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   IC Package Type:       
   Your choices are...         
   BGA       Ball-grid arrays (BGA) are IC packages which place output pins in the form of solder ball matrix. The traces of BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanism (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   P-BGA       Plastic Gall Grid Array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. 
   T-BGA       Tape-ball Grid Array. 
   CSP       CSP (chip scale package or chip size package) is a package that has an area of no more 20% larger than the die is built in. It is suitable for compact 2nd-level packaging efficiency. With better protection by ruggedized encapsulation and better 2nd-level reliability (or board level reliability), CSP prevails over the direct chip attach (DCA) and chip on board (CoB) technology. This package makes the IC sturdy enough for easily handling, and testability. The applications of CSP include memory ICs, RISC, and communication ICs. 
   uCSP       micro CSP package 
   FLGA       Fine-pitch Land Grid Array. 
   FP       Flatpack. 
   QFP       Quad flat packages (QFP) are important quad packages. The reason is the fine lead frame via etching or stamping process enables QFP to contain more leads and feature a smaller profile (the lead width can be as small as 0.16mm while the lead pitch is 0.4mm). The thinner and flexible leads in gull-wing shape also provide better 2nd-level reliability (package to PCB). Quad packages have been used for years to meet increasing challenges of advancing processors/controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipset, video-DAC, multi-media and other related applications. QFP applications are widely used for consumer and industrial products, automotive technology, PCs and other related products. 
   LFQP       Low-profile Quad Flat Package. 
   TQFP       Thin Quad Flat Package. 
   SOP       Small Outline Package. 
   MCM       Multiple chip module 
   SOIC       Small Outline IC. 
   TSOP Type I       Thin Small Outline Package Type I. 
   TSOP Type II       Thin Small Outline Package Type II. 
   SSOP       Shrink Small Outline Package. 
   TSSOP       Thin Shrink Small Outline L-leaded Package. 
   VSSOP       Very Thin Shrink Small Outline Package 
   TVSOP       Thin Very Small Outline Package 
   SOJ       Small Outline J-leaded Package. 
   HSOF       Small Outline Flat-Leaded Package with Heat Sink 
   PLCC       Plastic Leaded Chip Carrier. 
   LCCC       Leadless Ceramic Chip Carrier 
   DIP       Dual-In-line packages (DIP) have proven track record and considered as one of the established industry standard. 
   CDIP       The Ceramic DIP (CDIP) is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "DIP formed" leadframe. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° Centigrade. 
   PDIP       Plastic dual-in-line packaging (PDIP) is a principal package using the PTH technology. It is widely used for low cost and hand-inserting applications. Dual-In-line packages have proven track record and considered as one of the established industry standard. PDIP packages broad application includes consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers, commercial electronics, and telecommunications. 
   SIP       Single Inline Package. 
   SDIP       Shrink Dual Inline Package. 
   SZIP       Shrink Zigzag Inline Package. 
   SC-70       Single Chip EIAJ SC-88a 
   Other       Other unlisted, specialized, or proprietary packages. 
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   Mounting       
   Your choices are...         
   Surface Mount       In Surface Mount Technology (SMT), components are mounted on printed circuit boards by soldering the component leads or terminals to the top surface of the board 
   Flat Pack       A surface mount package whose leads extend straight out from the body. 
   Through-hole       In Through Hole Technology (THT), components are mounted on printed circuit boards by inserting component leads through holes in the board and then soldering. 
   Socket       In socket mount components are inserted into a socket type connector. 
   Other       Other unlisted, specialized, or proprietary mounting. 
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Services
   Backend Processing       
   Your choices are...         
   Soldering / Pasting       Soldering or solder deposition processes to facilitate bonding of or electrical connection of a packaged device into a system. 
   Wire Bonding       A process used to electrically connect a die to a package via wire loops. The wire loops may be bonded by soldering or ultrasonic techniques. 
   Flip Chip Technology       Flip Chip is the method of electrically connecting the die to the package carrier. The package carrier provides the connection from the die to the exterior of the package. In "standard" packaging, the interconnection between the die and the carrier is made using wire. The interconnection between the die and carrier in flip chip packaging is made through a conductive "bump" that is placed directly on the die surface. 
   Hermetic Sealing       Formation of a gas or vacuum tight seal between ceramic and/or metallic components in an assembly. 
   Bonding       Die bonding is the attachment of IC chips or dies using an adhesive into a package. 
   Back Grinding       Thinning of dies or chips using back grinding processes to improve thermal dissipation and facilitate testing, die bonding and packaging processes. 
   Dicing       Dicing is the sectioning of wafers or substrates into dies or chips to facilitate die bonding and packaging processes. 
   Other       Other proprietary, specialized or unlisted processes. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Testing Services       
   Your choices are...         
   Testing - Mechanical / Adhesion       Mechanical testing of packaged devices or other components to determine if die adhesion or structural specifications are met. 
   Testing - Electrical / Functional       Electrical functional testing is a process used to sort and/or mark die on wafers based on electrical performance. Wafer sorters or probers preform functional tests on dies in wafers or on packaged MEMS or IC devices.  Functional tests verify the operation of all device functions and then defective dies or chips are marked.  Ink marks were traditionally used, but electronic wafer maps are now being employed.  
   Testing - Thermal       Thermal testing of packaged devices to determine if the package meets heat dissipation guidelines. 
   Other       Other proprietary, specialized or unlisted processes. 
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Materials
   Package Material       
   Your choices are...         
   Plastic       The package material is plastic. 
   Ceramic       The package material is ceramic. 
   Metal       The package material is metal. 
   Other       Other unlisted materials. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Location
           
   Your choices are...         
   North America       Companies are located in the United States, Canada or Mexico. 
   United States Only       Companies are located in the United States. 
   Northeast US Only       Companies are located in the Northeast United States, namely Connecticut, Maine, Massachusetts, New Hampshire, New Jersey, New York, Pennsylvania, Rhode Island and Vermont. 
   Southern US Only       Companies are located in the Southern United States, namely Alabama, Arkansas, Delaware, Florida, Georgia, Kentucky, Louisiana, Maryland, Mississippi, Missouri, North Carolina, Oklahoma, South Carolina, Tennessee, Texas, Virginia, Washington D.C., and West Virginia. 
   Southwest US Only       Companies are located in the Southwest United States, namely Arizona, California, Colorado, Nevada, New Mexico and Utah. 
   Northwest US Only       Companies are located in the Northwest United States, namely Idaho, Montana, Oregon, Washington and Wyoming. 
   Midwest US Only       Companies are located in the Midwest United States, namely Illinois, Indiana, Iowa, Kansas, Michigan, Minnesota, Nebraska, North Dakota, Ohio, South Dakota and Wisconsin. 
   Canada Only       Companies are located in Canada. 
   South / Central America Only       Companies have facilities in South American countries such as Argentina, Brazil, or Chile; or in Central American countries such as Costa Rica, Honduras, Panama, etc. 
   Europe Only       Companies are located in Europe, namely Germany, Ireland, Italy, United Kingdom, etc. 
   South Asia Only       Companies are located in South Asia, namely India, Pakistan, Nepal, etc. 
   Near East Only       Companies are located in the Near East, namely Egypt, Israel, Saudi Arabia, etc. 
   East Asia / Pacific Only       Companies are located in East Asia, namely China, Japan, Taiwan, etc. 
   Oceania Only       Companies are located in Australia, New Zealand, Papua New Guinea and a large group of South Pacific islands that include Micronesia, Polynesia, Guam, Fiji, Tonga, etc.  
   Africa Only       Companies are located in sub-Saharan Africa. 
   Other       Other unlisted country or region. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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