Oak-Mitsui, Inc. - Product Announcements

Free up PCB real estate and reduce overall impedance of the power distribution system with FARADFLEX®, Oak- Mitsui's revolutionary ultra thin polymer film substrate capacitor plane for PCB fabrication. Oak-Mitsui's licensed Buried Capacitance™ technology eliminates the need for some discrete capacitors. (read more)

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electro-deposited Copper Foils for the printed circuit board industry. As the only U.S. manufacturer (but with the strength of international scope), Oak-Mitsui produces both conventional cladding and application specific Copper Foils required by technology's leading edge companies. (read more)

Today's electronics industry is fast-paced and ever-changing. Oak-Mitsui is committed to leading the way as the preferred supplier to the electronics industry. (read more)

Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the power distribution system as well as free up surface real estate and improve system reliability by eliminating some discrete capacitors. (read more)

Oak-Mitsui offers a family of resin coated copper products call MutliFoil. MutliFoil is manufactured by our parent company Mitsui Kinzoku. Mitsui is the world's leading supplier of resin coated copper with excellent quality and service worldwide. (read more)

Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin®.

MicroThin® is a very low profile copper 3µm or 5µm copper foil with an 18µm or 35µm peelable copper carrier for high-density circuit applications. The releasing layer can be peeled-off after lamination and recycled. (read more)

Aluminum separators are available tooled or untooled in common sizes and thicknesses. For more information please contact us. (read more)