Master Bond EP62-1 is an electrically insulating, high temperature resistant epoxy potting compound. It features remarkably high thermal stability, heat deflection temperature of 150°C (300°F), shrinkage less than 0.7%, volume resistivity of 6x1016 ohm-cm and a 3.7 dielectric constant from -5°C to 205°C (-60°F to 400°F). It has strong chemical resistance, e.g. 50% sulfuric acid, etc. (read more)
Master Bond EP56 is formulated for high performance applications where hardness, flexibility, chemical and abrasion resistance are required in addition to superior electrical insulation characteristics.Its aliphatic backbone results in excellent UV resistance thus assuring durable protection of electronic assemblies and devices under both indoor and outdoor environmental service conditions. (read more)
Master Bond UV10DCTK is a UV or heat curable modified epoxy resin system for high performance surface mount applications. It has been developed to solve a quality control problem with shadowed areas in UV curing systems. Having an alternative thermal curing mechanism, i.e. heat cure, greatly enhances the utility of UV curing technology by extending its applicability to opaque assemblies. (read more)
A uniquely versatile two component, optically clear, urethane elastomer for high performance bonding, sealing, casting and encapsulation EP30D-15, has been introduced by Master Bond. It is formulated to cure at ambient temperature and can be used over a wide temperature range of -60°F to +250°F. EP30D-15 has low water absorption, low moisture permeability and high hydrolytic stability. (read more)
Master Bond developed MB600, single component, storage stable adhesive as a cost effective alternative to the deficiencies of the currently used temporary adhesives. It features heat resistance and excellent adhesion to metals, ceramics, glass, most plastics and cures readily at ambient temperatures. The cured MB600 adhesive is water soluble and does not leave any undesirable contaminants. (read more)
Master Bond Supreme10HTFS is a, 2 minute, rapid curing and electrically conductive silver filled epoxy. It features tensile shear strengths of 1,200 psi, T-peel strengths in excess of 5 pli, and volume resistivity less than 10-3 ohm-cm. Service temperatures are from 4°K up to 205°C with superior resistance to impact, thermal shock, vibration ,creep and corrosion. (read more)
Master Bond EP21TDC-7 is a two component, room temperature, curing electrical insulating epoxy adhesive/sealant/coating. It bonds well to metals, glass, ceramics, plastics and many rubbers including neoprene, nitrile, SBR and natural rubber. It is 100% reactive and no solvents, diluents or volatiles are emitted during cure, elongation of 300% and offers excellent thermal shock resistance. (read more)
Master Bond has formulated a two component polymer system EP51AO, designed for heat dissipative bonding, sealing and potting assemblies. It gels in as little as 5 minutes, curing fully within 2 hours at ambient temperatures. EP51AO features high physical strength, a thermal conductivity of 8 Btu/hr/ft2/°F/in, electrical resistivity and a temperature range of -65°F to above 300°F. (read more)
Master Bond is introducing a two component electrically insulating, radio-opaque epoxy adhesive called EP21BAS. It features exceptional dimensional stability, wide service temperature range, CTE of 48 in/in x10-6/°C, and 1 to 1 mix ratio by weight or volume. When cured it contains elongation of >4%, and will adheres well to similar and dissimilar substrates. (read more)
Master Bond has introduced a two component, electrically insulating, low viscosity epoxy adhesive for cryogenic applications: EP29LPSP is able to withstand temperatures as low as 4°K, and resist cryogenic thermal shock. It features excellent chemical resistance, low exothem when curing and bonds well to a variety of substrates including metals, glass, ceramics and many different plastics (read more)
Master Bond Polymer System EP46HT-1 is a two component high performance epoxy resin system. The excellent tensile strength of 10,600 psi and tensile modulus as high as 450,000 are largely retained upon prolonged exposures to elevated temperatures as high as 315°C (600°F). The EP46HT-1 system exhibits glass transition temperatures in excess of 230°C and exceptionally low shrinkage. (read more)
Master Bond EP30D-7LV is a flexible, two component, moderate viscosity, epoxy resin for sealing, potting and encapsulation. Its excellent electrical insulation properties and high dielectric strength>400 volts/mil, make it an ideal flexible compound for sealing capacitors and other electrical components; especially when resistance to vibration mechanical shock and thermal cycling. (read more)
Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)
Master Bond Polymer System AC84, is a highly effective Acrylic based, copper filled EMI/RFI shielding coating for use in controlled atmospheres. The thixotropic, one component AC85 is highly cost effective, combining easy application with high area coverage. It has an impressive surface resistance of 0.05 -0.08 ohms/square, excellent ESD performance and an EMI performance greater than 70 dB (read more)
Master Bond has introduced a two component graphite filled, electrically conductive adhesive called EP75-1. It has excellent adhesion to metals, glass, ceramics, vulcanized rubbers and most plastics, along with outstanding dimensional stability and chemical resistance. Superior electrical conductivity makes EP75-1 particularly well suited for shielding and static dissipation applications. (read more)
Master Bond developed a UV curable urethane compound, UV21. Offering a fast curing alternative to conventional moisture curing silicone materials used for in-place seals, gaskets, bonding and protective coatings, its chemical resistance, strength & degree of flexibility exceeds those of RTV silicones while its electrical insulation properties withstand protracted exposure to moisture (read more)
MB297FL is an "instant cure" cyanoacrylate adhesive. It has excellent bond strength to metals, plastics and elastomer. The adhesive features high impact strength, superior resistance to shock and vibration, and adheres to materials with different expansion coefficients. It has excellent optical clarity, good resistance to many chemicals and a wide service operating temperature. (read more)
Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 1014 ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)
Master Bond has successfully developed a low viscosity silicone adhesive/sealant called Master Sil 713. It is a non-corrosive type silicone. Master Sil 713 has a viscosity of as little as 3000cps, a tensile strength of 125psi and more than 200% elongation. The hardness is Shore A 30, electrical resistivity is 1015 ohm cm, and the service operating temperature range is -65°F to +400°F. (read more)
Master Bond has developed, a two component sealing, potting, encapsulation and casting epoxy EP110F6. It exhibits superior resistance to thermal cycling and shock and passes the Navy "Hex Bar" test, MILI-16923C. EP110F6 resists a wide range of chemicals, elongation is 102%, Shore D hardness is 65, resistivity >1015 ohm-cm, CTE is 80-90 in/in x 10-8/C and dielectric strength >440 volts/mil. (read more)
