Help with Diacs specifications:
Performance
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| ITRM | ITRM is the repetitive peak on state current. This is the maximum current for which the device is rated and includes all of the repetitive currents. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| VO | VO is the output voltage of the device in the off state. It is the voltage across a 20 ohm resistor in series with the device during the discharge of a specified capacitor. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| VBO | VBO is the breakover voltage measured between the terminals when the device switches on. It is the voltage at which a device begins to conduct. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Breakover voltage symmetry (ΔVBO) | The breakover voltage symmetry (ΔVBO) is the maximum breakover voltage range around the nominal breakover voltage with a specified capacitance connected in parallel with the device. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| IBO | IBO is the breakover current. This is the level (min/max) of the direct voltage at the breakover point, which is where the differential resistance is zero and the principal voltage has reached a maximum value at a specified rate of rise of off state volt. It is the instantaneous current flowing at the breakover voltage (VBO). | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Pd | Pd is the power dissipated by the device while in the on-state. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| TJ | Temperature junction (TJ) is the full-required range of ambient operating temperatures. | ||
| Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
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Standards and Certifications
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| RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| ELV Directive | End of Life Vehicles (ELV) is an EU directive that required certain automotive products to be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum, and in solderable applications. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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Packaging Specifications
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| IC Package Type | |||
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| DIP / CDIP / PDIP | Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. | ||
| DPAK | Discrete package or deca-watt (DPAK). | ||
| D2PAK | D2PAK is large surface mounted package that include a heat sink. | ||
| DO-15 | DO-15 is a diode outline (DO) package. | ||
| DO-35 | DO-35 is a diode outline (DO) package. | ||
| IPAK | Integrated package (IPAK). | ||
| I2PAK | I2PAK is a plastic package with three leads. | ||
| PPAK | Power packaging (PPAK). | ||
| MELF | Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel. | ||
| TO-3 | TO-3 is a transistor outline (TO) package with three leads. | ||
| TO-3P | TO-3P is a transistor outline (TO) package with three leads. | ||
| TO-39 | TO-39 is a transistor outline (TO) package. | ||
| SOT3 | SOT3 is a small outline transistor (SOT) package. | ||
| SOT223 | SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink. | ||
| TO-92 | TO-92 is a transistor outline (TO) package. | ||
| TO-202 | TO-202 is a transistor outline (TO) package. | ||
| TO-220 | TO-220 is a transistor outline (TO) package. | ||
| TSOP | Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. | ||
| TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
| TSOJ | Thin small outline J-leaded package (TSOJ). | ||
| Other | Other unlisted, specialized or proprietary packages. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Pin Count | The number of physical connection points (e.g., pins, pads, balls) on the package. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Number of Diacs in Package | The number of diodes embedded in the chip (package). | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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