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Transistor Type / Technology:

Polarity:

Transistor Grade / Operating Range:

Package Type:

Packing Method:

Number of Transistors in the Chip:

TJ:

Power Gain:

dB

Output Power:

Noise Figure:

dB

Operating Frequency:

Help with RF Transistors specifications:

General Specifications
   Transistor Type / Technology       
   Your choices are...         
   Bipolar RF Transistors       RF bipolar junction transistors (BJTs) are designed to handle high power RF signals, such as signals found in stereo amplifiers, radio transmitters, TV monitors, etc. Bipolar transistors come in a wide variety of physical packages. Package type is primarily dependent upon the power dissipation of the transistor, much like resistors: the greater the maximum power dissipation, the larger the device has to be to stay cool. There are several standardized package types for three-terminal semiconductor devices, any of which may be used to house a bipolar transistor. This is an important fact to consider: there are many other semiconductor devices other than bipolar transistors, which have three connection points. It is impossible to positively identify a three-terminal semiconductor device without referencing the part number printed on it, and/or subjecting it to a set of electrical tests. 
   MOSFET RF Transistors       RF MOSFET transistors are designed to handle high power RF signals, such as signals found in stereo amplifiers, radio transmitters, TV monitors, etc. 
   HFET       Heterojunction field-effect transistors (HFET). 
   PHEMT       Pseudomorphic high electron mobility transistor (PHEMT) technology. 
   Other       Other unlisted transistor type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Polarity       
   Your choices are...         
   NPN       A physical BJT transistor arrangement where the emitter and the collector are made of N-type material and the base of P-type. 
   PNP       A physical BJT transistor arrangement where the emitter and the collector are made of P-type material and the base of N-type. 
   N-Channel       A field-effect transistor with the channel made of N-type material. 
   P-Channel       A field-effect transistor with the channel made of P-type material. 
   Complementary         
   Other       Other unlisted polarity type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Transistor Grade / Operating Range      The field in which the transistor will operate.
   Your choices are...         
   Commercial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications. 
   Industrial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications. 
   Military       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications. 
   Automotive       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for automotive applications. 
   Other       Other unlisted screening levels. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Packaging Characteristics
   Package Type       
   Your choices are...         
   TO-3       TO-3 is a transistor outline (TO) package. 
   TO-8       TO-8 is a transistor outline (TO) package. 
   TO-39       TO-39 is a transistor outline (TO) package. 
   TO-92       TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment. 
   TO-202       TO-202 is a transistor outline (TO) package. 
   TO-220       TO-220 is a transistor outline (TO) package that is suitable for high power, medium current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies. 
   TO-223       TO-223 is a transistor outline (TO) package. 
   TO-237       TO-237 is a transistor outline (TO) package. 
   TO-247       TO-247 is a large, through-hole, transistor outline (TO) package. TO-247 provides excellent power dissipation and is ideal for metal oxide semiconductor field effect transistors (MOSFETs), high power bipolar transistors, and insulated gate bipolar transistors (IGBTs). 
   TO-263       TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers. 
   SO-8       SO-8 is a small outline (SO) package. 
   SOT3       SOT3 is a small outline transistor (SOT) package with three leads. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   SOT25       SOT25 is a surface mounted, small outline transistor (SOT) package with three leads.  
   SOT26       SOT26 is a plastic, surface mounted, small outline transistor (SOT) package with three leads.  
   SOT82       SOT82 is a rectangular, surface mounted, small outline transistor (SOT) package with three leads. SOT82 is larger than DPAK and smaller than TO-220, but still comparable to TO-220 in performance. SOT82 lead frames are available in full nickel or selective silver plating and allow wire bonding with gold or aluminum wire. Often, SOT82 is used in over-voltage protection devices in telecommunications equipment. SOT82 is also used to package high power rectifiers, DC to AC converters (DACs) and frequency converters. 
   SOT89       SOT89 is a plastic, surface mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL). 
   SOT123       SOT123 is a flanged, ceramic, surface mounted, small outline transistor (SOT) package with two mounting holes and four leads.  
   SOT143       SOT143 is a plastic, surface mounted, small outline transistor (SOT) package with four leads. 
   SOT223       SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink. During soldering, the formed leads absorb thermal stress and eliminate the possibility of damage to the die. The encapsulation material enhances device reliability, allowing SOT223 to provide excellent performance in environments with high temperatures and humidity levels. SOT223 provides power dissipation of 1W ~ 1.5W. 
   SOT323       SOT323 is a plastic, surface mounted, small outline transistor (SOT) package with three leads. 
   TO-251 / TO-252       TO-251 and TO-252 are low to medium power packages that feature a transistor outline (TO). TO-251 uses through-hole technology (THT). TO-252 uses surface mount technology (SMT). Both packages provide several lead frame choices and are commonly used in home appliances, personal computers, lighting, and automotive systems.     
   FPAK       Flat package (FPAK). 
   Other       Other unlisted or proprietary packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Packing Method       
   Your choices are...         
   Tape Reel       Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP). 
   Rail       This is a method of packaging IC chips for production environments. 
   Bulk Pack       Components are distributed as individual parts. 
   Tray       Components are packed in trays that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks. 
   Shipping Tube / Stick Magazine       Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.  To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type. 
   Other       Other unlisted, specialized or proprietary packing methods. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Number of Transistors in the Chip       The number of independent units in the chip (package). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Performance
   TJ       This is the full-required range of ambient operating temperature of the junction. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Power Gain       The measure of the power amplification produced by the transistor. It is generally measured in dB (of the ratio of the output power to the input power). 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Output Power       The amount of output power (generally measured in watts) produced by the transistor. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Noise Figure       The noise figure (NF) is the ratio (in dB) of the signal-to-noise ratio at the input of the component and the signal-to-noise ratio measured at the output.  It is a measure of the amount of noise added to the signal during normal operation.  A low noise figure means better performance. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Operating Frequency       The frequency range through which the transistor will meet all expected specifications. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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