See All Suppliers In This Area
Fill out as many options as you want. Click "Run Search Filter" at any time.

Input Type:

Output Type:

Supply Voltage:

Operating Current:

Pd:

Isolation:

Response Time:

TJ:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Interface:

Package:

Standards:

Features:

Help with Signal Conditioning Chips specifications:

General Specifications
   Input Type       
   Your choices are...         
   AC Current       The input sensor of the conditioner measures AC current. 
   DC Current       The input sensor of the conditioner measures DC current. 
   AC Voltage       The input sensor of the conditioner measures AC voltage. 
   DC Voltage       The input sensor of the conditioner measures DC voltage. 
   Acceleration       The input sensor of the conditioner measures acceleration. 
   Light       The input sensor of the conditioner measures light. 
   Force       The input sensor of the conditioner measures force. 
   Frequency       The input sensor of the conditioner measures frequency. 
   Humidity       The input sensor of the conditioner measures humidity. 
   ORP       Oxygen reduction potential (ORP) input sensors measure oxidation-reduction potential. 
   Pressure       The input sensor of the conditioner measures pressure. 
   pH       pH input sensors measure potential of hydrogen (pH), the negative logarithm of the hydrogen ion activity in solution. 
   RTD       Resistance temperature detectors (RTD) measure temperature by correlating the resistance of the RTD element with temperature. 
   Temperature       The input sensor of the conditioner measures temperature. 
   Thermistor       The input of the conditioner is a thermistor 
   Thermocouple       The input of the conditioner is a thermocouple. 
   Other       Other, unlisted input types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Output Type       
   Your choices are...         
   4-20 mA       The output is a current-loop of 4-20 mA. 
   0 - 20 mA       The output is a current-loop of 0-20 mA. 
   0 - 5 Vdc       The output is a voltage between 0 - 5 Vdc. 
   0 - 10 Vdc       The output is a voltage between 0 10 Vdc. 
   AC Current       The output is AC current. 
   DC Current       The output is DC current. 
   AC Voltage       The output is AC voltage. 
   DC Voltage       The output is DC voltage. 
   Frequency       The output is a frequency signal. 
   Other       Other unlisted output types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Back to Top
Performance
   Supply Voltage:       
   Your choices are...         
   -5 V       Devices operate with -5 V. 
   -4.5 V       Devices operate with -4.5 V. 
   -3.3 V       Devices operate with -3.3 V. 
   -3 V       Devices operate with -3 V. 
   1.2 V       Devices operate with 1.2 V. 
   1.5 V       Devices operate with 1.5 V. 
   1.8 V       Devices operate with 1.8 V. 
   2.5 V       Devices operate with 2.5 V. 
   2.7 V       Devices operate with 2.7 V. 
   3 V       Devices operate with 3 V. 
   3.3 V       Devices operate with 3.3 V. 
   3.6V       Devices operate with 3.6 V. 
   5 V       Devices operate with 5 V. 
   Other       Other, unlisted supply voltages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Operating Current       The minimum current needed for active chip operation. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Pd       The power dissipated by the device while in the on-state. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Isolation       The maximum isolation voltage. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Response Time       The response time is the time that the sensor takes to react and produce an output given the input excitation. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   TJ       The full-required range of ambient operating temperatures. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Interface       
   Your choices are...         
   I2C       Inter-integrated circuit (I2C) bus is a two-wire, low-to-medium speed, communication bus. 
   PCI       Peripheral component interconnect (PCI) is a local bus system designed for high-end computer systems. PCI buses transfer 32 or 64 bits of data at a clock speed of 33 MHz They also support 3 to 5 critical peripherals, which are either integrated directly onto the motherboard or added via expansion cards. PCI buses fully support cards that were developed for standard I/O buses. 
   RS232       RS232 is a standard interface approved by the Electronic Industries Association (EIA) for connecting serial devices. This popular, serial communications standard provides asynchronous communication capabilities with hardware flow control, software flow control, and parity checking. Most gears, instruments with digital control interfaces, and communication devices have an RS232 interface. The typical transmission speed for RS232 is 9600 bps at 15 m. 
   RS422       RS422 supports multipoint connections whereas RS423 supports only point-to-point connections. RS422 provides much longer transmission distances than RS232, but less signal line. RS422 uses a differential transmission technology and provides high-speed transmissions up to 10 Mbps over a maximum transmission distance up to 1.2 km at 110 kbps. 
   RS485       RS485 is almost identical to RS232 except that transmissions are three-way rather than two-way. RS485 is often used in applications where a single controller needs to control multiple devices. Up to 64 devices may be connected with RS485. An enhanced version of RS422, RS485 is compatible with the RS422 interface and provides a two-wire bus topology. Using an RS485 two-wire bus provides a very inexpensive network system; however, RS485 defines only the electronic signal specifications. Consequently, users must define the software protocol for RS485 two-wire communications. 
   SPI       Serial peripheral interface (SPI). 
   Ethernet       The interface of the conditioner is an Ethernet interface. 
   Wireless       The interface of the conditioner is a wireless network interface. 
   Other       Other unlisted or proprietary interface types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Back to Top
Package
           
   Your choices are...         
   Bare Die        Devices are sold in semiconductor die form. They do not have a case or packaging. 
   BGA       Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   PGA       Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   UCSP       Ultra chip scale package (UCSP). 
   LGA       Land-grid array (LGA). 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.   
   TQFP       Thin quad flat package (TQFP). 
   PQFP       Plastic quad flat package (PQFP). 
   TDFN       Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages. 
   QFN       Quad flat non-leaded package (QFN). Also known as QFNL. 
   VQFP       Very thin quad flat package (VQFP). 
   SOP       Small outline package (SOP). 
   PSOP       Power small outline package (PSOP). 
   QSOP       Quarter size outline package (QSOP). 
   MLP       Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm. 
   SOIC       Small outline integrated circuit (SOIC). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   TSOJ       Thin small outline J-leaded package (TSOJ). 
   TSOP Type I       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   TSOP Type II       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   SSOP       Shrink small outline package (SSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   VSSOP       Very thin shrink small outline package (VSSOP). 
   TVSOP       Thin very small outline package (TVSOP). 
   HSOF       Small outline flat-leaded package with heat sink (HSOF). 
   HSOP       Small Outline with Heat Sink Package. 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. 
   SIP       Single in-line package (SIP) is a semiconductor package which has only one row of pins. 
   SDIP       Shrink dual in-line package (SDIP). 
   SZIP       Shrink zigzag in-line package (SZIP). 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Back to Top
Standards and Features
   Standards       
   Your choices are...         
   ELV Directive       End of life vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium, and lead as of 7/01/2003. Lead can still be used as an alloying additive in copper, steel, and aluminum and in solderable applications. 
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS became effective on July 1, 2006. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Features       
   Your choices are...         
   Programmable       The conditioner is programmable. 
   Temperature Compensation       The conditioner provides temperature compensation. 
   Amplification       The conditioner provides amplification. 
   Integrated Microprocessor       The conditioner has fully integrated microprocessor. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Back to Top