Advanced Interconnections Corp. - SOIC to DIP Adapters

SOIC to DIP Adapters from Advanced are designed to convert rectangular type, .050" (1.27mm) pitch SOIC devices for soldering or socketing in a dual in-line (DIP or DIL) application.
Adapter allows gull wing SOIC (Small Outline Integrated Circuit) devices to be solderable or socketable in a thru-hole application.

  • Cost effective solution for DIP to SOIC package...
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Advanced Interconnections Corp. - Socket Adapter Systems

Ball Grid Array (BGA) Socket Adapter Systems, from Advanced Interconnections Corp,. are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. (read more)

Advanced Interconnections Corp. - Customized Peel-A-Way® Removable Terminal Carriers

Peel-A-Way® Removable Terminal Carriers offer ultimate design flexibility and a simple, economical method for automated pin loading. (read more)

Advanced Interconnections Corp. - Ball Grid Array (BGA) Socket Adapter System

Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.

Le... (read more)

Advanced Interconnections Corp. - Connectors Meet Aerospace Application Challenges

1.27mm pitch B2B® SMT Connectors, featuring solder ball terminals, provide a highly reliable method to define stack height between two PC boards. Compact design conserves board space by combining many signal, ground, and power pins in a dense area. (read more)

Advanced Interconnections Corp. - Customized Board to Board Connectors

From prototype to production volumes, we provide affordable connector solutions matched to your specific requirements. Proven reliability combined with design flexibility ensure effective results for even the most demanding SMT and thru-hole applications. High quality screw-machined terminals provide reliable electrical/mechanical interconnects. (read more)

Advanced Interconnections Corp. - Flip-Top BGA Sockets Ease Device Test

Flip-Top™ BGA Test Sockets from Advanced Interconnections Corp. simplfy testing and validation of BGA and LGA devices, saving space on the board and speeding the test process. Watch our new video to see how easy it is to use. (read more)

Advanced Interconnections Corp. - Highly-Reliable Screw-Machined Terminals and Pins

Durable and highly-reliable screw-machined terminals and pins from Advanced Interconnections.

Advanced designs and manufactures hundreds of RoHS Compliant screw-machined terminals (pins and sockets) for high reliability interconnect applications (both standard and custom designs). (read more)

Advanced Interconnections Corp. - Peel-A-Way® - Removable Socket Terminal Carriers

Peel-A-Way® Removable Socket Terminal Carriers from Advanced Interconnections.

Peel-A-Way® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)

Advanced Interconnections Corp. - Customized SMT Perimeter Connectors

A new line of customized surface mount connectors from Advanced Interconnections reduces board space by utilizing the perimeter of circular and other odd-shaped PC boards. To support prototypes and small volume runs, Advanced can provide an affordable design and rough sample for electrical and mechanical testing, typically in less than 5 days. (read more)

Advanced Interconnections Corp. - Solder Preform Terminals Aid Intrusive Reflow

Unique solder perform terminals from Advanced Interconnections Corp. (Advanced) reduce assembly costs by eliminating time-consuming steps in PC board processing. (read more)

Advanced Interconnections Corp. - Custom Connectors for Military and Medical

With in-house technology from precision drilling and routing to CNC screw machining, combined with 25+ years of interconnect engineering, Advanced can quickly design a customized solution for your next connector application. (read more)

Advanced Interconnections Corp. - Flip-Top BGA Test Socket for 0.50mm Pitch Devices

The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. More Information... (read more)

Advanced Interconnections Corp. - Surface Mount Sockets

Surface mount sockets from Advanced are available in footprints from 0.50mm to 1.27mm pitch. Sockets feature industry-proven solder ball terminals in either eutectic Tin/Lead or RoHS Compliant lead-free Tin/Silver/Copper. More Information... (read more)

Advanced Interconnections Corp. - SOIC to DIP Adapters - Lead Free

Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC devices. Standard and lead-free designs featuring screw-machined terminals. (read more)

Advanced Interconnections Corp. - Peel-A-Way® Board to Board Connectors

Single, Dual and Triple Row Board to Board Connectors featuring screw-machined terminals available in either RoHS Compliant high temp. molded LCP insulators, FR-4 or Peel-A-Way® removable terminal carriers. (read more)

Advanced Interconnections Corp. - SIP Headers & Sockets for Power Modules/Converters

Single In-line (SIP) molded headers and sockets feature high quality screw-machined terminals for reliable socketing of power modules and converters. More Information... (read more)

Advanced Interconnections Corp. - Interposers: Package Conversion & Lead-free Issues

New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. (read more)

Advanced Interconnections Corp. - BGA Socket Adapter System

An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. (read more)

Advanced Interconnections Corp. - .100 Pitch Molded Board to Board Connector

Single and Dual Row Board to Board Connectors in new RoHS Compliant high temperature molded LCP insulators feature screw-machined terminals for superior durability. (read more)

Advanced Interconnections Corp. - Flip-Top™ BGA Socket

Advanced Interconnections' Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. (read more)

Advanced Interconnections Corp. - SMT Connectors- Mezza-pede Low Profile, 1mm pitch

Mezza-pede® low profile 1mm pitch SMT Connectors from Advanced are designed for board-to-board or cable-to-board applications where long-term reliability is required. (read more)

Advanced Interconnections Corp. - Peel-A-Way® DIP Socket Terminal Carriers

Peel-A-Way® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)