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Polarity:

hfe:

VCEO:

VCBO:

IC(max):

fT:

PD:

TJ:

Package Type:

Packing Method:

Number of Transistors in the Chip:

Help with Small-Signal Bipolar Transistors (BJT) specifications:

Performance
   Polarity       
   Your choices are...         
   NPN       A physical BJT transistor arrangement where the emitter and the collector are made of N-type material and the base of P-type. 
   PNP       A physical BJT transistor arrangement where the emitter and the collector are made of P-type material and the base of N-type. 
   Other       Other unlisted polarity type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   hfe       hfe (common-emitter current gain or static forward current transfer ratio) is defined as the ratio of the input dc current and the output dc current of the transistor (static current gain). This parameter is also known as β.  The ratio of collector current to base current, ß is the fundamental parameter characterizing the amplifying ability of a bipolar transistor. ß is usually assumed to be a constant figure in circuit calculations, but unfortunately this is far from true in practice. As such, manufacturers provide a set of ß (or "hfe") figures for a given transistor over a wide range of operating conditions, usually in the form of maximum/minimum/typical ratings. It may surprise you to see just how widely ß can be expected to vary within normal operating limits. One popular small-signal transistor, the 2N3903, is advertised as having a ß ranging from 15 to 150 depending on the amount of collector current. Generally, ß is highest for medium collector currents, decreasing for very low and very high collector currents. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   VCEO       Collector-to-emitter breakdown voltage (VCEO) is the maximum allowable value of voltage able to apply continuously in the reverse direction of collector junction with the emitter open. JIS C7032 (1993), IEC61360-AAE417. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   VCBO       Collector-to-base breakdown voltage when the emitter terminal is open. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   IC(max)       Maximum Collector Current - JIS C7032 (1993), IEC61360-AAE405 (IC_DC). 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   fT       Current gain bandwidth product is the frequency at which hFE is in unity. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   PD       The power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatt. When a transistor conducts current between collector and emitter, it also drops voltage between those two points. At any given time, the power dissipated by a transistor is equal to the product of collector current and collector-emitter voltage. Just like resistors, transistors are rated in terms of how many watts they can safely dissipate without sustaining damage. High temperature is the mortal enemy of all semiconductor devices, and bipolar transistors tend to be more susceptible to thermal damage than most. Power ratings are always given in reference to the temperature of ambient (surrounding) air. When transistors are to be used in hotter-than-normal environments, their power ratings must be derated to avoid a shortened service life. 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   TJ       This is the full-required range of ambient operating temperature of the junction. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Packaging Characteristics
   Package Type       
   Your choices are...         
   TO-3       TO-3 is a transistor outline (TO) package. 
   TO-8       TO-8 is a transistor outline (TO) package. 
   TO-39       TO-39 is a transistor outline (TO) package. 
   TO-92       TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment. 
   TO-202       TO-202 is a transistor outline (TO) package. 
   TO-220       TO-220 is a transistor outline (TO) package that is suitable for high power, medium current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies. 
   TO-223       TO-223 is a transistor outline (TO) package. 
   TO-237       TO-237 is a transistor outline (TO) package. 
   TO-247       TO-247 is a large, through-hole, transistor outline (TO) package. TO-247 provides excellent power dissipation and is ideal for metal oxide semiconductor field effect transistors (MOSFETs), high power bipolar transistors, and insulated gate bipolar transistors (IGBTs). 
   TO-263       TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers. 
   SO-8       SO-8 is a small outline (SO) package. 
   SOT3       SOT3 is a small outline transistor (SOT) package with three leads. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   SOT25       SOT25 is a surface mounted, small outline transistor (SOT) package with three leads.  
   SOT26       SOT26 is a plastic, surface mounted, small outline transistor (SOT) package with three leads.  
   SOT82       SOT82 is a rectangular, surface mounted, small outline transistor (SOT) package with three leads. SOT82 is larger than DPAK and smaller than TO-220, but still comparable to TO-220 in performance. SOT82 lead frames are available in full nickel or selective silver plating and allow wire bonding with gold or aluminum wire. Often, SOT82 is used in over-voltage protection devices in telecommunications equipment. SOT82 is also used to package high power rectifiers, DC to AC converters (DACs) and frequency converters. 
   SOT89       SOT89 is a plastic, surface mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL). 
   SOT123       SOT123 is a flanged, ceramic, surface mounted, small outline transistor (SOT) package with two mounting holes and four leads.  
   SOT143       SOT143 is a plastic, surface mounted, small outline transistor (SOT) package with four leads. 
   SOT223       SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink. During soldering, the formed leads absorb thermal stress and eliminate the possibility of damage to the die. The encapsulation material enhances device reliability, allowing SOT223 to provide excellent performance in environments with high temperatures and humidity levels. SOT223 provides power dissipation of 1W ~ 1.5W. 
   SOT323       SOT323 is a plastic, surface mounted, small outline transistor (SOT) package with three leads. 
   TO-251 / TO-252       TO-251 and TO-252 are low to medium power packages that feature a transistor outline (TO). TO-251 uses through-hole technology (THT). TO-252 uses surface mount technology (SMT). Both packages provide several lead frame choices and are commonly used in home appliances, personal computers, lighting, and automotive systems.     
   FPAK       Flat package (FPAK). 
   Other       Other unlisted or proprietary packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Packing Method       
   Your choices are...         
   Tape Reel       Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP). 
   Rail       This is a method of packaging IC chips for production environments. 
   Bulk Pack       Components are distributed as individual parts. 
   Shipping Tube / Stick Magazine       Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.  To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type. 
   Tray       Components are packed in trays that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks. 
   Other       Other unlisted, specialized or proprietary packing methods. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Number of Transistors in the Chip       The number of independent units in the chip (package). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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