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Frequency Range:

dBm Measurement Range:

Bandwidth:

Input Voltage Range (Vcc):

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

IC Package Type:

Pin Count:

Measurement Options:

Output Interface:

Standards and Certifications:

Operating Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Help with RF Power Detector ICs specifications:

Device Performance
   Frequency Range       The frequency range that devices can measure. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   dBm Measurement Range       The maximum dBm power that devices can measure. dBm = 10 log (P/Pref), where P is the measured power and Pref is the reference power (1 milliwatt). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Bandwidth       Bandwidth is the range of operating frequencies of the device 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Input Voltage Range (Vcc)       The needed input voltage (range) needed to operate the device. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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Packaging
   IC Package Type:       
   Your choices are...         
   Bare Die        Devices are sold in semiconductor die form. They do not have a case or packaging. 
   BGA       Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   FCBGA       Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints. 
   PBGA       Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. 
   MCM-PBGA       Multi-chip module plastic ball-grid array (MCM-PBGA). 
   SBGA       Super ball-grid array (SBGA) provides a high power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). 
   TBGA       Tape ball-grid array (TBGA). 
   CPGA       Ceramic pin-grid array (CPGA). 
   PPGA       Plastic pin-grid array (PPGA). 
   FCPGA       Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown without any wire bonding. 
   IPGA       Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA. 
   PGA       Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second-level packaging efficiency and encapsulated for second-level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   FCCSP       Flip-chip chip-scale package (FCCSP). 
   SuperFC®       Super flip-chip or SuperFC® packages feature a controlled bond line die attached directly to a copper heat spreader.  SuperFC® is a registered trademark of Amkor. 
   UCSP       Ultra chip scale package (UCSP). 
   WLCSP       Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction. 
   LGA       Tape ball-grid array (TBGA) uses a fine polyimide substrate and provides good thermal performance with high pin counts. 
   FLGA       Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.   
   LQFP       Low quad flat package (LQFP). 
   TQFP       Thin quad flat package (TQFP). 
   PQFP       Plastic quad flat package (PQFP). 
   QFN       Quad flat non-leaded package (QFN) is also known as QFNL. 
   VQFP       Very thin quad flat package (VQFP). 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar coded. Reels are placed inside barcode-labeled boxes for shipping. 
   PSOP       Power small outline package (PSOP). 
   SOP       Small outline package (SOP). 
   QSOP       Quarter size outline package (QSOP). 
   MLP       Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm. 
   SOIC       Small outline integrated circuit (SOIC). 
   TSOJ       Thin small outline J-leaded package (TSOJ). 
   TSOP Type I, Type II       Thin small outline package (TSOP) is a type of DRAM package that uses gull wing-shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. 
   TSOP Type I       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing-shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   TSOP Type II       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing-shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   SSOP       Shrink small outline package (SSOP). 
   VSSOP       Very thin shrink small outline package (VSSOP). 
   TVSOP       Thin very small outline package (TVSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   HSOF       Small outline flat-leaded package with heat sink (HSOF). 
   HSOP       Small Outline with heat sink package. 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry, pressed, ceramic surrounding a "DIP formed" lead frame. The ceramic/LF/ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers, commercial electronics and telecommunications. 
   SIP       Single in-line package (SIP) is a semiconductor package which has only one row of pins. 
   SDIP       Shrink dual in-line package (SDIP). 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. 
   SZIP       Shrink zigzag in-line package (SZIP). 
   TDFN       Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       The number of pins in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Standards, Options and Features
   Measurement Options       
   Your choices are...         
   RMS       Devices provide true RMS measurements. RMS is an acronym for root mean square (RMS, a statistical measure of time-varying value. 
   Peak       The device measures the peak RF value. 
   Spread Spectrum       The device is capable of measuring the power level of a spread spectrum signal. 
   Logarithmic       The device output is logarithmic. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Output Interface       
   Your choices are...         
   Analog Voltage       The device output is an analog voltage signal proportional to the measured signal. 
   Analog Current       The device output is an analog current signal proportional to the measured signal such as 4-20ma 
   TTL       The device outputs a digital transistor-transistor logic signal. 
   Serial       Serial port or asynchronous serial interfaces are system-to-system communication interfaces in which data is sent over a single wire (serial). Serial communications include RS232, RS422, and RS485, etc. 
   BCD       Binary coded decimal (BCD) is a circuit code which represents decimal numbers in binary code. With BCD, each decimal digit is represented by the four-bit binary representation of the digit. 
   Other       Other unlisted interfaces. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Standards and Certifications       
   Your choices are...         
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. 
   WEEE Compliant       “The Waste Electrical and Electronics Equipment Regulations (WEEE Regulations) is a European Parliament Directive with the aim of encouraging reuse, recycling and recovery of electrical and electronic equipment, and to improve the environmental impact and performance of this equipment.  This directive sets the requirements and criteria for the collection, treatment, recycling and recovery of this equipment. It makes producers responsible for financing these activities, and retailers and distributors must provide means for consumers to return used or obsolete equipment’s without charge. 
   ELV Directive       End of Life Vehicles (ELV) Directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of 7/01/2003. Lead can still be used as an alloying additive in copper, steel and aluminum and in solderable applications. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Operating Temperature:       This is the ambient temperature range through which the device is designed to operate. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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