Interplex Industries, Inc. - An Interconnect Solution for Motors & Drives

Interplex's new Insulation Displacement Connector (IDC) family of terminals, designed to work directly with heavier, multi-layer magnet wire coatings, maintain a high normal force and a low contact resistance while supporting motors, high-power and harsh industrial applications. The IDC terminals cover a wide range of wire diameters, from 0.050 mm (23 AWG) up to 1.20 mm (17 AWG). (read more)

Interplex Industries, Inc. - Using Solderless Card-Edge Connections

Interplex's Surface Mount Technology (SMT) Card-Edge contacts are placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution. Together, they make a high-strength electrical/mechanical connection. (read more)

Interplex Industries, Inc. - A Study on High-Power Press-Fit Current Capacity

This Interplex Press-Fit Tech Bulletin discusses the current carrying capacity, especially in high-power applications.

The specific three topics in this series are:

• Application requirements for higher current capabilities

• Current capability testing and results

• Special design considerations for power module applications. (read more)

Interplex Industries, Inc. - A New IDC Solution for Motors & Drives

Learn about a new Insulation Displacement Connector (IDC) solution designed to support heavier, multi-layer magnet wire coatings, while maintaining a high normal force and a low contact resistance. Applicable for motors, high-power and harsh industrial applications. Interplex's IDC terminals cover a wide range of wire diameters, from 0.050 mm (23 AWG) up to 1.20 mm (17 AWG). (read more)

Interplex Industries, Inc. - Getting Sharp With Etched Medical Applications

Interplex Etch Logic's Reel-to-Reel Chemical Etching process is capable of developing sharp point combinations that are suitable for many intended medical applications.
Strong, sharp tapered points are ideal for even the most difficult punctures and small incisions. (read more)

Interplex Industries, Inc. - IDC Solution for Harsh Environments

IDC Terminals: Insulation Displacement Connectors and Components (IDC) and Magnet Wire Terminals

Interplex developed and designed its new IDC family of magnet wire terminals to work directly with heavier, multi-layer magnet wire coatings while maintaining a high normal force and a low contact resistance. These terminals were designed to support the high-power and harsh environment... (read more)

Interplex Industries, Inc. - What are Best Practices for Press-Fit Suppliers?

With a rapidly expanding range of industries now relying on solder-free Press-Fit technology as a key lynchpin in their electronics assembly strategies, it has become increasingly important for suppliers of compliant Press-Fit interconnects to provide stringently controlled testing, qualification and manufacturing processes. (read more)

Interplex Industries, Inc. - Etched High-Strength Metal Filters

Interplex Etch Logic provides high-strength metal filters and metal filtration screens with consistent open-area. The company offers a variety of filtration solutions and technology to the industry.

Our filtration products are used successfully worldwide in thousands of demanding applications. Interplex Etch Logic provides expert technical assistance in designing stainless and oth... (read more)

Interplex Industries, Inc. - How to Create Consistent, Repeatable Metal Filters

Interplex's reel-to-reel chemical etching process creates consistent, repeatable high-strength metal filters by controlling 160 process parameters including the chemistry, temperature, exposure. (read more)

Interplex Industries, Inc. - A Solderless Solution for Power Applications

Driven by the explosive growth of automotive electrical systems and many other industries using inverter and converter based power modules, press-fit technologies have become the preferred alternative for delivering highly reliable, solderless interconnect solutions. (read more)

Interplex Industries, Inc. - Etching for Automotive Applications

Interplex Etch Logic's Reel-to-Reel Chemical Etching process is capable of developing sharp point combinations that are suitable for many intended automotive applications. High-speed reel-to-reel etching; Suitable for other reel-to-reel processes such as forming, plating and insert molding; Performed in an ISO/TS 16949 facility (read more)

Interplex Industries, Inc. - Why Press-Fit for Card-Edge Connections?

Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. (read more)

Interplex Industries, Inc. - Options for Custom Semiconductor Packaging

Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets. (read more)

Interplex Industries, Inc. - What are Solder-Bearing Leads?

Learn about Interplex's solder and flux bearing lead technology (SBL), a technology that has been deployed across a wide spectrum of product designs and applications. Virtually any arena that requires the joining of metal parts via solder is a candidate application for integrating the solder within one of the components. (read more)

Interplex Industries, Inc. - Wire-Bondable Plating: A Key Process Step

Wire-bondable plating is a key process step in the manufacturing of all types of semiconductor packages including Integrated Connector Package Modules such as MEMS housings, sensors, LEDs, and Solar and Power Electronic modules. Successful bonding of aluminum or gold wire to an interconnect module lead-frame requires a plated surface with the highest level of material surface quality. (read more)

Interplex Industries, Inc. - How to integrate solder with RF shielding

Integration of RF shielding is a critical issue for many products, especially in compact mobile handheld devices with increasingly complex circuitry and very thin PCBs. To prevent problems such as shield pop-up and signal leakage, many manufacturers use costly secondary soldering processes. (read more)