SUSS MicroTec
SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience.

The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing and aligning, to wafer bonding and is complemented by specialized add-ons such as photomasks, nanoimprint lithography tools and optical lenses.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like MEMS and LED appreciate their comprehensive experience in wafer processing. This makes SUSS MicroTec a valuable partner for high-volume production as well as for research and development.

SUSS MicroTec

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Technical Articles

Local Plasma Treatment in a Mask Aligner for Selective Wafer Surface Modification (.pdf) (Semiconductor Manufacturing Equipment) Plasma pre-treatment for low-temperature direct wafer bonding is used worldwide in many different applications. In this process the full wafer surface is exposed to the plasma. Recently, a new process... (View Full Article)
Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf) (Semiconductor Manufacturing Equipment) Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of... (View Full Article)