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Amplifier and comparator chips are board-level components for amplifying voltage, current, or power.
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Application specific integrated circuits (ASIC) are electronic chips designed for a particular application.
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RF bipolar transistors consist of an N-type or P-type layer sandwiched between two layers of the opposite type. They are designed to handle high-power radio frequency (RF) signals in devices such as stereo amplifiers, radio transmitters, and television monitors.
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Bluetooth® chips are board level components which broadcast in the 2.4 GHz industrial, scientific, and medical (ISM) radio band.
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Darlington transistors (Darlington pairs) are semiconductor devices that combine two bipolar transistors in a single device. They provide high current gain (commonly written ß) and require less space than configurations that use two discrete transistors.
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Digital LED displays are segmented or dot matrix displays allowing for numeric only and alphanumeric character representation.
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Diode lasers use light-emitting diodes to produce stimulated emissions in the form of coherent light output. They are also known as laser diodes.
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Diodes are electronic components that conduct electric current in only one direction, functioning as a one-way valve. Diodes are manufactured using semiconductor materials such as silicon, germanium or selenium and are used as voltage regulators, signal rectifiers, oscillators and signal modulators / demodulators.
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Dynamic random access memory (DRAM) chips are single-transistor memory cells that use small capacitors to store each bit of memory in an addressable format that consists of rows and columns. Because capacitors are unable to hold a charge indefinitely, DRAM memory chips require a near-constant pulse of current to retain stored information.
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Fiber optic couplers are optical devices that connect three or more fiber ends, dividing one input between two or more outputs, or combining two or more inputs into one output.
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FLASH memory chips offer extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. They do not need a constant power supply to retain their data.
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General-purpose diodes are electric components that conduct electric current in only one direction, functioning similarly to a one-way valve.
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GPS chips compare signals from several geo-positioning satellites to determine position on the Earth's surface. GPS is an acronym for global positioning system.
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High voltage diodes are designed for use in high-voltage applications.
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IC optical devices and optoelectronic devices are chips designed for optical and optoelectronic applications.
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Insulated gate bipolar transistors (IGBT) are bipolar transistors with an insulated gate. They combine the advantages of the bipolar transistor (high voltage and current) with the advantages of the MOSFET (low power consumption and high switching).
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LAN chips provide wireless local area network (LAN) connectivity in a system-on-chip platform.
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Lasers are devices that produce intense beams of monochromatic, coherent radiation. The word "laser" is an acronym for Light Amplification by Stimulated Emission of Radiation.
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Light-emitting diodes (LED) are PN junction devices that give off light radiation when biased in the forward direction. LEDs are used in a wide variety of indication applications.
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Magnetic sensor chips are semiconductor devices that detect physical quantities using magnetic principles.
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Memory chips are internal storage areas in computers. Although the term “memory chip” commonly refers to a computer's random access memory (RAM), this product area includes many different types of electronic data storage. Computer memory stores data electronically in cells. Without memory chips, a computer could not read programs or retain data.
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Memory modules are computer chips used to add memory to a computer.
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Metal-oxide semiconductor field-effect transistors (MOSFETs) are electronic switching devices with a conducting channel as the output. An electrode called a gate controls the width of the channel and determines how well the MOSFET conducts.
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Microcontrollers (MCU) are complete computer systems on a chip. They combine an arithmetic logic unit (ALU), memory, timer/counters, serial port, input/output (I/O) ports and a clock oscillator.
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Microprocessor chips (MPU) are silicon devices that serve as the central processing unit (CPU) in computers. They contain thousands of electronic components and use a collection of machine instructions to perform mathematical operations and move data from one memory location to another.
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Network and communication chips are semiconductor integrated circuits (IC) used in telecommunication devices and systems.
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Operational amplifiers (op amps, op-amps) are general-purpose, closed-loop devices that are used to implement linear functions.
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Optical isolators are optical devices that allow light to be transmitted in only one direction. They are most often used to prevent any light from reflecting back down the fiber, as this light would enter the source and cause feedback problems.
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IC phase-locked loops (PLL) are closed-loop frequency controls that are based on the phase difference between the input signal and the output signal of a controlled oscillator.
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PIN diodes are three-layer semiconductor diodes consisting of an intrinsic layer separating heavily doped P and N layers. The charge stored in the intrinsic layer in conjunction with other diode parameters determines the resistance of the diode at RF and microwave frequencies.
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Power bipolar transistors are semiconductors in which a base n-type or p-type layer is sandwiched between emitter and collector layers of the opposite type. The junctions between the semiconductor sections amplify weak incoming electrical signals.
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Power diodes are used mainly in high-power applications. They are built with large P-N junctions in order to pass large amounts of current and dissipate large amounts of heat.
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Power electronics devices are solid state devices or transistors capable of modulating or converting electrical power.
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Power MOSFETs are majority carrier devices which have high input impedance and do not exhibit minority carrier storage effects, thermal runaway, or secondary breakdown. Power MOSFETs have higher breakdown voltages than bipolar junction transistors (BJTs) and can be used in higher frequency applications where switching power losses are important.
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Pressure sensors include all sensors, transducers and elements that produce an electrical signal proportional to pressure or changes in pressure.
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Pulse width modulated (PWM) amplifier chips generate a current that switches between high and low output levels. PWM amplifiers have a much higher power capability for a given volume than linear amplifiers. They are also less expensive.
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Rectifier diodes are designed for use in rectification circuits. Rectifiers are used to convert AC to DC.
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Resistive temperature device (RTD) elements are wire windings or other thin-film serpentines that exhibit changes in resistance with changes in temperature. They are usually made of metallic elements or alloys such as copper, nickel, or nickel-iron.
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RF amplifiers are devices that accept a varying input signal and produce an output signal that varies in the same way, but with larger amplitude.
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RF transistors are designed to handle high-power radio frequency (RF) signals in devices such as stereo amplifiers, radio transmitters, and television monitors.
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Schottky diodes in their simplest form consist of a metal layer that contacts a semiconductor element. The metal / semiconductor junctions exhibit rectifying behavior (i.e., the current passes through the structure more readily with one polarity than the other).
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Sensor chips are dies incorporating semiconductor circuit elements that are used to convert changes to some physical parameter to an electrical signal.
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Small-signal bipolar transistors (BJT) are semiconductors that amplify small AC or DC signals. They consist of a base n-type or p-type layer sandwiched between emitter and collector layers of the opposite type.
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Solid state power controllers (SSPC) are semiconductor devices that control power (voltage and/or current) supplied to a load. They perform supervisory and diagnostic functions in order to identify overload conditions and prevent short circuits.
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Solid state relays (SSR) or semiconductor relays are semiconductor devices that can be used in place of mechanical relays to switch electricity to a load in many applications.
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Specialty communications and wireless chips are specialty or proprietary products and accessories related to communications, wireless and telecommunications chip products.
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SRAM chips use static random access memory (SRAM), a type of memory that is faster, more reliable, and more expensive than DRAM. Unlike DRAM, SRAM does not need to be refreshed in order to prevent data loss; however, SRAM requires more power than DRAM.
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SRAM modules are collections of static random access memory (SRAM) chips assembled on circuit boards.
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Temperature instruments use contact or noncontact methods to measure temperature. Products include dial, digital, industrial and laboratory thermometers; temperature probes, indicators, and sensors; RTD elements and transmitters; and thermistors, thermocouples, thermopiles, and thermal switches.
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Transistors are electronic devices made of semiconductor material that amplify a signal or open or close a circuit.
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Varactor diodes are p-n junction diodes that are designed to act as a voltage controlled capacitance when operated under reverse bias.
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xDSL chips provide digital subscriber line (DSL) connectivity in a system-on-chip platform. The term xDSL refers collectively to all types of digital subscriber lines.
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