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Type / Topology:

VREF Type:

IC Package Type:

Life Cycle Stage:

Reference Voltage (VREF):

Initial Accuracy:

%

Temperature Coefficient (TC):

ppm/C

Supply Current (IQ):

Input Voltage (VIN):

Operating Temperature:

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Help with Voltage Reference Chips specifications:

General Specifications
   Type / Topology       
   Your choices are...         
   Shunt / Zener       Shunt references operate in parallel with the load. The most common types of two-terminal shunt reference are based on the Zener principle, in which the current in a reverse-biased diode begins to flow at a certain voltage threshold and then increases dramatically with an increase in voltage. Resistors in series with the diode establish a constant current, allowing the Zener to achieve a stable reference voltage.  The Zener reference behaves like a typical shunt or two-terminal reference. 
   Series / Buried-Zener       Subsurface or "buried" Zener references are more stable and accurate than the simple Zener-reference. They consist of diodes with the correct value of reverse-breakdown voltage, formed below the surface level of the integrated-circuit chip; then covered by a protective diffusion to keep the breakdown below the surface.  At the surface of a silicon chip there are more impurities, mechanical stresses and crystal-lattice dislocations than within the chip. Since these contribute to noise and long-term instability, the buried breakdown diode is less noisy and much more stable than surface Zeners. This is the preferred on-chip reference source for accurate IC devices.  However, its breakdown voltage is normally about 5 V or more and it must draw several hundred microamperes for optimum operation, so the technique is not suitable for references that must run from low voltage and have low power consumption. For such applications, the “bandgap” reference is preferred. 
   Series / Bandgap       Series references operate in series with the load. They are typically three-terminal devices.  The two most important three-terminal-series references are the buried-zener and bandgap types. The bandgap reference compensates the effect of temperature by subtracting the negative-temperature coefficient voltage of a forward-biased base-emitter junction from a positive-temperature-coefficient proportional-to-absolute temperature (PTAT) voltage. It develops a voltage with a positive temperature coefficient to compensate for the negative temperature coefficient of a transistor’s Vbe, maintaining a constant “bandgap” voltage. Measuring and amplifying the voltage difference between two forward-biased diode junctions generates the PTAT voltage. 
   Other       Other unlisted or proprietary operating mode, such as digitally controlled references. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   VREF Type       
   Your choices are...         
   Fixed       The device produces a fixed reference voltage. 
   Programmable / Adjustable       The device can be programmed (adjusted) to provide output within certain range. 
   Other       Other unlisted reference voltage types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   IC Package Type       
   Your choices are...         
   DIP / CDIP / PDIP       Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. 
   DPAK (TO-252)       Discrete packaging (DPAK). 
   PPAK       Plastic packaging (PPAK). 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. 
   SO-8       Packages have a small outline (SO) with 8 pins. 
   SO-14       Packages have a small outline (SO) with 14 pins. 
   SO-20       Packages have a small outline (SO) with 20 pins. 
   SSOP       Shrink small outline package (SSOP). 
   SOIC / SOP       Small outline integrated circuit (SOIC). Small outline package (SOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   SOT89       SOT89 is a plastic, surface mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL). 
   TO-3       TO-3 is a transistor outline (TO) package with three leads. 
   TO-39       TO-39 is a transistor outline (TO) package. 
   TO-92       TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment. 
   TO-220       TO-220 is a transistor outline (TO) package that is suitable for high power, medium current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies. 
   TO-263       TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers. 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Life Cycle Stage      This is the current product lifecycle stage, as defined by EIA-724.
   Your choices are...         
   Introduction       Product planning or design is underway. Samples may or may not exist. Specification changes may occur and planned introduction dates may be delayed. Orders and product shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model. 
   New Product       Production is beginning to ramp up. Limited quantities are available. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model. 
   Rapid Growth       Production is increasing rapidly. Manufacturing capacity is being added. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model. 
   Maturity       Product growth has stabilized or peaked. Product quality is very high. Orders and shipments are permitted. Product is recommended for use in new designs. This stage is part of the EIA-724 product life cycle data model. 
   Saturation       Sales and capacity have peaked. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model. 
   Not Recommended (Declining)       Capacity is beginning to decline. Orders and shipments are permitted, but devices are not recommended for new designs. This stage is part of the EIA-724 product life cycle data model. 
   Phase Out       Capacity is declining rapidly. A formal discontinuance notice may be issued. Limitations on shipments can occur, but orders are still allowed. Devices are not considered for new designs. This stage is part of the EIA-724 product life cycle data model. 
   Last Shipments       Final shipments are made for existing orders. New orders are limited to existing or residual inventories. Manufacturing capacity limitations may exist. This stage is not part of the EIA-724 product life cycle data model. 
   Removed       Devices are unavailable. Product inventories and all supporting hardware, software, and documentation have been removed. New orders and new shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model. 
   Other       Other unlisted life cycle stages 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Performance
   Reference Voltage (VREF)       The output voltage (reference) that the device produces. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Initial Accuracy       The maximum deviation (in % of F.S., or in mV, at 25°C) of nominal reference voltage. This parameter represents the initial output-voltage error. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Temperature Coefficient (TC)       Temperature coefficient of voltage reference (TC) parameter calculated with the voltage deviation between cathode and anode and the temperature variation. This parameter refers to the change in reference output voltage for a given change in temperature.  It is expressed in part per million per degree Celsius (ppm/°C). 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Supply Current (IQ)       The supply current measured with no load on the output (IQ). This parameter is also specified as "no-load current or as "quiescent current". Normally this parameter is important in series references. For shunt references the specifications normally list the "operating current" (IK). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Input Voltage (VIN)       The voltage in continuous mode (DC) as specified by level (Min / Max) that can be applied to the voltage reference (VIN). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Temperature:       The value as specified by level (Min / Max) of the ambient temperature (in °C) in which the voltage Reference chip was designed to operate. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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