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Substrate / Material Compatibility:

Dissimilar Substrates?

Chemical / Polymer System Type:

Filled / Reinforced?

Solvent Based (Volatile Organic)?

Water Based / Latex Dispersion?

Features:

Industry:

Applied Thickness / Gap Fill:

Viscosity:

Use Temperature:

Thermal Conductivity:

Coeff. of Thermal Expansion (CTE):

Tensile Strength (Break):

Elongation:

%

Dielectric Strength:

Dielectric Constant (Relative Permittivity):

Index of Refraction:

Transmission:

%

Help with Thermoset Adhesives specifications:

Substrate / Material Compatibility
           
   Your choices are...         
   Ceramic / Glass       Ceramics consist of oxides, carbides, nitrides, and other non-metals with high melting points. Ceramics are suitable for applications requiring wear resistance, thermal stability, and electrical resistivity. 
   Concrete / Masonry       Concrete and cements consist of a mixture of a binder or clinker and a coarser aggregate. They are used to patch or line floors and walls, bond brick, and join components for use in high-temperature applications. Clinker is a fused mineral or mineral mixture, such as alumina or bauxite and lime, which is crushed into a fine powder. Aggregates are coarser, granular materials that are added to mortar, grout, or cement at mixing time to impart special properties such as thermal stability, wear resistance and oxidation resistance. Synthetic aggregates are fused mineral or mineral mixtures crushed to a coarse, granular size range rather than a fine, powdered clinker. Portland cement is the most common bond used in structural concretes and mortars. Polymer cements have a resin bond and are used in corrosion protection, mortars for corrosion-resistant floor tiles, and other specialized industrial applications. Masonry consists of tile, bricks, stone, or other ceramic components that are bonded together with mortar or adhesive. 
   Composites       Composite materials consist of a resin (suitable for molding) and a matrix (typically fibers or textile material) which serves to enhance strength, alter electrical or magnetic properties, or enhance wear resistance. 
   Metal       Metals are opaque, fusible, ductile, and typically lustrous substances that are good conductors of heat and electricity. They form cations by the loss of electrons and yield basic oxides and hydroxides. Metals that are used in structural engineering applications have a high toughness that is a combination of high strength and ductility. 
   Paper / Paperboard       Paper or paperboard products are produced from a pulp of cellulose, cotton, wood, or other vegetable fibers. The pulp is laid down on a fine screen from a water suspension to form sheets that are dried and further processed. 
   Plastic       Plastics are organic, synthetic, or processed materials that are mostly thermoplastic or thermosetting polymers of high molecular weight. They can be made into objects, films or filaments. 
   Porous Surfaces       Substances are adhesives or sealants with a high viscosity or gel-like consistency. Typically, these materials have the ability to work with porous surfaces. 
   Rubber / Elastomer       Rubber and elastomers are characterized by a high degree of flexibility and elasticity (high reversible elongation). Natural or synthetic rubber is vulcanized to increase useful properties such as toughness and resistance to wear for use in tires, electrical insulation, and waterproof materials.  Vulcanization is a chemical treatment that adds sulfur and heat to crosslink the rubber. Natural rubber is an elastic substance that is obtained by coagulating the milky juice of any of various tropical plants. Essentially, natural rubber is a polymer of isoprene, and is prepared as sheets and then dried.  Synthetic rubbers or elastomers can be based on a variety of systems such as silicone, polyurethane or neoprene. 
   Textiles / Fabrics       Substances are adhesives or sealants suitable for coating, filling, sizing, or sealing non-woven or woven textiles. Sizing adhesives or resins are used to fill paper, textile webs, and other fibrous products. 
   Wood / Wood Product       Wood is a natural composite extracted from the stems, branches, and roots of trees. It is a hard, fibrous substance that consists of xylem, cellulose fibers in an amorphous, lignin polymer matrix. Lignin is a biogenetic cross linked polymer which bonds together adjacent cell walls into a straw or wood tissue composite. Cellulose is a polysaccharide (C6H10O5)x of glucose units that constitutes the chief part of the cell walls of plants. It occurs naturally in fibrous products such as cotton and kapok, and is the raw material of many manufactured goods as paper, rayon, and cellophane. 
   Other       Other unlisted, specialty, or proprietary substrates. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Dissimilar Substrates?       Adhesive or sealant systems can bond dissimilar substrates, such as metal to rubber.  
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Chemical / Polymer System Type
   Chemical / Polymer System Type       
   Your choices are...         
   Acrylic / Polyacrylate       Acrylics feature excellent environmental resistance and fast-setting times. Acrylic polymers are produced from acrylic acids via a catalytic reaction. 
   Ceramic / Inorganic Cement       Compounds or material systems are based on ceramic or inorganic cement systems. 
   Epoxy (EP)       Epoxy resins (EP) exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally-cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders or laminating resins in fiberglass or composite construction. They are also used as encapsulates, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications. 
   Phenolics / Formaldehyde Resins       Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that provide strong bonds and good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan, and melamine resins are all part of this category. Generally, the most durable phenolic resin adhesives are made from chemicals of the phenol group and formaldehyde. Phenolic resins come in liquid, powder, and film form. Special phenolic resins are available that harden at moderate temperatures when mixed with suitable accelerators. Phenol-formaldehyde, resorcinol-formaldehyde, resol, and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde, and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties.  Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up, and filament winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories, and other high-temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements. 
   Polyester / Vinyl Ester       Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins. 
   Polysulfide       Polymer resins or compounds are based on polysulfide or polyphenylene sulfide (PPS) chemical systems.  
   Polyurethane (PU, PUR)       Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. PUR resins require a catalyst, heat, or air evaporation to initiate and complete curing.  
   Silicone       Plastic compounds, elastomer resins, or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes. 
   Rubber Based / Elastomeric       Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation). Natural rubber, synthetic rubber, or elastomer sealants and adhesives can be based on a variety of systems such silicone, polyurethane, chloroprene, butyl, polybutadiene, isoprene, or neoprene. 
   Specialty / Other       Other specialty, proprietary or unlisted resins, chemical systems or compound or polymer types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Filled / Reinforced?       Filled compounds consist of adhesives with additional modifiers such as pigments or chopped fiber reinforcements. Typically, filled compounds are ready-to-use. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Solvent Based (Volatile Organic)?       Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or a risk of explosion, depending on the plant or job site. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Water Based / Latex Dispersion?       Water-based or water-borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Features & Industry
   Features       
   Your choices are...         
   Thermal Compound / Interface (Thermally Conductive)       Materials are designed to form a thermally conductive layer on the substrate, between components, or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulates, potting compounds, tapes, pads, adhesives and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation. 
   Thermal Insulation / Heat Insulating       Thermally insulating resins, plastics, compounds and encapsulates provide a thermal barrier between components and a hot or cold source. 
   Thread Locker / Retainer       Threadlocking or threadlocker adhesives bind threads that are subject to transverse and axial loads against vibrational loosening. They reduce production costs and improve reliability by eliminating lock washers and other expensive locking devices. Threadlockers also preserve on-torque and distribute the load over the entire engagement length of a fastener, effectively eliminating premature material fatigue and fastener failure. 
   UL Approved       The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL). 
   Anti-static / ESD Control       Anti-static materials have relatively high electrical conductivity or low electrical resistivity. They are used in electronic, anti-static or electrostatic discharge (ESD) applications. 
   Caulk / Grout       Caulks, grouts and joint compounds have a sufficiently low viscosity that allows them to be pumped into joints or cracks for sealing or repair. Caulk typically consists of a flexible material. Grouts are usually based on thin-set inorganic mortars.  Polymer or resin binder-based grouts are also available. 
   Electrically Conductive Compound (Adhesive, Grease)       Resins or compounds with a high degree of electrical conductivity (low resistivity) are used in applications such as anti-static or ESD control, EMI / RFI shielding, thick-film metallization, and device and board-level electrical interconnection. 
   Electrical Insulation / Dielectric Material       Dielectric compounds and electrical insulation materials form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components influence material selection, based on the dielectric strength to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths. 
   EMI / RFI Shielding Material       Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity. 
   Encapsulanting / Potting       Encapsulates and potting compounds are resins used to encapsulate circuit boards or semiconductor devices, fill a container of electronic devices, or infiltrate electrical coils to provide environmental protection and electrical insulation. Ceramic cement-based potting compounds are available for high-temperature applications. 
   Flame Retardant (e.g. UL 94 Rated)       The material is flame retardant in accordance with industry standards from Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. Flame-retardant materials are designed to reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to it. 
   Flexible / Dampening       Products are designed to provide flexibility or dampening of sound, vibration, or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating. 
   Laminating / Composites       Products are designed for constructing laminating strip structures or SCRIMP matrix resins for composite construction. SCRIMP is an acronym for "Seeman composites resin infusion molding process". 
   Leveling / Filling Compound       Leveling compounds, gap fillers, chocking materials, and mastics are highly viscous materials that are applied by trowel to give thick glue lines, usually with gap-sealing properties. Chocks, chocking, and floor-leveling compounds are used during the installation of heavy equipment or machine bases. Chocking or leveling compounds allow machines to be installed level or plumb, and can be used in place of metal or plastic shims or shim stock. Mastics are used to fill gaps or irregularities in a surface before tile or other materials are applied. Mastics are also used to bond tiles to sub-flooring. Repair compounds or gap fillers are used to fill gaps or repair cavities or holes in a part, casting, or structure.  Typically, these compounds may also be used as adhesives or sealants, or have sealing or bonding characteristics. 
   Non-corrosive Cure       Silicone or reactive systems use a non-corrosive cure system such as a metal or oxime catalyst. 
   Phase Change       Thermal interface materials use a phase change to enhance thermal characteristics or heat absorption from electronic devices or electrical components. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Industry:       
   Your choices are...         
   Aerospace       Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components. 
   Automotive       Products are designed for automotive applications. For example, they can be used to bond panels and seal windows. 
   Electronics       Products are designed for use in electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants. 
   Electrical Power / HV       Products are resins, compounds, and plastic composites that are suitable for electrical power or high voltage (HV) applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation. 
   Marine       Products are designed for marine applications. They can be immersed in water and can withstand exposure to marine atmospheres. 
   Medical / Food (Sanitary / FDA)       Products are suitable for medical or food-contact applications. Typically, they they comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI. 
   Military / Government (MIL-SPEC / GG)       Products adhere to U.S. military specifications (MIL-SPEC). 
   OEM / Industrial       Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing, or fabrication of products. 
   Optical Grade / Material       Polymers or elastomers are designed for optical or photonics applications. Examples include transparent polycarbonate or acrylic lens materials. 
   Photonics / Optoelectronics       Products are designed for optoelectronics or photonics applications. Examples include cements for bonding simple lenses into compound structures. 
   Semiconductors / IC Packaging       Products are designed or are suitable for semiconductor or semiconductor packaging applications. 
   Building / Construction       Products are designed for use by construction contractors and in maintenance, repair, and operation (MRO) applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam), and bitumen-based roofing materials.  
   Tooling / Mold Material       Products are designed for tooling or mold fabrication such as polyurethane shapes or castable silicones. 
   Other       Other unlisted industries. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Processing & Physical Properties
   Applied Thickness / Gap Fill       Products are applied at a particular functional surface thickness  or between two surfaces (the 'gap fill' thickness) to ensure performance criteria, such as strength, electrical resistance, etc., are met. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Viscosity       Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold.    
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Thermal Properties
   Use Temperature       Use temperature is the range of temperatures a product can be exposed to without the degradation of structural or other required end-use properties. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Thermal Conductivity       Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)] 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Coeff. of Thermal Expansion (CTE)       Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Mechanical Properties
   Tensile Strength (Break)       Tensile strength at break is the maximum amount of stress required to break the material under tension-loading test conditions, or to cause failure. Typically, tensile tests are performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards.  
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Elongation       Elongation is the amount of deformation as a percentage that occurs during a tensile test or other mechanical test. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Electrical & Optical Properties
   Dielectric Strength       Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Dielectric Constant (Relative Permittivity)       The dielectric constant is the relative permittivity of a material compared to a vacuum or free space.  As an equation, it is expressed as k = εr = ε / εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m.  
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Index of Refraction       The index of refraction is a measure of the speed of light in a material. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Transmission       This is the amount of light transmitted through a material. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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