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Abrasives and abrasive products are used to remove surface materials such as metal, ceramics, glass, plastics, and paint. Abrasives and abrasive products include discs, belts, blast machines and sandblasters, as well as sheets, rolls, and hand pads.
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Cut-off wheels and abrasive saw blades are used to cut bars, stock, pipes and other materials that are made of metal, concrete, or masonry.
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Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.
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Electroceramics are ceramic materials that have been specially formulated for specific electrical, electro-magnetic, or optical properties. They include dielectric ceramics, electrostrictive ceramics, ferrite ceramics, garnets (ferromagnets), and piezoelectric ceramics.
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Finishing compounds are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
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Honing, lapping and super-finishing equipment are used to improve surface finish or geometry to tight tolerances.
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Laboratory furnaces provide continuous heating to process samples and materials.
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Microscopy sample preparation equipment and metallography sample preparation equipment is used for the preparation of samples for metallographic or microscopic inspection and analysis.
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Nanotechnology materials and nanotechnology products have features or particle sizes in the range of 1 to 100 nm.
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Polishers and buffing machines are used to impart a fine (low Ra) surface finish on the exterior of a part. To improve surface finish, they use use abrasive grain slurries or compounds on buffs, bobs, cloth naps, laps, very fine grit nonwovens, and coated abrasives.
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Sawing machines and cut-off machines are used to cut raw materials to specified lengths or sizes.
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Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells.
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Superabrasives and diamond wheels include grinding wheels, abrasive saw blades, wheel dressers, single-point tools, and other products that use diamond or cubic boron nitride (CBM) abrasive grains.
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Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates.
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Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.
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X-ray diffraction instruments are used to measure crystal structure, grain size, texture and/or residual stress of materials and compounds through interaction of the X-ray beam with a sample.
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