser Enhanced)       Chemical vapor deposition process where reactions are enhance through the photon or laser energy source. 
   Other       Other unlisted, specialized, or proprietary CVD processes. 
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Applications & Materials Processed
           
   Your choices are...         
   Semiconductor Manufacturing       Systems used in the manufacture of semiconductor materials or in the processing of semiconductor wafers into microelectronic components. 
   Flat Panel Display       Equipment for processing flat panel displays. 
   Cutting Tools / Wear Components       Equipment for deposition of thin films or the modification of surfaces to enhance wear resistance.  A common example is the formation of titanium nitride films on cutting tools. 
   Decorative / Shielding       Systems designed to apply coating onto plastics, glass or other materials for decorative or electromagnetic shielding functions. 
   Optical Coatings       Equipment for deposition of thin films on lens, fiber or mirrors or other optical components.  The films can be used to alter reflectivity, refractive index or other properties. 
   Photovoltaic / Solar       Systems designed for the production of photovoltaic or solar cells using silicon or other semiconducting materials. 
   Magnetic Storage       Systems for coating or processing magnetic storage products or components. 
   Medical       Systems used to provide coatings implants or prostheses, medical devices and surgical tools to enhance compatibility or functionality in medical applications. 
   MEMS       Systems designed for manufacturing microelectromechanical (MEMS) devices, sensors and components. 
   Nanomaterials       Systems designed for research or production of materials structures or electronic circuits in the nanometer (10-9 meter) range. The products may consist of films, fibers, nanotubes or powders. 
   Research / Surface Analysis       Systems for coating samples for observation in an electron microscope or other analytical units.  Metallization or a thin film metallic or carbon coating provides a conductive layer for charge dissipation.  Also, specialized systems for the fabrication of advanced coatings and nanomaterials. 
   Other       Other unlisted, specialized, or proprietary applications. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Materials Processed (Deposit or Substrate):       
   Your choices are...         
   Metal       Systems that can deposit metal films. 
   Dielectric / Ceramic       Systems used for the deposition of dielectric or insulating layers of oxides, silicides or nitrides as well as other inorganic compounds, glasses or other ceramics. 
   Aluminum       Systems for deposition of aluminum for microelectronic conductors or interconnects, reflectors or other commercial applications. 
   Silicon       Systems for deposition of epitaxial, amorphous or polycrystalline silicon. 
   Diamond-like Carbon (DLC)       Systems capable of producing deposits of carbon with hardness or other properties approaching those of diamond. 
   Dopants       Ion implanters or other system used to deposit, implant or drive in dopants such as boron (B), phosphorus (P), arsenic (As), gallium (Ga) or antimony (Sb).  
   Germanium       Systems capable of depositing germanium. 
   Silicides       Systems capable of depositing silicides. 
   Compound Semiconductors / GaAs       Common compound semiconductors include gallium arsenide, aluminum gallium arsenide and indium gallium phosphide. 
   Nitrides / TiN       CVD or other systems capable of depositing nitrides such as titanium nitride or silicon nitride. 
   Oxides       Systems capable of depositing oxides such as silicon dioxide. 
   Polymer / Organic       Organic or polymer films can be deposited from precursor chemicals. Plasma enhanced chemical vapor deposition is often used in depositing polymer films. 
   Tungsten / Refractory Metal       Systems capable of depositing tungsten or other refractory metals for microelectronic conductors or interconnects or other commercial applications. 
   Other       Other unlisted, specialized, or proprietary material. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Specifications & Features
   Maximum Part Diameter / Width:       Maximum wafer or part diameter that can be processed in through the thin film system.  On continuous systems the maximum web width or wire diameter. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Integral Process Controller?       Integral or optional system to monitor or control process parameters such as temperature, power or deposition rate. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Metrology / Film Monitor?       Examples of metrology include units or chambers for surface analysis and in-situ process sensors such as a quartz sensor for film thickness monitor. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Automated Loading?       System has the capable to automatically load samples into the vacuum system or chamber for processing.  System capable of coating continuous products such as fiber, wire, or webs would also fit into this category. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Multiple Sources?       Coating system that can deposit multiple materials sources either simultaneously or sequentially within the run cycle.  The systems may have a turnstile containing several different sources or materials. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Gas Control Unit?       Integral or optional system to monitor or control gas flows, compositions and pressures. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Vacuum / Pressure Range:       
   Your choices are...         
   Rough / Low (< 760, > 1 torr)         
   Medium (< 1, >10-3 torr)         
   High Vacuum (< 10-3, >10-8 torr)         
   Ultra-high Vacuum (< 10-8 torr)         
   Elevated Pressures (> 760 torr)         
   Other         
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   High Vacuum Pump Type:       
   Your choices are...         
   Turbomolecular       Turbomolecular pumps utilize a series of high-speed rotors (25,000 to 75,000 rpm) and flow stabilizing, stationary stators to impart a preferential motion to gas molecules and create molecular flow through the pump.  They are often described as "molecular bats."  They are also known as axial flow turbines. 
   Molecular Drag       Molecular drag pump are similar to turbomolecular pumps except a rotor drum with a ridged surface and cylindrical stator are utilized in place of stator and rotor blades to impart a preferential motion to gas molecules and create molecular flow through the pump.  Hybrid pumps are available that use combinations of blades and ridged drums. 
   Diffusion / Vapor       Diffusion pumps utilize jets of diffusion oil vapor to impart momentum and sweep gas molecules from the system. Diffusion pumps have no moving parts and provide the highest pumping speed for lighter gases like helium and hydrogen. Diffusion pump oil can wander or backstream into the system causing process contamination. 
   Ion       Ion pumps utilize a sputtering process to ionize then entrain gas molecules and embed them into the anode or cathode wall.  The entrainment process can utilize a getter such as titanium to bind and bury the molecules.  They can operate in the ultra high vacuum range and eliminate contamination by organic molecules. 
   Cryogenic / Cryosorption       Cryogenic pumps utilize extremely cold (liquid N2 and He temperatures) surfaces and absorption surfaces freeze or trap molecules. Cryogenic pumps can operate with relatively high fore or exhaust pressures. Cryogenic pumps must be periodically generated to purge the frozen or trapped gases. Cryosorption pumps evacuate gas molecules from a volume by adsorbing them on the chilled surface of a molecular sieve. These molecular sieves are designed to have a large surface area-to-volume ratio to maximize the adsorbing area. 
   Getter / TSP / NEG Sorption       Getter or titanium sublimation pumps (TSP) entrain gas molecules in a getter, or material that is vaporized in order to absorb or capture the molecules, and embed them on the cold outer wall of the chamber.  These may also use "non-evaporating Gettering sorption" techniques by utilizing a large-surface-area porous matrix for entrainment. 
   Other       Any unlisted, specialized, or proprietary high vacuum pump. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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