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Thyristor Type:

IC Package Type:

Pin Count:

Number of Thyristors in Package:

RoHS Compliant?

ELV Directive?

VDRM:

VRRM:

IT(RMS):

TJ:

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Help with Thyristors specifications:

General Specifications
   Thyristor Type       
   Your choices are...         
   Silicon Controlled Rectifier (SCR)       Silicon controlled rectifiers (SCR) are silicon devices with four layers (PNPN). They have an input control terminal (gate), an output terminal (anode) and a terminal common to both the input and output (cathode). SCRs are used mainly where high currents and voltages are involved, and are often used to control alternating currents, where the change of sign of the current causes the device to automatically switch off. For example, a dimmer switch for lights can be implemented using an SCR, where the turn-on point is controlled to occur at a particular point on the sine curve of the AC supply. The SCR stays on for the remainder of that cycle. The drawback of using SCRs is that, like diodes, they only conduct in one direction. 
   Silicon Controlled Switch (SCS)       Silicon controlled switches (SCS) are four-layer (PNPN) devices that are similar in construction to silicon controlled rectifiers (SCR). The SCS, however, has two gate terminals: a cathode gate and an anode gate. The SCS can be turned on and off using either gate terminal.  Applying a positive voltage between the cathode gate and cathode terminals turns on an SCS. It may be turned off (forced commutation) by applying a negative voltage between the anode and cathode terminals, or simply by shorting those two terminals together. The anode terminal must be kept positive with respect to the cathode in order for the SCS to latch. 
   Triac       Triacs are three-terminal silicon devices that function as two SCRs configured in an inverse, parallel arrangement, so as to provide load current during both halves of the AC supply voltage. Generally, triacs are used to control motor speed. Since load current (armature current) flows during both halves of the applied AC voltage, the motor rotates smoothly at all rotational speeds. 
   Thyristor Surge Suppressor       Thyristor surge suppressors are semiconductor chips used to protect circuits and devices from over-voltage and over-current. 
   Unijunction Transistor (UJT)       Unijunction transistors (UJT) are three-terminal devices that exhibit a negative resistance characteristic. 
   Programmable Unijunction Transistor (PUT)       Programmable unijunction transistors (PUT) are three-terminal thyristors that are triggered into conduction when the voltage at the anode exceeds the voltage at the gate. The PUT is similar to the UJT, but its intrinsic standoff ratio can be set by two external resistors. Hence, the term "programmable". 
   Diac       Diacs are bi-directional diodes that are designed to trigger a triac or SCR. Diacs do not conduct (except for a small leakage current) until the breakover voltage is reached. 
   Gate Turn-off Thyristor (GTO)       Gate turn-off thyristors (GTOs) are like SCRs, but only have three external terminals (the cathode, the anode and the cathode gate, or simply gate). GTOs can be turned off as well as on. They are turned on or off by positive or negative pulses applied to the cathode gate. The advantage of the GTO over the SCR or the SCS is the fact that it can be turned on or off by applying the proper pulse to only one terminal, the cathode gate. 
   Light-activated SCR (LASCR)       Light-activated silicon controlled rectifiers (LASCR) are silicon controlled rectifiers (SCR) where the state is controlled by light falling upon the silicon semiconductor layer of the device.  LASCRs conduct current in one direction when activated by a sufficient amount of light and continue to conduct until the current falls below a specified value. LASCRs are most sensitive to light when the gate terminal is open. Additionally, most LASCRs have a gate terminal so that an electrical pulse can trigger the device in a similar fashion to traditional SCRs. 
   Shockley Diode       Shockley diodes are four-layer (PNPN) semiconductor devices that behave as a pair of interconnected PNP and NPN transistors. Like all thyristors, Shockley diodes tend to stay on once they have been turned on (latched), and stay off once they have been turned off.  There are two ways to latch a Shockley diode: exceed the anode-to-cathode breakover voltage, or exceed the anode-to-cathode critical rate of voltage rise. There is only one way to cause a Shockley diode to stop conducting, and that is to reduce the current going through it to a level below its low-current dropout threshold. 
   Static Induction Thyristor (SITH)       Static induction thyristors (SITH), also known as field-controlled thyristors (FCT), are essentially JFETs with an added P+-Type back layer. 
   Static Induction Transistor (SIT)       Static induction transistors (SIT) are thyristors formed by creating a channel region between the gate region and the source region. The current of the device (from drain to source) is controlled by a voltage applied to the gate region. 
   MOS Controlled Thyristor (MCT)       MOS controlled thyristors (MCT) are SCRs with an insulated gate terminal. The insulated gate simplifies the drive circuits. MCTs have the low on-state losses and high current capabilities of an SCR and the faster switching speed of the MOSFET. 
   Quadrac       Quadracs are special types of thyristors that consist of a combination of a triac and a diac. The diac is the triggering device for the triac. 
   Sidac       Sidacs are bi-directional voltage-triggered switches. Upon reaching the breakover voltage in each direction, the device switches from a blocking state to a low-voltage on state. Conduction will continue like a triac until the main terminal current drops below the holding current. 
   Other       Other unlisted thyristors. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   IC Package Type       
   Your choices are...         
   DIP / CDIP / PDIP       Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. 
   DPAK       Discrete package or deca-watt (DPAK). 
   D2PAK       D2PAK is large surface mounted package that include a heat sink. 
   IPAK       Integrated package (IPAK). 
   I2PAK       I2PAK is a plastic package with three leads. 
   MELF       Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel. 
   PPAK       Power packaging (PPAK). 
   DO-15       DO-15 is a diode outline (DO) package. 
   DO-35       DO-35 is a diode outline (DO) package. 
   SOD       Small outline diode (SOD) package. 
   TO-3       TO-3 is a transistor outline (TO) package with three leads. 
   TO-3P       TO-3P is a transistor outline (TO) package with three leads. 
   TO-39       TO-39 is a transistor outline (TO) package. 
   SOT3       SOT3 is a small outline transistor (SOT) package. 
   SOT223       SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink. 
   TSOP       Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.  
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   TSOJ       Thin small outline J-leaded package (TSOJ). 
   TO-92       TO-92 is a transistor outline (TO) package.  
   TO-202       TO-202 is a transistor outline (TO) package. 
   TO-220       TO-220 is a transistor outline (TO) package. 
   Other       Other unlisted, specialized or proprietary packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       The number of physical connection points (e.g., pins, pads, balls) on the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Thyristors in Package       The number of diodes embedded in the chip (package). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Standards and Certifications
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   ELV Directive       End of Life Vehicles (ELV) is an EU directive that required certain automotive products to be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum, and in solderable applications. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Performance
   VDRM       The peak repetitive off-state voltage (VDRM) is the maximum instantaneous value of the off-state voltage across the device. It includes all of the repetitive transient voltages, and excludes all of the non-transient repetitive voltages. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   VRRM       Peak repetitive reverse voltage (VRRM) is the maximum peak reverse voltage that can be applied continuously to the main terminals (anode, cathode) of the thyristor. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   IT(RMS)       IT(RMS) is the maximum root mean square (RMS) current for a specified case temperature. It is the RMS value of the principal current when the device is in the on state. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   TJ       Temperature junction (TJ) is the full-required range of ambient operating temperatures. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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