Advanced Interconnections Corp.
BGA, LGA, or QFP to QFP footprint on the PCB
Advanced's patented Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or different footprint. (read more)
Peel-A-Way® Removable Terminal Carriers offer ultimate design flexibility and a simple, economical method for automated pin loading. (read more)
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.
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1.27mm pitch B2B® SMT Connectors, featuring solder ball terminals, provide a highly reliable method to define stack height between two PC boards. Compact design conserves board space by combining many signal, ground, and power pins in a dense area. (read more)
From prototype to production volumes, we provide affordable connector solutions matched to your specific requirements. Proven reliability combined with design flexibility ensure effective results for even the most demanding SMT and thru-hole applications. High quality screw-machined terminals provide reliable electrical/mechanical interconnects. (read more)
Durable and highly-reliable screw-machined terminals and pins from Advanced Interconnections.
Advanced designs and manufactures hundreds of RoHS Compliant screw-machined terminals (pins and sockets) for high reliability interconnect applications (both standard and custom designs). (read more)
Peel-A-Way® Removable Socket Terminal Carriers from Advanced Interconnections.
Peel-A-Way® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)
A new line of customized surface mount connectors from Advanced Interconnections reduces board space by utilizing the perimeter of circular and other odd-shaped PC boards. To support prototypes and small volume runs, Advanced can provide an affordable design and rough sample for electrical and mechanical testing, typically in less than 5 days. (read more)
The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. More Information... (read more)
Single In-line (SIP) molded headers and sockets feature high quality screw-machined terminals for reliable socketing of power modules and converters. More Information... (read more)
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. (read more)
Peel-A-Way® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)