Peel-A-Way® Removable Terminal Carriers offer ultimate design flexibility and a simple, economical method for automated pin loading. (read more)
Whether you're battling device obsolescence or need a pluggable device for easy in-field replacement, SOIC to DIP Adapters from Advanced Interconnections meet the challenge. New lower pricing, lead-free options, and mating DIP Sockets make your job even easier. The 4414 Series SOIC to DIP Adapters are available from 8 to 32 positions on .300/(7.62mm) or .600/(15.24mm) spacing. (read more)
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.
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1.27mm pitch B2B® SMT Connectors, featuring solder ball terminals, provide a highly reliable method to define stack height between two PC boards. Compact design conserves board space by combining many signal, ground, and power pins in a dense area. (read more)
From prototype to production volumes, we provide affordable connector solutions matched to your specific requirements. Proven reliability combined with design flexibility ensure effective results for even the most demanding SMT and thru-hole applications. High quality screw-machined terminals provide reliable electrical/mechanical interconnects. (read more)
Advanced Interconnections offers value added surface mount device attach and rework services in our in-house SMT production facility. From BGA and LGA device attach to precision BGA solder reballing services, Advanced's in-house expertise will reduce your overall production costs. (read more)
Durable and highly-reliable screw-machined terminals and pins from Advanced Interconnections.
Advanced designs and manufactures hundreds of RoHS Compliant screw-machined terminals (pins and sockets) for high reliability interconnect applications (both standard and custom designs). (read more)
Peel-A-Way® Removable Socket Terminal Carriers from Advanced Interconnections.
Peel-A-Way® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)
A new line of customized surface mount connectors from Advanced Interconnections reduces board space by utilizing the perimeter of circular and other odd-shaped PC boards. To support prototypes and small volume runs, Advanced can provide an affordable design and rough sample for electrical and mechanical testing, typically in less than 5 days. (read more)
Our screw-machined Pin Grid Array (PGA) Sockets and Adapters come in a multitude of footprints, including interstitial, and can be custom-engineered to meet specific requirements. PGA Sockets provide a cost-effective method for replacing, repairing, or upgrading PGA devices in the field. (read more)
The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. More Information... (read more)
Single In-line (SIP) molded headers and sockets feature high quality screw-machined terminals for reliable socketing of power modules and converters. More Information... (read more)
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. (read more)
Peel-A-Way® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)