Help with Sensor Chips specifications:
General Specifications
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| Sensor Type | |||
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| Acceleration Sensor | Acceleration sensors are used to detect and measure acceleration. | ||
| Biometric Sensor | Biometric sensors are semiconductors with embedded algorithms that are used in security systems or environments for user authentication. | ||
| Biosensor | Biosensors, microarrays, biochips and lab-on-chip (LOC) products are microscale devices for biological, biochemical and chemical assays. They consist of microfluidic channels and a biodetector or microsensor arrays. | ||
| Pressure Sensor | Pressure sensor chips are based on micro-machining technology, where the physical parameter being sensed (pressure) causes a temporary and reversible deformation to a specifically designed mechanical structure etched into the solid silicon. The output generated can be an analog voltage or current, or a digital signal (serial, parallel, etc.), and is proportional to the measured pressure. Depending on the specific requirements of the application, these sensors are manufactured as stand-alone transducers, signal conditioning chips, or integrated transducers that include signal conditioning and the sensor on the same die. | ||
| Proximity Sensor | Proximity sensors detect the presence or proximity of a target. | ||
| Temperature Sensor | Temperature sensor chips measure temperature. The output generated can be an analog voltage or current, or a digital signal (serial, parallel, on-off thermostat, etc.) that is proportional to the measured temperature. Vendors classify IC temperature sensors according to the input source and output-signaling method. The temperature source to be measured is usually the IC's own package, but airflow can be measured with an on-chip heater that raises the package temperature above ambient. Remote temperature can be measured with a diode-connected transistor. On the output side, analog-output, thermostat-logic-output, and serial-digital-output signaling methods are in widespread use. | ||
| Magnetic Sensor | Magnetic sensor chips measure magnetic field strength. The output generated can be an analog voltage or current, or a digital signal (serial, parallel, etc.) that is proportional to the measured field. Magnetic sensors have many industrial uses, from measuring automotive position, to driving speed and current sensors. Low voltage battery-powered sensors are used in handheld instrumentation and in implanted medical devices. | ||
| Humidity Sensor | Humidity sensors used in the detection and processing of humidity. | ||
| Inertial Sensor | Inertial sensors are semiconductor devices used to measure acceleration, changes in inclination, and gyration. | ||
| Level Sensor | Level sensors are used in detection levels. Applications of level chip sensors include continuous fluid level sensing, moisture detection, etc. | ||
| Light Sensor | Light sensor chips convert light into electrical signals which are then conditioned to produce a desired electrical output. They are sometimes called light-to-frequency chips, light-to-voltage chips, or ambient light sensors. | ||
| Force Sensor | Force sensors used in the detection force or strain. | ||
| Torque Sensor | Torque sensors are used in the detection torque. | ||
| Other | Other unlisted sensor types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Sensor Grade / Operating Range | |||
| Your choices are... | |||
| Medical | The sensor is designed for medical applications. | ||
| Automotive | The sensor is designed for automotive applications. | ||
| Industrial | The sensor is designed for general industrial applications. | ||
| Consumer | The sensor is designed for consumer product applications. | ||
| Military | The sensor is designed for military applications. | ||
| Other | Other unlisted applications. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Package Type / Mounting | |||
| Your choices are... | |||
| Die | Bare die devices are sold in semiconductor die form. They do not have a case or packaging. | ||
| Through Hole Technology (THT) | In through-hole technology (THT), components are mounted on printed circuit boards by inserting component leads through holes in the board and then soldering. | ||
| Surface Mount (SMD) | Surface mount device (SMD). | ||
| Other | Other unlisted or proprietary package types or packing methods. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Performance
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| Input (Supply) Voltage | The input voltage required to operate the sensor. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Impedance | The impedance seen at the input of the sensor. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Operating Temperature: | This is the full-required range of ambient operating temperature. | ||
| Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
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Standards and Features
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| RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS became effective on July 1, 2006. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| WEEE Compliant | Waste Electrical and Electronics Equipment (WEEE) is a European Union (EU) directive that aims to encourage the reuse, recycling, and recovery of electrical and electronic equipment, and to improve the environmental impact and performance of this equipment. WEEE also establishes the requirements and criteria for the collection, treatment, recycling and recovery of this equipment. It makes producers responsible for financing these activities, and retailers and distributors must provide a means for consumers to return used or obsolete equipment without charge. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| ELV Directive | End of life vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium, and lead as of 7/01/2003. Lead can still be used as an alloying additive in copper, steel, and aluminum and in solderable applications. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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