TeoSys, is a laser systems designer and manufacturer as well as an integrator and a contract services provider in the field of "laser micromachining".
LASER SYSTEM INTEGRATION & MANUFACTURE:
We integrate and use lasers of all wavelengths for many industries including medical, aerospace, commercial packaging, electronic, semiconductor and the university sector. But by far, the coolest laser is our Excimer (deep UV at 193nm) which we have designed and now manufacture in-house. This laser provides us a competitive advantage over other laser system integrators. Our patented Intra-Cavity Gain Control inside the laser allows us to do really beautiful 1-10 micron features through amazing thick materials in almost everything, quite often including our hands!
Full size, industrial laser micromachining systems are also offered which house the above as well as up to 8 additional integrated axes of motion and full parts handling subsystems. These systems come with any type of laser (or wavelength (CO2) 10um, (Nd:YAG) 1.064um, 532nm, (UV) 355nm, (UV) 248nm, (UV)193nm) depending on the needs of the customer application. All of the underlying subsystems remain the same. TeoSys has designed the electrical, motion and software interfaces which are applicable to any type of laser (light bulb).
The LMS-5000 consists of a 532nm frequency doubled Nd:YAG Laser, Control System, Motion System, Structure, Power Supply and Software. The Laser consists of two major elements. The first is the laser head which is integrated into the upper systems structure. The second element of the laser is its power supply which resides in a cavity below the system. The laser power supply is not attached to, or otherwise part of the main system structure. The control system consists of two PCs and an integrated PLC (Programmable Logic Controller), which in this case is an Ensemble from Aerotech motion. The motion system consists of a ladder assembly which delivers parts into the system, a track assembly, a separator plate system, a pickup arm, an indexing plate and an ejector system. The structure consists of three enclosures supported by a single welded frame. The upper enclosure houses the laser head, beam delivery and X-Y stages. The middle enclosure houses the parts handling system and the optical flow tester. The lower enclosure houses the PCs, motion amps, power delivery, power supplies and transformers, UPS, DIN rail system, KVM and Laser Power Supply. Custom software resides on both PCs as well as the Ensemble controller. There is a custom integrated Ophir Beam Profiler also included.
Custom laser systems are also designed for those applications whose requirement are outside of the typical table-top design or for those who want to retrofit a laser into an existing manufacturing line. TeoSys design a system to put a laser pretty much anywhere it is needed.
High-repetition-rate UV lasers are normally used in "direct-write" configuration in which the sharply focused beam is rapidly moved over the worksurface to generate hole arrays or cut complex patterns. Beam delivery and motion system configurations are often similar to those used with CO2 or Nd:YAG lasers. Moving optics, moving workpiece, and hybrid systems all can be used to generate relative motion between the beam and the workpiece. UV-transmitting optical fibers are seldom used for transmitting the light from the laser source to the focus head because of their tendency toward color center generation and optical damage.
TeoSys offers custom contract services in laser cutting, laser drilling and laser marking. We can laser mark any text, graphics,1 and 2-D barcodes. Our text is as small as 10 microns in character height. Our spot sizes are as small as 1 micron. Our laser systems range from fully automated 5-axis systems to semi-automated 2 axis.
We perform precision micro milling, marking, stripping, drilling, and cutting on all hard to process materials. We also have a full capability machine shop on-site and are able to provide fabrication of larger pieces, micromachining of small features on the piece and quick turnaround for difficult micromachining part handling.
Examples of the materials on which we process: Plastics, Ceramics and Glass.
Polyimide (Kapton) (Kalrez) Polyurethane PTFE Teflon PEBAX Polystyrene Parylene
Alumina Zirconia Silicon Carbonate Pyrex Glass Borofloat Borosilicate
Diamond Quartz Fused Silica All colored gemstones
Steel Stainless Steel Nickle (Mu-metal) Brass Other Metals
Direct write laser marking of text, graphics and Data Matrix 2D barcodes on DIAMOND. Excimer lasers can be used on diamond and FUSED SILICA for cleaning and ablation. The UV wavelength is guaranteed not to crack or fracture the material. The laser mark was made using a 2 um spot size at the work surface and the 'Engineering' text height is 30 microns. NOTE: The overlaying squares are TeoSys's focusing aide which is coaxial with the UV beam path.
This picture is a 25 micron exit hole in 38micron thick stainless steel. We have full video microscope verification of feature size. TeoSys includes a copy of this feature size verification with the fabricated product for quality control purposes.
Here is an example of 38-40um thick kapton sheet which has a profiled hole drilled with a 120um entrance (on bottom) and a 30um exit (on top). Our video microscope provides feature measurement capabilities.
In process groove drilling in 5 inch diameter pyrex plate. Groove is 150um deep and 255um wide. Although processing time was multiple hours, the 193nm wavelength provided clean groove walls and groove floor flatness for this unusual and very large piece.
Here we have a picture which depicts 5 microns of teflon ablated from around the circumference of a 15 micron diameter copper wire.